Resin based diamond dicing blade for LED segmentation and preparation method thereof

Abstract

The invention discloses a resin based diamond dicing blade for LED segmentation and a preparation method thereof. The preparation method includes: subjecting a mixture of diamond, resin powder, zinc oxide, alumina, carbon fiber and 4-methylbenzyl alcohol to ball milling, and then performing hot-pressing to obtain a hot-pressed green body; conducting curing treatment on the hot-pressed green body at 130-160DEG C for 12-16h to obtain a molded body; and processing the molded body to obtain the resin based diamond dicing blade for LED segmentation. The product provided by the invention can meet LED precision machining process, the blade precision can reach 4microm, the cutting speed can be raised to 40mm / s, and the life span can reach 8000m, therefore the working efficiency and processing costare greatly improved.

Description

technical field

[0001] The invention belongs to the technical field of cutting knives, and in particular relates to a resin-based diamond scribing knife for LED segmentation and a preparation method thereof. Background technique

[0002] The consumption of semiconductor materials reflects the scale and process level of a country's IC manufacturing industry. With the development of LED chip technology and packaging technology, multi-chip LED components have gradually entered the market in response to the demand for high luminous flux LED products in the lighting field. The current LED cutting speed is low, the cutting knife wears fast, the life is short, the diamond cutting knife is more expensive, and the demand for personnel and machines is relatively large, resulting in high machine costs and labor costs, and the cutting knife is directly in contact with the chip during cutting , The side of the chip is prone to edge chipping, chipping and cracks, and the product qualific...