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Preparation method of metal copper nanocluster not wrapped with surface ligand and application thereof

A technology of nanoclusters and surface ligands, which is applied in nanotechnology, metal processing equipment, nanotechnology, etc. for materials and surface science, and can solve problems such as the lack of preparation methods for copper nanoclusters without surface ligands, Achieve the effect of high purity, good dispersion and good stability

Active Publication Date: 2018-09-14
GUANGZHOU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Currently, methods for preparing copper nanoclusters without surface ligands are still lacking

Method used

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  • Preparation method of metal copper nanocluster not wrapped with surface ligand and application thereof
  • Preparation method of metal copper nanocluster not wrapped with surface ligand and application thereof
  • Preparation method of metal copper nanocluster not wrapped with surface ligand and application thereof

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Embodiment 1

[0041] A method for preparing metal copper nanoclusters without surface ligand coating, comprising the following steps:

[0042] (1) Preparation of gold nanoparticles: put a gold plate with a size of 1 cm × 0.6 cm × 0.1 cm in 10 mL of deionized water, and then irradiate the gold plate with a laser with a wavelength of 1064 nm, with a spot diameter of 0.4 cm and an average laser power of 2 W / cm 2 , for a duration of 20 minutes to obtain a gold nanoparticle solution. Characterized by electron diffraction and transmission electron microscopy, the product is gold nanoparticles with a diameter of about 10-20 nanometers. After characterization such as absorption spectrum, it was confirmed that the position of the surface plasmon resonance absorption peak was 520 nanometers.

[0043] The content of gold nanoparticles in the solution was determined by the weight change of the gold plate before and after laser irradiation. In this embodiment, the mass loss of the gold plate was 0.2 mg...

Embodiment 2

[0055] A method for preparing metal copper nanoclusters without surface ligand coating, comprising the following steps:

[0056] (1) Preparation of gold nanoparticles: put a gold plate with a size of 1 cm × 0.6 cm × 0.1 cm in 10 mL of deionized water, and then irradiate the gold plate with a laser with a wavelength of 1064 nm, with a spot diameter of 0.4 cm and an average laser power of 2 W / cm 2 , for a duration of 20 minutes to obtain a gold nanoparticle solution. The product was characterized by electron diffraction and transmission electron microscopy as gold nanoparticles. The obtained gold nanoparticles are in a single crystal state with a diameter of about 10-20 nanometers; the mass loss of the gold plate is 0.2 mg, and the concentration of the colloidal gold nanoparticles solution is 0.02 mg / mL.

[0057] (2) Adjust the concentration of gold nanoparticle solution to 0.05 mg / mL, then take 1.5 mL of gold nanoparticle solution and place it in a quartz photocatalytic reacti...

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Abstract

The invention relates to a preparation method of a metal copper nanocluster not wrapped with surface ligand and an application thereof. The preparation method comprises the following steps that a goldnanoparticle solution is prepared, then 2-10 volume parts of gold nanoparticle solution with the concentration being 0.01-0.1 mg / mL is taken to be put into a reaction container, then 3-10 volume parts of copper chloride solution with the concentration being 0.1-40 mg / mL is added, and the mixture is stored at dark light for 3-10 minutes and mixed evenly; and then the mixed solution of gold nanoparticle and copper chloride is subjected to laser irradiation of different wavelengths, the reacted solution is subjected to centrifugal separation, and the obtained solid precipitate is the metal copper nanocluster. In the preparation process of the metal copper nanocluster, surface active agents, polymers, the ligand and the like are not introduced completely, and the obtained metal copper nanocluster has the characteristics of remarkable fluorescence-emission performance, high oxygen reduction current, good stability and the like and can be applied to the fields of fluorescence labeling and electro-catalysis like fuel cells.

Description

technical field [0001] The invention relates to the preparation technology of nanometer materials, in particular to the preparation method of copper nanoclusters, in particular to the preparation method and application of metal copper nanoclusters without surface ligand coating. Background technique [0002] Metal nanomaterials have very important uses in catalytic reactions. For example, Pt has important applications in electrocatalysis fields such as fuel cells, and Cu has important uses in industrial thermocatalytic hydrogenation reactions. Catalytic reactions are very closely related to the surface of catalysts, and most of the catalytic processes take place on metal surfaces. For metal nanomaterials with smaller size, the larger the specific surface area, the stronger the catalytic activity will be. Metal nanoclusters will be obtained when the size of metal nanoparticles drops below 3nm. Since nanoclusters have a large proportion of surface atoms, their physical and c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/00C09K11/58H01M4/90B82Y40/00B82Y30/00
CPCH01M4/9041C09K11/58B82Y30/00B82Y40/00B22F9/24B22F1/054Y02E60/50
Inventor 潘书生刘志宇葛军姚玲敏
Owner GUANGZHOU UNIVERSITY
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