A non-uniform wettability silicon-based microchannel phase-change heat exchanger connected at the top

Abstract

The invention discloses a non-uniform wettability silicon-based microchannel phase-change heat exchanger connected at the top, which belongs to the technical field of electronic cooling. The microchannel phase change heat exchanger is formed by anodic bonding of the upper glass and the bottom silicon, and the liquid inlet and the liquid outlet are arranged on the upper glass; the liquid inlet pool, the liquid outlet pool, and the parallel The array of microchannels and nucleation holes, the open microchannels communicate with each other at the top, the sides and bottom surfaces of the microchannels and the top surface of the rib walls between the microchannels are all hydrophilic silicon dioxide films, the array of nucleation holes is located at the bottom of the microchannels and Its inner surface is all hydrophobic silicon; the back of the underlying silicon is processed with an electric heating film to simulate an external heat source. The prominent advantage of the phase change heat exchanger is that it has low start-up overtemperature, high heat transfer coefficient and critical heat flux density, strong heat transfer stability, and has broad application prospects.

Description

technical field [0001] The invention belongs to the technical field of electronic cooling, in particular to a non-uniform wettability silicon-based microchannel phase-change heat exchanger connected at the top. Background technique [0002] With the continuous development of microelectronics integration technology, the number of integrated transistors per unit area is increasing, resulting in a sharp increase in heat flux per unit area, and its heat dissipation and cooling problems have become one of the main bottlenecks restricting the development of microelectronic chips. . At present, mainstream chip cooling technologies include air cooling and liquid cooling technologies. For example, desktop computer CPUs are usually cooled by air cooling technology, and notebook computers are usually cooled by heat pipe-based cooling technology. Due to its large specific surface area and relatively high heat dissipation capacity, microchannel coolers show great application prospects i...

AI Technical Summary

Problems solved by technology

In addition, in phase change systems, especially in parallel microchannel heat exchangers, since the nucleation of bubbles between parallel microchannels is not synchronized, the nucleation and growth of bubbles will cause the pressure in the channel to fluctuate, and the pressure between different channels will be different. Poor, resulting in the instability of the parallel channel of the phase change system, which makes the flow and heat transfer characteristics of different channels fluctuate, resulting in local pulsating thermal stress, which easily leads to thermal fatigue damage of electronic chips

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