Insulated phase-change heat conducting material and preparation method thereof

A technology of heat-conducting materials and insulating phases, applied in the field of insulating phase-change heat-conducting materials and their preparation, can solve problems affecting product performance, poor thermal conductivity, weakened electrical conductivity, etc., and achieve good phase change characteristics, good thermal conductivity, and good insulation sexual effect

Inactive Publication Date: 2018-09-28
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the insulation performance of phase-change thermally conductive materials is poor, and it cannot meet the requirements for use in electronic devices that require relatively high insulation performance, and because of its electrical conductivity, it will also weaken or shield the signals of electronic products and affect product performance.
Therefore, a kind of insulating phase-change heat-conducting material has been developed, but the existing insulating phase-change heat-conducting material is a composite material formed by using a variety of insulating polymers, and its thermal conductivity is poor, which greatly limits the realization of insulation performance. thermal conductivity of the material

Method used

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  • Insulated phase-change heat conducting material and preparation method thereof
  • Insulated phase-change heat conducting material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0026] S1. Preparation of three-dimensional network expanded boron nitride:

[0027] Take 5g of boron oxide and 1g of expanded graphite dissolved in 75ml of methanol solution, and carry out magnetic stirring and mixing for 1h, put the stirred viscous mixed solution in an oven and dry at a temperature of 90°C to obtain a mixture B of boride and expanded graphite. The obtained mixture B was flattened in a graphite crucible and put into a tube furnace. Under the flow rate of 100mL / min N2, the temperature of the tube furnace was raised to 400°C at a rate of 10°C / min and kept for 1h, and at a rate of 5°C / min The temperature was raised to 800°C at a rate of 5°C / min and kept at 2h, and the rate of 5°C / min was heated to 1400°C for 2.5h and then cooled to room temperature with the furnace. After the reaction was completed, the obtained product was placed in a muffle furnace, and kept at 750°C for 5 hours to remove excess carbon, and finally obtained a white powder with a specific surfa...

Embodiment 2

[0033] S1. Preparation of three-dimensional network expanded boron nitride:

[0034] Take 5g of boron oxide and 1g of expanded graphite dissolved in 75ml of methanol solution, and carry out magnetic stirring and mixing for 1h, put the stirred viscous mixed solution in an oven and dry at a temperature of 90°C to obtain a mixture B of boride and expanded graphite. The obtained mixture B was flattened in a graphite crucible and put into a tube furnace. Under the flow rate of 100mL / min N2, the temperature of the tube furnace was raised to 400°C at a rate of 10°C / min and kept for 1h, and at a rate of 5°C / min The temperature was raised to 800°C at a rate of 5°C / min and kept at 2h, and the rate of 5°C / min was heated to 1400°C for 2.5h and then cooled to room temperature with the furnace. After the reaction was completed, the obtained product was placed in a muffle furnace, and kept at 750°C for 5 hours to remove excess carbon, and finally obtained a white powder with a specific surfa...

Embodiment 3

[0042] S1. Preparation of three-dimensional network expanded boron nitride:

[0043] Take 5g of boron oxide and 1g of expanded graphite dissolved in 75ml of methanol solution, and carry out magnetic stirring and mixing for 1h, put the stirred viscous mixed solution in an oven and dry at a temperature of 90°C to obtain a mixture B of boride and expanded graphite. The obtained mixture B was flattened in a graphite crucible and put into a tube furnace. Under the flow rate of 100mL / min N2, the temperature of the tube furnace was raised to 400°C at a rate of 10°C / min and kept for 1h, and at a rate of 5°C / min The temperature was raised to 800°C at a rate of 5°C / min and kept at 2h, and the rate of 5°C / min was heated to 1400°C for 2.5h and then cooled to room temperature with the furnace. After the reaction was completed, the obtained product was placed in a muffle furnace, and kept at 750°C for 5 hours to remove excess carbon, and finally obtained a white powder with a specific surfa...

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Abstract

The invention relates to the field of heat radiation materials for electronic products and specifically relates to an insulated phase-change heat conducting material and a preparation method thereof.The insulated phase-change heat conducting material comprises a boron nitride suspension, paraffin, a polymer and an antioxidant, and the boron nitride suspension is prepared by mixing raw materials including ammonium oleate, a flame retardant and three-dimensional net-like expanded boron nitride. Three-dimensional net-like expanded boron nitride of the insulated phase-change heat conducting material disclosed by the invention is expanded boron nitride internally having a continuous three-dimensional net-like structure, provides a uniform and continuous heat conduction network for the whole heat conducting material, has better heat conductivity as comparison with a common nanometer boron nitride powder, also has excellent insulation property, can be used in an electronic product with relatively high insulation property and cannot affect a signal of the electronic product.

Description

technical field [0001] The invention relates to the field of heat dissipation materials for electronic products, in particular to an insulating phase-change heat-conducting material and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology and intelligent consumer electronics products, the working efficiency of electronic products is constantly improving, with more and more functions and more powerful performance. The heating of products has become one of the problems that cannot be ignored, which will pose a serious threat to the stability, reliability and service life of electronic products. Heat is considered a limiting factor for the advancement of electronic systems. [0003] Thermal interface material is a material commonly used in IC packaging and electronic heat dissipation. Its main function is to fill the micropores and uneven holes on the surface when the two materials are bonded or contacted, reduce the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06C09K5/14H01B3/34H01B3/40H01B3/42H01B3/44
CPCC09K5/063C09K5/14H01B3/34H01B3/40H01B3/427H01B3/44
Inventor 祝渊付婷婷徐明强
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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