Photosensitive compositions, hardening film, color filter and electronic device

A technology of photosensitive composition and compound, which is applied in optical filters, photosensitive materials for optomechanical equipment, instruments, etc. It can solve the problems of reduced residual film rate, reduced transmittance of hardened film, and aggregation of inorganic particles, and achieves The effect of excellent refractive index

Inactive Publication Date: 2018-10-09
JNC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Patent Document 2 discloses the transmittance or refractive index of a cured film formed from a photosensitive composition containing an acrylic resin, but the heat resistance cannot be sufficiently satisfied, and further improvement is required.
[0008] In addition, when inorganic fine particles are added to the photosensitive composition, if the dispersibility of the inorganic fine particles with respect to the resin contained in the photosensitive composition is poor, the aggregation of the inorganic fine particles may occur, which may lead to the formation of the cured film obtained. Reduced transmittance or reduced residual film rate and other issues

Method used

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  • Photosensitive compositions, hardening film, color filter and electronic device
  • Photosensitive compositions, hardening film, color filter and electronic device
  • Photosensitive compositions, hardening film, color filter and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0201] Next, the present invention will be specifically described by way of synthesis examples, reference examples, examples, and comparative examples, but the present invention is not limited by these examples.

[0202] About the abbreviation of each component in Table 1 to Table 2,

[0203] ODPA is 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride,

[0204] BT-100 is 1,2,3,4-butane tetracarboxylic dianhydride,

[0205] SMA1000P is styrene-maleic anhydride copolymer (trade name; Chuanyuan Chemical Co., Ltd.),

[0206] MEHQ is 4-methoxyphenol (hydroquinone monomethyl ether),

[0207] Epoxy Ester (Epoxy Ester) 70PA is an acrylic modified product of propylene glycol diglycidyl ether (trade name; Gongrongshe Chemical Co., Ltd.),

[0208] DDS is 3,3'-diaminodiphenyl sulfone,

[0209] M-520 is a compound having a polymerizable double bond, Aronix (Aronix) M-520 (trade name; Toagosei Co., Ltd.),

[0210] NCI-930 is photopolymerization initiator Adeka arc Luz (Adeka arc Luz) ...

Synthetic example 1

[0220] [Synthesis Example 1] Synthesis of Polyester Amic Acid (A1) Solution

[0221] In a four-necked flask with a stirrer, dehydrated and purified PGMEA, BT-100, SMA1000P, benzyl alcohol, and 1,4-butanediol were sequentially loaded with the following weights, and carried out under dry nitrogen flow at 125°C for 3 Stir for an hour.

[0222]

[0223] Then, the reaction liquid was cooled to 25 degreeC, DDS and PGMEA were thrown in by the following weight, and after stirring at 20 degreeC - 30 degreeC for 2 hours, it stirred at 125 degreeC for 2 hours.

[0224] DDS 0.95g

[0225] PGMEA 7.04g

[0226] [Z / Y=2.7, (Y+Z) / X=0.9]

[0227] Thereafter, the reaction liquid was cooled to 25° C., trimellitic anhydride (TMA) and PGMEA were added by the following weights, and stirred at 20° C. to 30° C. for 2 hours.

[0228] TMA0.24g

[0229] PGMEA 6.15g

[0230] The solution was cooled to room temperature to obtain a 30% by weight solution of a pale yellow transparent polyester amic ...

Embodiment 1

[0236] A 30% by weight solution of polyester amic acid (A1), M-520, NCI-930, VG3101L, TMA, ND-139, 2 -Hydroxy-1,4-naphthoquinone, S510, AO-60, BYK-342, PGMEA, PGME, and EDM were mixed and dissolved, and filtered with a membrane filter (0.2 μm) to obtain a photosensitive composition.

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Abstract

The present invention relates to photosensitive compositions, a hardening film, a color filter and an electronic device. The photosensitive compositions comprise polyesteramide, compounds, a photopolymerization initiator, epoxy compound, epoxy hardener and inorganic corpuscule, wherein the polyesteramide is obtained through reaction by taking tetracarboxylic anhydride, diamidogen and multiple hydroxyl compounds as necessary raw materials. The photosensitive compositions can form heat-resistant, transparent and flat hardening film with good a plastic film residue rate, analyticity and a refractive index.

Description

technical field [0001] The present invention relates to a photosensitive composition used for various elements, a cured film formed from the photosensitive composition, and a color filter and an electronic device using the cured film. Background technique [0002] In the manufacturing process of elements such as display elements, various chemical treatments such as organic solvents, acids, and alkali solutions are performed, or the surface is locally heated to a high temperature when forming a film of wiring electrodes by sputtering. Therefore, a surface protective film may be provided in order to prevent deterioration, damage, and deterioration of the surface of various elements. For these protective films, various properties that can withstand various treatments in the above-mentioned manufacturing steps are required. Specifically, chemical resistance such as heat resistance, solvent resistance, acid resistance, and alkali resistance, water resistance, adhesion to base su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G02B5/20C08G69/44
CPCC08G69/44G02B5/20G03F7/004G03F7/0007G03F7/031G03F7/0385G03F7/0387
Inventor 渡辺尚树冈本优纪
Owner JNC CORP
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