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A thermosetting resin composition, prepreg and laminate

A resin composition and thermosetting technology, which is applied in the direction of layered products, metal layered products, glass/slag layered products, etc., can solve the problem that the resin composition is not conducive to optimizing the comprehensive performance of the laminated substrate and limiting the variability of the active ester structure , low production efficiency and other issues, to achieve excellent dimensional stability, good reactivity, and improved wettability

Active Publication Date: 2020-01-31
ZHEJIANG WAZAM NEW MATERIAL CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the practice of attaching active ester groups to both ends of polyphenylene ether limits the advantages of active ester structural variability, which is not conducive to the optimization of the resin composition in the later stage and the improvement of the comprehensive performance of the laminated substrate, such as dielectric, heat resistance, Toughening, flame retardant and other properties
[0007] In summary, the existing thermosetting resins that can be used for electronic substrates and the use of them to make prepregs or laminates have problems such as low dielectric properties, heat resistance or flame retardancy that need to be improved, complex processes, and low production efficiency.

Method used

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  • A thermosetting resin composition, prepreg and laminate
  • A thermosetting resin composition, prepreg and laminate
  • A thermosetting resin composition, prepreg and laminate

Examples

Experimental program
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Embodiment example

[0034] In order to illustrate the present invention better, be convenient to understand technical scheme of the present invention, the typical but non-limiting implementation case of the present invention is as follows:

[0035] The source of raw materials used in the embodiment and the product name are as shown in table 1 in the specific embodiment:

[0036] Table 1 Implementation Case 1-6 Raw Materials Used

[0037]

[0038]

[0039] (1) Preparation of thermosetting resin composition:

[0040] Mix polyphenylene ether with solvent, stir until polyphenylene ether is completely dissolved, then add silicone polymer and active ester oligomer in sequence, and finally add fillers or flame retardants and other additives, stir and mix the mixture evenly to obtain thermosetting resin composition.

[0041] (2) Preparation of prepreg

[0042] Use the thermosetting resin composition prepared in the previous step to adjust the solid content of the system to 55wt%-60wt% with a sol...

Embodiment 1-6

[0052] Example 1-6: Change the raw materials and raw material content of the thermosetting resin composition, make a metal foil laminated board through the above-mentioned preparation method, and test the glass transition temperature, dielectric constant, and dielectric loss of the laminated board according to the above-mentioned performance measurement standards Factors, water absorption, heat resistance, flame retardancy and other properties, the results are shown in Table 2.

[0053] Formulation composition and physical property data of each embodiment comparative example of table 2

[0054]

[0055]

[0056] The amounts and proportions of raw materials involved in the above implementation cases are weight proportions, and all raw materials can be obtained from the market unless otherwise specified.

[0057] It can be seen from Examples 1-3 in Table 2 that the greater the molecular weight of the epoxidized polyphenylene ether in the thermosetting resin composition, th...

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Abstract

The invention discloses a thermosetting resin composition, a prepreg and a laminated board. The thermosetting resin composition is prepared from the following components: (1) 40-60 parts by weight ofpolyphenylene ether, (2) 30-50 parts by weight of an active ester oligomer, and (3) 10-20 parts by weight of an organosilicon polymer, wherein the polyphenylene ether has epoxy groups at both ends, and the number average molecular weight of the polyphenylene ether is 3000-10000; the active ester oligomer is DCPD type active ester; the organosilicon polymer is epoxy functionalized polysiloxane. Thethermosetting resin composition has very good activity and wettability; the prepreg and the laminated board which are prepared from the thermosetting resin composition have the advantages of being good in dielectric property, heat resistance, flame retardance, toughness, processability, and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic substrates, and in particular relates to a thermosetting resin composition, a prepreg and a laminate that can be used as an electronic substrate copper-clad board. Background technique [0002] Nowadays, with the rapid development of global information technology towards digitization and networking, ultra-large capacity information transmission and ultra-fast, ultra-high-density information processing have become the goals pursued by the development of information and communication equipment (ICT) technology. This also puts forward higher requirements on the comprehensive performance of circuit substrates such as heat resistance, water absorption, chemical resistance, mechanical properties, dimensional stability and dielectric properties. However, the existing materials of epoxy resin and phenolic resin system can no longer meet the application in the near stage, especially the application of h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/12C08L67/02C08L83/04C08J5/24B32B17/04B32B17/06B32B15/14B32B15/20
CPCB32B5/02B32B15/14B32B15/20B32B17/061B32B2260/021B32B2260/046B32B2262/101B32B2307/204B32B2307/306B32B2307/3065C08J5/24C08J2371/12C08J2467/02C08J2483/04C08L71/126C08L2201/02C08L2201/08C08L2203/20C08L2205/03C08L67/02C08L83/04
Inventor 陈忠红潘锦平彭康梁希亭盛佳炯竺孟晓
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD