Heat conduction adhesive for electronic product heat radiation

Abstract

The invention belongs to the technical field of heat radiation materials and in particular relates to a heat conduction adhesive for electronic product heat radiation. The heat conduction adhesive comprises the following components: graphite powder, zinc oxide, nano titanium dioxide, aluminum oxide, silicon nitride, silicon carbide, high-molecular base glue, a solvent, an antioxidant, a coupling agent and a curing agent, wherein the high-molecular base glue is prepared from butyl acrylate, iso-octyl acrylate, vinyl acetate, crylic acid, methyl methacrylate and benzoyl peroxide. The heat conduction adhesive can be used for adhering metallic heat radiation tubes to electronic elements, the bonding effect of the metallic heat radiation tubes to the electronic elements can be improved, the contact areas can be increased, the heat conduction adhesive is high in heat conduction efficiency, and the heat radiation effect of the metallic heat radiation tubes from the electronic elements can beremarkably improved.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation materials, and in particular relates to a heat conduction glue used for heat dissipation of electronic products. Background technique [0002] With the continuous advancement of science and technology, more and more types of electronic products are shipped, and their performance is becoming more and more powerful. The integration of components used in electronic products has increased with the advancement of processing technology, and the power consumption of components has become smaller and smaller, which has also led to the use of more and more components in the same electronic product to achieve more abundant functions. While the functions are more powerful, the problem of heat dissipation of electronic products is becoming more and more urgent. [0003] Large-scale electronic products mainly dissipate heat through air-cooled or liquid-cooled radiators, while some components or small...

AI Technical Summary

Problems solved by technology

However, the heat conduction effect of the metal heat pipe is poor because it is not tightly combined with the components when it is used. Usually, an adhesive is used to bond the metal heat pipe and the components to improve the heat dissipation effect, but the use of the adhesive will reduce the thermal conductivity of the two. The contact surface affects the heat dissipation effect of the equipment

Moreover, the thermal conductivity of the adhesive is poor, which can easily cause low local heat transfer efficiency, and when the heat is severe, it will also affect the normal use of electronic products