Heat conduction adhesive for electronic product heat radiation

A technology for electronic products and thermally conductive adhesives, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve the problems of reducing the contact surface, poor thermal conductivity of adhesives, and poor thermal conductivity. Achieve the effect of improving heat conduction contact surface, improving heat conduction efficiency, and preventing local overheating

Inactive Publication Date: 2018-06-29

HEFEI SIBOT SOFTWARE DEV CO LTD

4 Cites 2 Cited by

AI-Extracted Technical Summary

Problems solved by technology

However, the heat conduction effect of the metal heat pipe is poor because it is not tightly combined with the components when it is used. Usually, an adhesive is used to bond the metal heat pipe and the components to improve the heat dissipation effect, but the use of the adhesive will reduce the therma...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine

Abstract

The invention belongs to the technical field of heat radiation materials and in particular relates to a heat conduction adhesive for electronic product heat radiation. The heat conduction adhesive comprises the following components: graphite powder, zinc oxide, nano titanium dioxide, aluminum oxide, silicon nitride, silicon carbide, high-molecular base glue, a solvent, an antioxidant, a coupling agent and a curing agent, wherein the high-molecular base glue is prepared from butyl acrylate, iso-octyl acrylate, vinyl acetate, crylic acid, methyl methacrylate and benzoyl peroxide. The heat conduction adhesive can be used for adhering metallic heat radiation tubes to electronic elements, the bonding effect of the metallic heat radiation tubes to the electronic elements can be improved, the contact areas can be increased, the heat conduction adhesive is high in heat conduction efficiency, and the heat radiation effect of the metallic heat radiation tubes from the electronic elements can beremarkably improved.

Application Domain

Non-macromolecular adhesive additivesEster polymer adhesives

Technology Topic

SolventSilicon nitride +18

Examples

Experimental program(4)

Example Embodiment

[0017] Example 1

[0018] A thermally conductive adhesive used for heat dissipation of electronic products. According to the number of parts by mass, the composition of the thermally conductive adhesive is as follows: graphite powder 20 parts, zinc oxide 18 parts, nano-titanium dioxide 3 parts, alumina 7 parts, silicon nitride 22 parts, carbonized 17 parts of silicon, 65 parts of polymer base, 15 parts of solvent, 1.5 parts of antioxidant, 1 part of coupling agent, 3 parts of curing agent.

[0019] The preparation method of the polymer base of the present invention is as follows: according to the mass parts, mix 80 parts of butyl acrylate, 40 parts of isooctyl acrylate, 5 parts of vinyl acetate, 2 parts of acrylic acid and 8 parts of methyl methacrylate. Then it was stirred by a stirrer at a high speed of 500r/min for 30 minutes and then added to the reactor. The temperature was increased to 75°C. At the same time, 3 parts of benzoyl peroxide were added to the reactor. Polymer base glue.

[0020] Among them, the particle size of silicon carbide and silicon nitride is 80 nm, and the particle size of graphite powder, zinc oxide, and aluminum oxide is 0.2 μm. Antioxidant is antioxidant TPP, coupling agent is titanate coupling agent; curing agent is vinyl triamine; solvent is isopropanol.

[0021] The preparation method of the thermal conductive adhesive of the present invention is as follows: prepare each raw material according to the mass parts, add the polymer base glue to the reaction kettle, raise the temperature of the reaction kettle to 75°C, and then add isopropanol and slowly stir until the base glue and solvent Compatible, add graphite powder, zinc oxide, nano titanium dioxide, aluminum oxide, silicon nitride, silicon carbide to the mixture, stir at a speed of 60r/min until the solid material is mixed with the organic mixed solvent evenly, and then the antioxidant Add with the coupling agent, mix and react for 5 minutes, finally add the curing agent to the reaction for 15 minutes, cool the mixture to room temperature after the reaction, to obtain the required thermal conductive adhesive.

Example Embodiment

[0022] Example 2

[0023] A thermally conductive adhesive used for heat dissipation of electronic products. According to the number of parts by mass, the composition of the thermally conductive adhesive is as follows: graphite powder 23 parts, zinc oxide 22 parts, nano titanium dioxide 5 parts, alumina 10 parts, silicon nitride 26 parts, carbonized 25 parts of silicon, 80 parts of polymer base, 18 parts of solvent, 2 parts of antioxidant, 1.6 parts of coupling agent, 4 parts of curing agent.

[0024] The preparation method of the polymer base of the present invention is as follows: according to the mass parts, mix 80 parts of butyl acrylate, 40 parts of isooctyl acrylate, 5 parts of vinyl acetate, 2 parts of acrylic acid and 8 parts of methyl methacrylate. Then it was stirred by a stirrer at a high speed of 550r/min for 40 minutes and then added to the reactor. The temperature was increased to 80°C. At the same time, 3 parts of benzoyl peroxide were added to the reactor. Polymer base glue.

[0025] Among them, the particle size of silicon carbide and silicon nitride is 120 nm, and the particle size of graphite powder, zinc oxide, and aluminum oxide is 0.3 μm. Antioxidant is antioxidant TPP, coupling agent is titanate coupling agent; curing agent is diaminodiphenylmethane; solvent is isopropanol.

[0026] The preparation method of the thermal conductive glue of the present invention is as follows: prepare each raw material according to the mass parts, add the polymer base glue into the reaction kettle, raise the temperature of the reaction kettle to 85°C, and then add isopropanol and slowly stir until the base glue and solvent Compatible, add graphite powder, zinc oxide, nano titanium dioxide, aluminum oxide, silicon nitride, silicon carbide to the mixture, stir at a speed of 90r/min until the solid material is mixed with the organic mixed solvent evenly, and then the antioxidant Add it with the coupling agent, mix and react for 10 minutes, and finally add the curing agent to the reaction for 20 minutes. After the reaction, the mixture is cooled to room temperature to obtain the required thermal conductive adhesive.

Example Embodiment

[0027] Example 3

[0028] A thermal conductive adhesive used for heat dissipation of electronic products. According to parts by mass, the composition of the thermal conductive adhesive is as follows: 22 parts of graphite powder, 20 parts of zinc oxide, 4 parts of nano titanium dioxide, 9 parts of alumina, 24 parts of silicon nitride, and carbonization 21 parts of silicon, 70 parts of polymer base, 17 parts of solvent, 1.8 parts of antioxidant, 1.3 parts of coupling agent, 3.5 parts of curing agent.

[0029] The preparation method of the polymer base of the present invention is as follows: according to the mass parts, mix 80 parts of butyl acrylate, 40 parts of isooctyl acrylate, 5 parts of vinyl acetate, 2 parts of acrylic acid and 8 parts of methyl methacrylate. Then it was stirred by a stirrer at a high speed of 530r/min for 35 minutes and then added to the reactor. The temperature was increased to 78°C. At the same time, 3 parts of benzoyl peroxide were added to the reactor. Polymer base glue.

[0030] Among them, the particle size of silicon carbide and silicon nitride is 100 nm, and the particle size of graphite powder, zinc oxide, and aluminum oxide is 0.2 μm. Antioxidant is antioxidant TPP, coupling agent is titanate coupling agent; curing agent is dimethylaminopropylamine; solvent is isopropanol.

[0031] The preparation method of the thermal conductive adhesive of the present invention is as follows: prepare each raw material according to the mass parts, add the polymer base to the reactor, raise the temperature of the reactor to 80°C, and then add isopropanol and slowly stir until the base and solvent Compatible, add graphite powder, zinc oxide, nano-titanium dioxide, aluminum oxide, silicon nitride, silicon carbide to the mixture, stir at 75r/min until the solid material is mixed with the organic mixed solvent evenly, and then the antioxidant Add with coupling agent, mix and react for 8min, finally add curing agent to react for 17min, after the reaction, cool the mixture to room temperature to obtain the required thermal conductive adhesive.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine

Login to view more

PUM

Property	Measurement	Unit
Particle size	80.0	nm
Particle size	0.2	µm
Particle size	120.0	nm
tensile		MPa
Particle size		Pa
strength	10

Description & Claims & Application Information

We can also present the details of the Description, Claims and Application information to help users get a comprehensive understanding of the technical details of the patent, such as background art, summary of invention, brief description of drawings, description of embodiments, and other original content. On the other hand, users can also determine the specific scope of protection of the technology through the list of claims; as well as understand the changes in the life cycle of the technology with the presentation of the patent timeline. Login to view more.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine

Login to view more

Classification and recommendation of technical efficacy words

Improve heat transfer efficiency
Avoid shaking

Heat conduction adhesive for electronic product heat radiation

AI-Extracted Technical Summary

Problems solved by technology

Abstract

Examples

Example Embodiment

Example Embodiment

Example Embodiment

PUM

Description & Claims & Application Information

Similar technology patents

Fed meat shredding processing device

Linear vibration motor

Safety protection device used for construction site

Agricultural fruit transport device capable of preventing fruits from bumping against one another

Multi-lens aerial camera shooting stabilized platform

Classification and recommendation of technical efficacy words

Double-wall pipe and refrigerant cycle device using the same

Appliance exterior pre-treatment for hydrogenation catalyst

Air conditioning apparatus

Biomass castoff supercritical water fluid bed partial oxidation hydrogen-preparation device and method

Car air-conditioner evaporator refrigerating agent flow control system

Diffuse reflection type intelligent electric pressure cooker

Vertically adjustable table

Multidirectional collision preventing device of robot

Power distribution box mounted with contact sensor

Showing stand for pipe fitting selling