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Single-component quickly cured cofferdam adhesive and preparation method thereof

A fast-curing, one-component technology, applied in adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve problems such as reducing the adhesion of PCB boards, affecting product reliability, and reducing production efficiency. Achieve excellent interface adhesion, excellent thixotropy, and improve reliability

Inactive Publication Date: 2018-06-29
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition to the reduced production efficiency of the two-step dispensing method, what is more serious is that under the two-step dispensing cofferdam-curing-potting-curing process conditions, after the cofferdam glue is cured, small molecule volatiles will contaminate the PCB board (Printed circuit board) surface, which greatly reduces the adhesion of the low-viscosity potting resin to the PCB board in the later stage, thus affecting the reliability of the product. Therefore, it is necessary to improve the epoxy resin cofferdam glue to meet the cofferdam-potting One-step curing process to improve curing efficiency and reliability of electronic components

Method used

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  • Single-component quickly cured cofferdam adhesive and preparation method thereof
  • Single-component quickly cured cofferdam adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] In the present embodiment, the preparation method of this one-component fast-curing cofferdam glue includes the following steps in sequence:

[0034] (1) By weight, prepare the following raw materials: 100 parts of epoxy resin mixture (including 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate (Hunsman CY-179) 40 60 parts, 60 parts of bisphenol F type epoxy resin with a viscosity of 3000cps, an epoxy equivalent of 170, and a hydrolyzable chlorine content of 100ppm), 80 parts of fused silica, 6 parts of fumed silica, and carbamate compounds 0.3 part of N-methylpyrrolidone solution, 0.1 part of curing accelerator, 5 parts of polypolyol (both polyethylene glycol (PEG200)), 0.5 part of organosilane defoamer, 0.1 part of antioxidant (both 2, 6-di-tert-butyl-4-methylphenol), 0.5 parts of colorant;

[0035] (2) Drying the fused silica to remove moisture from the fused silica;

[0036] (3) Add epoxy resin mixture, fused silica, fumed silica, N-methylpyrrolidone solut...

Embodiment 2

[0045] In the present embodiment, the preparation method of this one-component fast-curing cofferdam glue includes the following steps in sequence:

[0046] (1) By weight, prepare the following raw materials: 100 parts of epoxy resin mixture (including 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate (Hunsman CY-179) 60 40 parts, 40 parts of bisphenol F type epoxy resin with a viscosity of 3500cps, an epoxy equivalent of 168, and a hydrolyzable chlorine content of 80ppm), 120 parts of fused silica, 4 parts of fumed silica, and carbamate compounds 0.5 parts of N-methylpyrrolidone solution, 1 part of curing accelerator, 25 parts of polyol (including 10 parts of polyethylene glycol (PEG200) and 15 parts of polypropylene glycol (PPG200)), 0.05 parts of organosilane defoamer, 1 part of oxygen agent (including 0.4 parts of 2,6-di-tert-butyl-4-methylphenol, 0.6 parts of n-octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate parts), 0.2 parts of colorant;

[0047] (2)...

Embodiment 3

[0057] In the present embodiment, the preparation method of this one-component fast-curing cofferdam glue includes the following steps in sequence:

[0058] (1) By weight, prepare the following raw materials: 100 parts of epoxy resin mixture (including 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate (Hunsman CY-179) 48 52 parts, 52 parts of bisphenol F type epoxy resin with a viscosity of 3000cps, an epoxy equivalent of 170, and a hydrolyzable chlorine content of 100ppm), 120 parts of fused silica, 4 parts of fumed silica, and carbamate compounds 0.5 part of N-methylpyrrolidone solution, 0.3 part of curing accelerator, 15 parts of polyol (both polypropylene glycol (PPG200)), 0.5 part of organosilane defoamer, 0.5 part of antioxidant (both 3-(3 , 5-di-tert-butyl-4-hydroxyphenyl) n-octadecyl propionate), 0.5 parts of coloring agent;

[0059] (2) Drying the fused silica to remove moisture from the fused silica;

[0060] (3) Add epoxy resin mixture, fused silica, fumed...

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Abstract

The invention discloses a single-component quickly cured cofferdam adhesive, which is characterized by being prepared from the following components in parts by weight: 100 parts of epoxy resin mixture, 80 to 120 parts of fused silica, 2 to 6 parts of fumed silica, 0.05 to 0.5 part of N-methylpyrrolidone solution of a carbamate compound, 0.1 to 2 parts of curing accelerator, 5 to 30 parts of polyester polyol, 0.05 to 0.5 part of organosilane antifoaming agent, 0.1 to 1 part of antioxidant and 0.1 to 0.5 part of colorant. The invention also provides a preparation method of the single-component quickly cured cofferdam adhesive. The single-component quickly cured cofferdam adhesive provided by the invention is excellent in thixotropy and favorable in moldability in high-temperature curing; a cofferdam material is quick in curing speed, and can be quickly cured at 80 to 100 DEG C; the cofferdam material does not need to be precured in an application process, and can be simultaneously curedwith a low-viscosity epoxy encapsulating material, and the single-component quickly cured cofferdam adhesive has favorable heat resistance, favorable electric insulativity and excellent interfacial binding power after being cured, and cannot generate an interfacial cracking phenomenon after cold and hot impact (at subzero 40 to 130 DEG C).

Description

technical field [0001] The invention relates to a cofferdam material applicable to electronic and electrical products, in particular to a single-component fast-curing cofferdam glue and a preparation method thereof. Background technique [0002] Epoxy resin adhesives have excellent mechanical properties, chemical medium resistance, bonding properties and electrical insulation properties, and are widely used in machinery, electronic component protection, casting and potting of transformers. [0003] In the field of electronic components, in order to improve the permeability of epoxy resin, it is necessary to use epoxy packaging materials with lower viscosity, but low viscosity will cause colloid overflow. In order to solve the molding problem, it is necessary to develop an epoxy cofferdam adhesive with good moldability and fast curing. [0004] Conventional epoxy cofferdam glue adopts the method of adding a large amount of thixotropic agent, so that epoxy resin cofferdam glu...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C08G59/40
CPCC08G59/4057C08K3/04C08K3/36C08K5/13C08K13/02C08K2201/014C09J11/04C09J11/06C09J163/00
Inventor 周振基周博轩罗永祥石逸武许喜銮
Owner NICHE TECH KAISER SHANTOU