Heat conduction adhesive for electronic product heat radiation
A technology for electronic products and thermally conductive adhesives, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve the problems of reducing the contact surface, poor thermal conductivity of adhesives, and poor thermal conductivity. Achieve the effect of improving heat conduction contact surface, improving heat conduction efficiency, and preventing local overheating
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[0017] Example 1
[0018] A thermally conductive adhesive used for heat dissipation of electronic products. According to the number of parts by mass, the composition of the thermally conductive adhesive is as follows: graphite powder 20 parts, zinc oxide 18 parts, nano-titanium dioxide 3 parts, alumina 7 parts, silicon nitride 22 parts, carbonized 17 parts of silicon, 65 parts of polymer base, 15 parts of solvent, 1.5 parts of antioxidant, 1 part of coupling agent, 3 parts of curing agent.
[0019] The preparation method of the polymer base of the present invention is as follows: according to the mass parts, mix 80 parts of butyl acrylate, 40 parts of isooctyl acrylate, 5 parts of vinyl acetate, 2 parts of acrylic acid and 8 parts of methyl methacrylate. Then it was stirred by a stirrer at a high speed of 500r / min for 30 minutes and then added to the reactor. The temperature was increased to 75°C. At the same time, 3 parts of benzoyl peroxide were added to the reactor. Polymer bas...
Example Embodiment
[0022] Example 2
[0023] A thermally conductive adhesive used for heat dissipation of electronic products. According to the number of parts by mass, the composition of the thermally conductive adhesive is as follows: graphite powder 23 parts, zinc oxide 22 parts, nano titanium dioxide 5 parts, alumina 10 parts, silicon nitride 26 parts, carbonized 25 parts of silicon, 80 parts of polymer base, 18 parts of solvent, 2 parts of antioxidant, 1.6 parts of coupling agent, 4 parts of curing agent.
[0024] The preparation method of the polymer base of the present invention is as follows: according to the mass parts, mix 80 parts of butyl acrylate, 40 parts of isooctyl acrylate, 5 parts of vinyl acetate, 2 parts of acrylic acid and 8 parts of methyl methacrylate. Then it was stirred by a stirrer at a high speed of 550r / min for 40 minutes and then added to the reactor. The temperature was increased to 80°C. At the same time, 3 parts of benzoyl peroxide were added to the reactor. Polymer b...
Example Embodiment
[0027] Example 3
[0028] A thermal conductive adhesive used for heat dissipation of electronic products. According to parts by mass, the composition of the thermal conductive adhesive is as follows: 22 parts of graphite powder, 20 parts of zinc oxide, 4 parts of nano titanium dioxide, 9 parts of alumina, 24 parts of silicon nitride, and carbonization 21 parts of silicon, 70 parts of polymer base, 17 parts of solvent, 1.8 parts of antioxidant, 1.3 parts of coupling agent, 3.5 parts of curing agent.
[0029] The preparation method of the polymer base of the present invention is as follows: according to the mass parts, mix 80 parts of butyl acrylate, 40 parts of isooctyl acrylate, 5 parts of vinyl acetate, 2 parts of acrylic acid and 8 parts of methyl methacrylate. Then it was stirred by a stirrer at a high speed of 530r / min for 35 minutes and then added to the reactor. The temperature was increased to 78°C. At the same time, 3 parts of benzoyl peroxide were added to the reactor. Po...
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