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Copper-silicon integrated electrode and preparation method thereof

A technology of copper-silicon and electrodes, which is applied in the direction of carbon-silicon compound conductors, cable/conductor manufacturing, circuits, etc., can solve problems such as complex synthesis process, hindering application, high cost, etc., and achieve volumetric energy density improvement, space relief, and wide application foreground effect

Inactive Publication Date: 2020-12-11
TIANJIN POLYTECHNIC UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods all require complicated synthetic procedures, thus they are tedious, costly, and time-consuming, seriously hindering their commercial application

Method used

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  • Copper-silicon integrated electrode and preparation method thereof
  • Copper-silicon integrated electrode and preparation method thereof
  • Copper-silicon integrated electrode and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Prepare the copper-silicon integrated electrode according to the following steps: first prepare the green body: mix silicon powder with a particle size of 80 nm and copper powder with a particle size of 1 μm to obtain a copper-silicon mixed powder, and ball mill the copper-silicon mixed powder for 30 hours to obtain Copper-silicon composite powder, silicon powder accounts for 1.6% by mass of the copper-silicon mixed powder; solvent mixing: the copper-silicon composite powder is mixed with polyacrylonitrile and N-methylpyrrolidone to obtain the first mixture, in the first mixture, The mass percent of copper-silicon composite powder is 1.1%, and the mass percent of polyacrylonitrile is 3.19%; Grinding: the first mixture is ground to obtain casting solution; scraping film: placing casting solution on a scraping film plate, using The film scraper scrapes the casting solution; then puts the scraped casting solution into water for solvent-non-solvent phase conversion to obtain...

Embodiment 2

[0019] Prepare the copper-silicon integrated electrode according to the following steps: first prepare the green body: mix silicon powder with a particle size of 200 nm and copper powder with a particle size of 5 μm to obtain a copper-silicon mixed powder, and ball mill the copper-silicon mixed powder for 50 hours to obtain Copper-silicon composite powder, silicon powder accounts for 6.3% by mass of the copper-silicon mixed powder; solvent mixing: the copper-silicon composite powder is mixed with polyacrylonitrile and N-methylpyrrolidone to obtain the first mixture, in the first mixture, The mass percentage of copper-silicon composite powder is 4.3%, and the mass percentage of polyacrylonitrile is 3.59%; Grinding: the first mixture is ground to obtain casting solution; Scraping film: placing casting solution on a scraping film plate, using The film scraper scrapes the casting solution; then puts the scraped casting solution into water for solvent-non-solvent phase conversion to...

Embodiment 3

[0021] Prepare the copper-silicon integrated electrode according to the following steps: first prepare the green body: mix silicon powder with a particle size of 200 nm and copper powder with a particle size of 5 μm to obtain a copper-silicon mixed powder, and ball mill the copper-silicon mixed powder for 50 hours to obtain Copper-silicon composite powder, silicon powder accounts for 4% by mass of the copper-silicon mixed powder; solvent mixing: the copper-silicon composite powder is mixed with polyacrylonitrile and N-methylpyrrolidone to obtain the first mixture, in the first mixture, The mass percentage of copper-silicon composite powder is 2%, and the mass percentage of polyacrylonitrile is 3.29%; Grinding: the first mixture is ground to obtain casting solution; scraping film: placing casting solution on a scraping film plate, using The film scraper scrapes the casting solution; then puts the scraped casting solution into water for solvent-non-solvent phase conversion to obt...

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Abstract

The invention discloses a copper silicon integrated electrode and a preparation method thereof. The preparation method comprises the following steps of performing mixing on silicon powder and copper powder to obtain copper silicon mixed powder, and performing ball milling on the copper silicon mixed powder for 30-70h to obtain copper silicon composite powder; enabling the copper silicon compositepowder to be mixed with an organic matter to obtain a first mixture; performing grinding on the first mixture to obtain a casting film liquid; film scraping: putting the casting film liquid on a filmscraping plate and performing film scraping treatment on the casting film liquid by a film scraper; next, putting the casting film liquid into water after film scraping is performed to carry out conversion of solvent-non-solvent to obtain a green body; performing sintering in two steps of carrying out heating on the green body in the air firstly to obtain a green body without organic matter, next,performing reduction on the green body without organic matter in a hydrogen atmosphere to obtain a reduced porous copper silicon film; and performing rolling on the reduced porous copper silicon filmon a roller press to obtain the copper silicon integrated electrode. The method is simple, easy and efficient, and the obtained electrode is high in cycle stability.

Description

technical field [0001] The invention relates to an electrode and a preparation method thereof, in particular to a copper-silicon integrated electrode and a preparation method thereof. Background technique [0002] With the advancement of science and technology, the development of new electronic equipment such as notebook computers, digital appliances, and mobile phones, new energy storage devices with low cost, high energy density, high voltage, light weight, long cycle life, and good safety performance have become people's research hotspot. [0003] Many new anode materials used as energy storage devices, such as silicon-based materials, etc., will have a huge volume change during cycling, which leads to severe pulverization, resulting in a large capacity loss and loss of electrical conductivity with the current collector. connect. [0004] At present, many solutions to this problem have been proposed, such as: using hydrothermal method, solution synthesis method or chemi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B13/00H01B1/04H01B1/02
CPCH01B1/02H01B1/04H01B13/00
Inventor 张志佳王佳敏关新新康建立
Owner TIANJIN POLYTECHNIC UNIV
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