Heat conduction adhesive for electronic product heat radiation
A technology for electronic products and thermally conductive adhesives, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve the problems of reducing the contact surface, poor thermal conductivity of adhesives, and poor thermal conductivity. Achieve the effect of improving heat conduction contact surface, improving heat conduction efficiency, and preventing local overheating
Inactive Publication Date: 2018-06-29
HEFEI SIBOT SOFTWARE DEV CO LTD
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The invention belongs to the technical field of heat radiation materials and in particular relates to a heat conduction adhesive for electronic product heat radiation. The heat conduction adhesive comprises the following components: graphite powder, zinc oxide, nano titanium dioxide, aluminum oxide, silicon nitride, silicon carbide, high-molecular base glue, a solvent, an antioxidant, a coupling agent and a curing agent, wherein the high-molecular base glue is prepared from butyl acrylate, iso-octyl acrylate, vinyl acetate, crylic acid, methyl methacrylate and benzoyl peroxide. The heat conduction adhesive can be used for adhering metallic heat radiation tubes to electronic elements, the bonding effect of the metallic heat radiation tubes to the electronic elements can be improved, the contact areas can be increased, the heat conduction adhesive is high in heat conduction efficiency, and the heat radiation effect of the metallic heat radiation tubes from the electronic elements can beremarkably improved.
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Property | Measurement | Unit |
Particle size | 80.0 | nm |
Particle size | 0.2 | µm |
Particle size | 120.0 | nm |
tensile | MPa | |
Particle size | Pa | |
strength | 10 |
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