Unlock instant, AI-driven research and patent intelligence for your innovation.

Diamond aluminum composite material for electronic packaging

A diamond aluminum and composite material technology, applied in the field of electronics, can solve the problems of high packaging density and achieve the effect of excellent performance

Inactive Publication Date: 2018-08-03
郁海丰
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Today, with the rapid development of microelectronics technology, the packaging density of semiconductor integrated circuits is increasing. The thermal conductivity and thermal expansion coefficient of commonly used electronic packaging materials are far from meeting the development needs of current integrated circuit and chip technologies. Therefore, new electronic packaging The development of materials has become one of the keys to the development of electronic devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A diamond-aluminum composite material for electronic packaging. Nano-diamond powder, nano-alumina and nano-zinc sulfide are uniformly mixed to obtain a mixed solid powder, and then the mixed solid powder is added to a natural resin and melted and solidified.

[0013] The weight ratio of nano-diamond powder, nano-alumina and nano-zinc sulfide is 8:4:1.

[0014] The quality of the mixed solid powder is 40% of the natural resin quality.

Embodiment 2

[0016] A diamond-aluminum composite material for electronic packaging. Nano-diamond powder, nano-alumina and nano-zinc sulfide are uniformly mixed to obtain a mixed solid powder, and then the mixed solid powder is added to a natural resin and melted and solidified.

[0017] The weight ratio of nano-diamond powder, nano-alumina and nano-zinc sulfide is 7:3:1.

[0018] The quality of the mixed solid powder is 40% of the natural resin quality.

Embodiment 3

[0020] A diamond-aluminum composite material for electronic packaging. Nano-diamond powder, nano-alumina and nano-zinc sulfide are uniformly mixed to obtain a mixed solid powder, and then the mixed solid powder is added to a natural resin and melted and solidified.

[0021] The weight ratio of nano-diamond powder, nano-alumina and nano-zinc sulfide is 9:5:1.

[0022] The quality of the mixed solid powder is 40% of the natural resin quality.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a diamond aluminum composite material for electronic packaging, wherein nanometer diamond powder, nanometer alumina and nanometer zinc sulfide are uniformly mixed to obtain mixed solid powder, the mixed solid powder is added to a natural resin, and melting curing is performed, wherein a weight ratio of nanometer diamond powder to nanometer alumina to nanometer zinc sulfideis 7-9:3-5:1, and the mixed solid powder accounts for 35-45% of the mass of the natural resin. The composite material of the invention has excellent performance and can be used in the field of electronic packaging.

Description

technical field [0001] The invention belongs to the field of electronics, and in particular relates to a diamond-aluminum composite material for electronic packaging. Background technique [0002] Electronic packaging is an operation process that rationally arranges, assembles, bonds, connects, isolates and protects the various components that constitute electronic devices or integrated circuits according to the specified requirements. It requires the packaging materials used to have high thermal conductivity. , and has a low thermal expansion rate, and plays the role of mechanical support, electrical connection, physical protection, external field shielding, stress relaxation, heat dissipation and moisture resistance, size transition and stable component parameters. Today, with the rapid development of microelectronics technology, the packaging density of semiconductor integrated circuits is increasing. The thermal conductivity and thermal expansion coefficient of commonly ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L93/00C08K3/04C08K3/22C08K3/30
CPCC08K3/04C08K3/22C08K3/30C08K2003/2227C08K2003/3009C08L2203/204C08L93/00
Inventor 不公告发明人
Owner 郁海丰