Heat conduction adhesive for electronic product heat radiation

A technology for electronic products and thermally conductive adhesives, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve the problems of reducing the contact surface, poor thermal conductivity of adhesives, and poor thermal conductivity. Achieve the effect of improving heat conduction contact surface, improving heat conduction efficiency, and preventing local overheating

Inactive Publication Date: 2018-06-29
HEFEI SIBOT SOFTWARE DEV CO LTD
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the heat conduction effect of the metal heat pipe is poor because it is not tightly combined with the components when it is used. Usually, an adhesive is used to bond the metal heat pipe and the components to improve the heat dissipation effect, but the use of the adhesive will reduce the therma

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0017] Example 1

[0018] A thermally conductive adhesive used for heat dissipation of electronic products. According to the number of parts by mass, the composition of the thermally conductive adhesive is as follows: graphite powder 20 parts, zinc oxide 18 parts, nano-titanium dioxide 3 parts, alumina 7 parts, silicon nitride 22 parts, carbonized 17 parts of silicon, 65 parts of polymer base, 15 parts of solvent, 1.5 parts of antioxidant, 1 part of coupling agent, 3 parts of curing agent.

[0019] The preparation method of the polymer base of the present invention is as follows: according to the mass parts, mix 80 parts of butyl acrylate, 40 parts of isooctyl acrylate, 5 parts of vinyl acetate, 2 parts of acrylic acid and 8 parts of methyl methacrylate. Then it was stirred by a stirrer at a high speed of 500r / min for 30 minutes and then added to the reactor. The temperature was increased to 75°C. At the same time, 3 parts of benzoyl peroxide were added to the reactor. Polymer bas...

Example Embodiment

[0022] Example 2

[0023] A thermally conductive adhesive used for heat dissipation of electronic products. According to the number of parts by mass, the composition of the thermally conductive adhesive is as follows: graphite powder 23 parts, zinc oxide 22 parts, nano titanium dioxide 5 parts, alumina 10 parts, silicon nitride 26 parts, carbonized 25 parts of silicon, 80 parts of polymer base, 18 parts of solvent, 2 parts of antioxidant, 1.6 parts of coupling agent, 4 parts of curing agent.

[0024] The preparation method of the polymer base of the present invention is as follows: according to the mass parts, mix 80 parts of butyl acrylate, 40 parts of isooctyl acrylate, 5 parts of vinyl acetate, 2 parts of acrylic acid and 8 parts of methyl methacrylate. Then it was stirred by a stirrer at a high speed of 550r / min for 40 minutes and then added to the reactor. The temperature was increased to 80°C. At the same time, 3 parts of benzoyl peroxide were added to the reactor. Polymer b...

Example Embodiment

[0027] Example 3

[0028] A thermal conductive adhesive used for heat dissipation of electronic products. According to parts by mass, the composition of the thermal conductive adhesive is as follows: 22 parts of graphite powder, 20 parts of zinc oxide, 4 parts of nano titanium dioxide, 9 parts of alumina, 24 parts of silicon nitride, and carbonization 21 parts of silicon, 70 parts of polymer base, 17 parts of solvent, 1.8 parts of antioxidant, 1.3 parts of coupling agent, 3.5 parts of curing agent.

[0029] The preparation method of the polymer base of the present invention is as follows: according to the mass parts, mix 80 parts of butyl acrylate, 40 parts of isooctyl acrylate, 5 parts of vinyl acetate, 2 parts of acrylic acid and 8 parts of methyl methacrylate. Then it was stirred by a stirrer at a high speed of 530r / min for 35 minutes and then added to the reactor. The temperature was increased to 78°C. At the same time, 3 parts of benzoyl peroxide were added to the reactor. Po...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Particle sizeaaaaaaaaaa
Particle sizeaaaaaaaaaa
Login to view more

Abstract

The invention belongs to the technical field of heat radiation materials and in particular relates to a heat conduction adhesive for electronic product heat radiation. The heat conduction adhesive comprises the following components: graphite powder, zinc oxide, nano titanium dioxide, aluminum oxide, silicon nitride, silicon carbide, high-molecular base glue, a solvent, an antioxidant, a coupling agent and a curing agent, wherein the high-molecular base glue is prepared from butyl acrylate, iso-octyl acrylate, vinyl acetate, crylic acid, methyl methacrylate and benzoyl peroxide. The heat conduction adhesive can be used for adhering metallic heat radiation tubes to electronic elements, the bonding effect of the metallic heat radiation tubes to the electronic elements can be improved, the contact areas can be increased, the heat conduction adhesive is high in heat conduction efficiency, and the heat radiation effect of the metallic heat radiation tubes from the electronic elements can beremarkably improved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation materials, and in particular relates to a heat conduction glue used for heat dissipation of electronic products. Background technique [0002] With the continuous advancement of science and technology, more and more types of electronic products are shipped, and their performance is becoming more and more powerful. The integration of components used in electronic products has increased with the advancement of processing technology, and the power consumption of components has become smaller and smaller, which has also led to the use of more and more components in the same electronic product to achieve more abundant functions. While the functions are more powerful, the problem of heat dissipation of electronic products is becoming more and more urgent. [0003] Large-scale electronic products mainly dissipate heat through air-cooled or liquid-cooled radiators, while some components or small...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J133/08C09J11/04C09J11/06C08F220/18C08F212/08C08F220/06C08F220/14
CPCC08F220/18C08F220/1804C08K3/04C08K3/34C08K13/02C08K2003/2227C08K2003/2241C08K2003/2296C08K2201/011C08K2201/014C09J11/04C09J11/06C09J133/08C08F220/1808C08F212/08C08F220/06C08F220/14
Inventor 吴青明
Owner HEFEI SIBOT SOFTWARE DEV CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products