Negative photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in optics, optomechanical equipment, instruments, etc. It can solve the problems of storage stability such as sensitivity and pattern shape change, difficulty in obtaining bonding strength, increase in molecular weight, etc., and reach UV Excellent transmittance, improved sensitivity and heat resistance, excellent performance effects

Active Publication Date: 2012-06-27
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of the above-mentioned acrylic resin, since it is difficult to obtain the high heat resistance required for the interlayer insulating film, outgassing (Outgassing) may cause damage to the photosensitive device and problems of afterimages, and it is difficult to obtain the composition of each layer. The bonding strength between metals (ITO, SiNx, etc.), and coloring will occur after thermal curing, it is difficult to achieve the high transmittance required by the interlayer insulating film, and the molecular weight will increase when stored at room temperature, so There are problems with storage stability such as sensitivity and pattern shape changes
[0006] Acrylic resins are mainly used for resist resins for protective layers, resist resins for black matrices, resist resins for columnar spacers, and resist resins for color filters that have been conventionally used as materials for liquid crystal elements for image formation. , these acrylic resins have the problems of slow curing speed based on photoinitiators and polyfunctional monomers with ethylenic unsaturated bonds, and volume shrinkage after curing

Method used

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  • Negative photosensitive resin composition
  • Negative photosensitive resin composition
  • Negative photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] (manufacturing of acrylic copolymers)

[0087] Add 10 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile), 400 parts by weight of propylene glycol monomethyl ether acetate, 30 parts by weight in the flask equipped with condenser tube and stirrer Parts by weight of methacrylic acid, 30 parts by weight of allyl methacrylate, 10 parts by weight of 4-hydroxyphenylmaleimide of the above chemical formula 1 and 30 parts by weight of styrene, slowly carry out after nitrogen exchange Stir. The temperature of the reaction solution was raised to 55° C. and maintained at this temperature for 24 hours to produce a polymer solution containing an acrylic copolymer.

[0088] Add the above-produced acrylic copolymer dropwise to 5000 parts by weight of hexane, and the copolymer is precipitated. After the copolymer is separated by filtration, 200 parts by weight of propionate are added to the copolymer and heated to 30°C to produce a solid A polymer solution having a polymer conce...

Embodiment 2

[0092] In the manufacture of the acrylic copolymer of the above-mentioned embodiment 1, 20 parts by weight of 4-hydroxyphenylmaleimide of the above chemical formula 1 was used, 30 parts by weight of methacrylic acid, 30 parts by weight of allyl methacrylate , 20 parts by weight of styrene, the manufacture of solids concentration is 45% by weight, the weight average molecular weight of the polymer is an acrylic copolymer of 17800, except that, operate with the method identical with above-mentioned embodiment 1, manufacture negative photosensitive Resin composition coating solution.

Embodiment 3

[0094]In the manufacture of the acrylic copolymer of the above-mentioned embodiment 1, use 30 parts by weight of 4-hydroxyphenylmaleimide of the above chemical formula 1, use 30 parts by weight of methacrylic acid, 30 parts by weight of allyl methacrylate , 10 parts by weight of styrene, the manufacture of solid concentration is 45% by weight, the weight-average molecular weight of the polymer is an acrylic copolymer of 18100, except that, operate with the method identical with above-mentioned embodiment 1, manufacture negative photosensitive Resin composition coating solution.

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Abstract

The present invention provides a negative photosensitive resin composition, a TFT type liquid crystal display element comprising the negative photosensitive resin condensate, and an image forming method using the TFT type liquid crystal display element of the negative photosensitive resin composition. Said negative photosensitive resin composition has excellent bonding strength, heat resistance, insulativity, flatness, chemical resistance and stability of storing in normal temperature, which is suitable for image forming material of liquid crystal display element. The negative photosensitive resin composition of the invention contains a) acrylates compolymer; b) photoinitiator; c) multifunctional monomer having ethane unsaturated link; d) silicon compound containing epoxy group or amidocyanogen and e) solvent; said a) acrylates compolymer is obtained by polymerizing i) phenyl maleimide compound, ii) allyl acrylates compound and iii) undersaturation carboxylic acid, undersaturation carboxylic acid anhydride and mixture of them.

Description

technical field [0001] The invention relates to a negative photosensitive resin composition. The negative photosensitive resin composition of the present invention has heat resistance, bonding strength, insulation, transmittance, flatness, chemical resistance and stable storage at room temperature. It is suitable for image forming materials for liquid crystal display elements, especially because of the sensitivity, residual film rate, and UV transmittance of the negative photosensitive resin composition when forming the organic insulating film of liquid crystal display elements. It is excellent, so it is suitable for use as an interlayer organic insulating film, and not only that, this negative photosensitive resin composition is used as a resist resin for a protective layer, a resist resin for a black matrix, and a column spacer. When a resist resin or a resist resin for color filters is used, sensitivity, heat resistance, adhesive strength, and storage stability at room temp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/028G03F7/031G03F7/027
CPCB26B3/08B26B9/02
Inventor 吕泰勳尹赫敏李浩真尹柱豹丘冀赫郑义澈金东明崔相角申洪大李东赫金柄郁
Owner DONGJIN SEMICHEM CO LTD
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