Composition capable of crosslinking hydrocarbon polymer and prepared prepreg and thermosetting copper clad plate

A hydrocarbon polymer and prepreg technology, which is applied in the field of communication materials, can solve the problems of difficulty in meeting the diversification of functions, complex and high density, poor uniformity of thermal expansion coefficient of dielectric properties, and general thermal-mechanical stability of copper clad laminates. Achieve the effect of good industrial production basis and broad application prospects

Active Publication Date: 2018-10-16
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in addition to polystyrene, polyphenylene ether generally has poor compatibility with other resins, resulting in serious phase separation of the resin in the prepreg composite matrix, and the bonding between the matrix resin and fillers and fiber cloth and other reinforcing materials Poor strength
T

Method used

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  • Composition capable of crosslinking hydrocarbon polymer and prepared prepreg and thermosetting copper clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Take 65 parts of vinyl-terminated polyphenylene ether (Sabic SA9000), 35 parts of polybutadiene (Kray Willy Ricon130), 20 parts of polydiene-styrene-divinylbenzene terpolymer (Kray Wiley Ricon257), 8 parts polybutadiene-maleic anhydride copolymer (Cray Wiley Ricon130MA8), 12 parts polystyrene-maleic anhydride copolymer (Cray Wiley SMA1000), 22 parts TiO 2 (Tianjin Zhongzheng Huamei Technology), 50 parts of flame retardant magnesium hydroxide (USA Yabao MAGNIFIN H-5), 20 parts of sub-flame retardant decabromodiphenylethane (Shandong Haiwang Chemical) and 450 parts of DMF solvent, in 80 Stir at ℃ for 24 hours to fully dissolve and disperse evenly; cool down to room temperature, add 1.2 parts of dibenzoyl peroxide (Qinfeng Chemical Industry), and stir evenly; use 1080 glass fiber cloth to dip in glue, and then bake and dry to obtain a prepreg. Among them, the baking temperature of the first stage is 75°C and the time is 7 minutes, and the baking temperature of the second sta...

Embodiment 2

[0023] Take 60 parts of vinyl-terminated polyphenylene ether (Sabic SA9000), 30 parts of polybutadiene (Kray Willy Ricon130), 22.5 parts of polydiene-styrene-divinylbenzene terpolymer (Kray Willie Ricon257), 4 parts polybutadiene-maleic anhydride copolymer (Cray Willy Ricon130MA8), 6 parts polystyrene-maleic anhydride copolymer (Cray Willy SMA1000), 35 parts polytetrafluoroethylene Pre-sintered material (Shandong Dongyue), 8 parts of SiO 2 (Xinyi Hongrun), 28 parts of flame retardant magnesium hydroxide (USA Yabao MAGNIFIN H-5), 18 parts of sub-flame retardant decabromodiphenylethane (Shandong Haiwang Chemical) and 450 parts of DMF solvent, in 80 o Stir at C for 24 hours to fully dissolve and disperse evenly; cool down to room temperature, add 1.2 parts of dibenzoyl peroxide (Qinfeng Chemical Industry), and stir evenly; use 1080 glass fiber cloth to dip in glue, and then bake and dry to obtain a prepreg. Among them, the baking temperature of the first stage is 75°C and the ti...

Embodiment 3

[0025] Take 20 parts of vinyl-terminated polyphenylene ether (Sabic SA9000), 80 parts of polybutadiene (Kray Willy Ricon130), 18 parts of polydiene-styrene-divinylbenzene terpolymer (Kray Willie Ricon257), 4 parts polybutadiene-maleic anhydride copolymer (Cray Willy Ricon130MA8), 6 parts polystyrene-maleic anhydride copolymer (Cray Willy SMA1000), 40 parts polytetrafluoroethylene Pre-sintered material (Shandong Dongyue), 23 parts of flame retardant magnesium hydroxide (USA Yabao MAGNIFIN H-5), 18 parts of sub-flame retardant decabromodiphenylethane (Shandong Haiwang Chemical) and 450 parts of DMF solvent, Stir at 80°C for 24 hours to fully dissolve and disperse evenly; cool down to room temperature, add 1.5 parts of dibenzoyl peroxide (Qinfeng Chemical Industry), and stir evenly; use polytetrafluoroethylene fiber woven cloth to soak in glue, and then bake Baking and drying to obtain prepregs, in which the first-stage baking temperature is 75°C and the time is 7 minutes, and th...

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Abstract

The invention belongs to the field of communication materials and particularly relates to a composition capable of crosslinking a hydrocarbon polymer and a prepared prepreg and a thermosetting copperclad plate, the dielectric property of the composition is excellent, the mechanical strength is high, the glass transition temperature and the heat resistance are high, the coefficient of thermal expansion is low, the peel strength of copper foil is high, the evenness of the various performances is high, the composition is suitable for manufacturing a multi-layer copper clad plate, and the variousperformance requirements on function diversification and complication of the copper clad plate material are met in the high-frequency high-speed communication field. Therefore, the composition has anexcellent basis for industrial production and a broad application prospect.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a crosslinkable hydrocarbon polymer composition and a prepreg and a thermosetting copper clad laminate prepared therefrom. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, wearable devices, communication base stations, satellites, unmanned vehicles, drones and intelligent robots, and are one of the key materials in the electronic communication and information industries. Traditional thermosetting resins represented by epoxy resin, phenolic resin and cyanate resin have high thermo-mechanical properties, low thermal expansion coefficient, high quality and low price, convenient processing and strong versatility. They are commonly used in the production of copper clad laminate substrates. Material. After continuously exploring and optimizing the formula and process parameters, researchers have prepared various types o...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L9/00C08L47/00C08L35/06C08K13/02C08K3/22C08K5/03C08K5/14B32B17/02B32B17/12B32B15/20B32B15/14B32B27/04B32B27/02B32B27/12B32B27/32
CPCB32B5/02B32B5/26B32B15/14B32B15/20B32B2260/021B32B2260/046B32B2262/0253B32B2262/101B32B2307/204B32B2307/3065B32B2307/308B32B2307/546C08K2003/2224C08K2003/2241C08L9/00C08L71/12C08L2205/025C08L2205/035C08L47/00C08L35/06C08K13/02C08K3/22C08K5/03C08K5/14
Inventor 俞卫忠俞丞顾书春冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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