Soldering tin wire for circuit boards and preparation method thereof

Abstract

The invention discloses a soldering tin wire for circuit boards. The soldering tin wire for the circuit boards comprises, by weight, 97.4-98.2% of hollow tin alloy and 1.8-2.6% of scaling powder arranged in the tin alloy in a filling mode. The tin alloy comprises, by weight, 2-9 parts of Cu, 1-5 parts of Ni, 0.2-1.2 parts of P, 0.1-0.7 part of Ga, 40-60 parts of Sn and 2-8 parts of Bi. The scalingpowder comprises, by weight, 1-3 parts of fluoridation hydroxylamine, 2-4 pars of metal active salts, 1-5 parts of active agents, 0.1-0.5 part of corrosion inhibitor, 2-8 parts of organic acid, 0.5-3.5 parts of azole substances, 1-5 parts of oxidation resistant oil and 10-30 parts of rosin. The soldering tin wire has good solderability, higher welding efficiency, higher welding efficiency can beincreased by more than 10%, spatter is less during welding, the subsequent corrosion is reduced, the difficulty of cleaning is reduced, the precious tin solder is saved, the scaling powder is prone toleaking by storage, and the rejection rate is effectively reduced.

Description

technical field [0001] The invention relates to the technical field of electronic technology, in particular to a solder wire used for circuit boards and a preparation method thereof. Background technique [0002] With the continuous development of electronic and electrical products in the direction of miniaturization, light weight, and low energy consumption, the materials used are required to be lighter and lighter, while still having good overall performance. Although copper has good electrical conductivity, thermal conductivity, corrosion resistance and excellent mechanical properties, it has been widely used in various industrial fields and its demand is increasing with the rapid development of the economy, but its reserves in nature Not much, mining and processing costs are high, and the current guide copper wire on the circuit board is generally welded by solder wire, and the general solder wire is easy to break during the welding process, resulting in reduced welding ...

AI Technical Summary

Problems solved by technology

Although copper has good electrical conductivity, thermal conductivity, corrosion resistance and excellent mechanical properties, it has been widely used in various industrial fields and its demand is increasing with the rapid development of the economy, but its reserves in nature Not much, mining and processing costs are high, and the current guide copper wire on the circuit board is generally welded by solder wire, and the general solder wire is easy to break during the welding process, resulting in reduced welding efficiency, easy to oxidize, and poor mechanical properties. Difference