Wafer carrier, wafer cleaning system and method

Abstract

The invention relates to the technical field of a semiconductor, and discloses a wafer carrier, and a wafer cleaning system and method. The wafer carrier comprises a carrier body, and the carrier bodyhas opposite bearing surface and fixing surface; the bearing surface is used for bearing wafers and the fixing surface is used for fixing the carrier; and a plurality of first clamps for fixing wafers are arranged on the edge of the bearing surface. When the wafers are cleaned, the wafers are pre-fixed on the bearing surface of the carrier, and then the fixing surface of the carrier is fixed in acleaning cavity; in the cleaning process, the wafers are firmly fixed on the carrier without being fixed in the cleaning cavity directly, so that wafer cracking caused by infirm wafer adsorption dueto that the wafers are directly adsorbed in the cleaning cavity in the conventional mode can be avoided, and wafer finished product rate is improved; and in addition, when the wafers are transported on a cleaning assembly line, the wafers also can be fixed on the carrier, so that safety of the wafers in the transporting process can be further ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer carrier, a wafer cleaning system and method. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. As the feature size of integrated circuits enters the deep sub-micron stage, the cleanliness of the wafer surface required in the integrated circuit wafer manufacturing process is becoming more and more stringent. Therefore, in the semiconductor manufacturing process, wafer cleaning is a very important link. [0003] The existing wafer cleaning process usually includes the following steps: Step 1, the wafer is directly grasped by the robot and transferred between the units; Step 2, when it reaches the cleaning unit, the wafer is directly adsorbed on the chuck in the cleaning chamber; Step 3, further cleaning the wafer. In the above pro...

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Problems solved by technology

In the above process, due to the warping of the wafer, it is easy to slip and break during the transfer process, and in the cleaning process, because the wafer is directly adsorbed on the chuck, it is very easy to cause the wafer to fly due to weak vacuum adsorption. chip breakage, thus affecting product yield

[0004] At the same time, the existing single-chip cleaning equipment can only clean wafers with conventional thickness. The so-called conventional thickness generally refers to the thickness value between 500μm-1mm, and cannot meet the requirements of unconventional thickness (less than 500μm or greater than 1mm). Wafer Cleaning Specifications

If cleaning equipment with mismatched thickness specifications is used for cleaning, the possibility of wafer fragmentation in the cleaning chamber will be significantly increased, thereby greatly reducing the yield of wafers

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