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Hot-melt adhesive

A technology of hot-melt adhesives and symmetry, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of low tensile breaking strength and low cohesion of hot-melt adhesives, Achieve the effects of small temperature dependence, stable adhesion, and excellent quality stability

Active Publication Date: 2018-09-28
SANYO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned hot melt adhesives have problems of low cohesive force and low tensile breaking strength.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0100] [Synthesis of EO Adduct of Bisphenol A (A-1)]

[0101] Into a glass autoclave, 137.0 g of toluene (40% relative to bisphenol) and 342.4 g (1.50 mol) of bisphenol A ("bisphenol A" manufactured by Mitsubishi Chemical Corporation) were put into a glass autoclave, and after nitrogen substitution, the temperature was raised to At 75°C, bisphenol A was dispersed in toluene. Thereto was added 2.73 g of a 25% aqueous solution of tetramethylammonium hydroxide.

[0102] Nitrogen replacement was performed again, and EO was added dropwise at 75 to 95° C. and a reaction pressure of 0.2 MPa or less to react. During the reaction, samples were appropriately sampled, the molar distribution of the addition of the reactant to bisphenol was traced by GC, and the reaction was terminated when 1 mole of the addition product reached 0.1% or less. The required EO was 139.9 g (3.18 mol) and the reaction time was 7 hours.

[0103] After the reaction, unreacted EO, a catalyst, a solvent, and th...

manufacture example 2

[0106] [Synthesis of EO adduct of Bisphenol A (A-2)]

[0107] In a glass autoclave, 85.6 g of (A-1) obtained in Example 1 (25 wt % with respect to bisphenol A added later) was charged and melted as a solvent for the reaction system. After heating to 110 degreeC and melting this, bisphenol A 342.4g (1.50 mol) was injected|thrown-in, and after nitrogen substitution, it cooled to 95 degreeC, and bisphenol A was disperse|distributed. Thereto was added 0.30 g of sodium hydroxide.

[0108] Nitrogen replacement was performed again, and EO was added dropwise at 75 to 95° C. and a reaction pressure of 0.2 MPa or less to react. During the reaction, samples were appropriately sampled and the molar distribution of the addition of reactants on bisphenol was followed by GC. The reaction was terminated when 1 mol of the adduct reached 0.1% or less. The required EO was 150.5 g (3.42 mol) and the reaction time was 7 hours.

[0109] After the reaction, the catalyst was neutralized with phos...

manufacture example 3

[0112] [Synthesis of EO adduct of Bisphenol A (A-3)]

[0113] The reaction was carried out in the same manner as in Production Example 2, except that the amount of EO to be added dropwise in Production Example 2 was 154.0 g (3.50 mol), and the reaction was terminated when 1 mol of the adduct reached 0.1% or less.

[0114] After the reaction, the catalyst was neutralized with phosphoric acid, and unreacted EO was distilled off at 130 to 160° C. under reduced pressure to obtain an EO adduct of bisphenol A (A-3).

[0115] As a result of analyzing this (A-3) by GC, the average number of moles of EO added per hydroxyl group of the obtained (A-3) was 1.10, and the monodispersity was 81.3%.

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Abstract

The purpose of the present invention is to provide a hot-melt adhesive which has a reduced temperature dependence, exhibits flowability immediately upon heating to above the melting point, and has anexcellent rupture tensile strength. The hot-melt adhesive of the present invention comprises a thermoplastic urethane resin (F) produced from monomers including the following essential constituent monomers: a polyol (A) having an aromatic ring; a diisocyanate (B) having symmetry; one or more glycols (C) which are poly(methylene glycol) (C1) represented by general formula (1) and / or poly(ethylene glycol) (C2) represented by general formula (2); and a high-molecular-weight polyol (D). HO-(CH2)n-OH (1) [n is an integer of 2-8.] HO-(CH2CH2O)m-H (2) [m is an integer of 2-8.]

Description

technical field [0001] The present invention relates to hot melt adhesives containing thermoplastic urethane resins. Background technique [0002] Thermoplastic resins generally decrease in resin strength with an increase in temperature, and thus heat resistance may become a problem during use. From the viewpoint of quality stability of products using thermoplastic resins, thermoplastic resins with small temperature dependence in a wide temperature range are desired. In addition, from the viewpoint of ease of handling during use, a thermoplastic resin having rapid melting properties (flowability is rapidly exhibited when exceeding the melting point) is desired. As such a thermoplastic resin having little temperature dependence, a hot-melt adhesive comprising a diisocyanate having a symmetrical structure, a low-molecular-weight diol having a symmetrical structure, and / or a low-molecular-weight diamine having a symmetrical structure is known. A hard segment composed of a cla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C08G18/66C09J11/06
CPCC08G18/66C09J11/06C09J175/04
Inventor 今井政登岛田哲也
Owner SANYO CHEM IND LTD
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