Preparation method of high heat conduction filler for epoxy resin

Abstract

The invention relates to a preparation method of a high heat conduction filler for epoxy resin, and belongs to the technical field of heat conduction filler preparation. According to the method, firstly, linen fiber is used as a raw material; after the linen fiber is steeped in tea seed oil ; then, the linen fiber is put under the high-temperature and high-humidity conditions to be subjected to static rancidification; next, after the fiber subjected to rancidification is sealed, fermentation is performed for a short time, so that the linen fiber is slightly decayed; micropores are generated onthe linen fiber surface; after the carbonization, potassium permanganate is used for oxidation; the oxidized linen carbon fiber is sequentially subjected to mixed reaction with a cupric nitrate solution and a glucose solution; through electric arc anti-electricity treatment, a heat conduction material crude product is prepared; finally, the heat conduction material crude product, lard oil and biogas slurry are blended for fermentation modification; finally, the high heat conduction filler is prepared. The prepared high heat conduction filler has high heat conduction efficiency, high stability, good toughened anti-impact performance and wide application prospects.

Description

technical field [0001] The invention relates to a method for preparing a high thermal conductivity filler for epoxy resin, and belongs to the technical field of thermal conductivity filler preparation. Background technique [0002] Due to its excellent mechanical properties and dielectric properties, epoxy resin has been widely used in electrical packaging, transformer castings, circuit boards and other fields. However, due to the low thermal conductivity of epoxy resin (less than 0.2W / m·K), it is easy to generate heat accumulation during the operation of the device, increase the internal stress, and lead to a series of problems such as cracking of the product. Therefore, in fields that require high thermal conductivity, epoxy composite materials are required to have superior comprehensive properties such as high thermal conductivity, good processability, and high cost performance. In order to effectively improve thermal conductivity, adding high thermal conductivity filler...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is aimed at the low thermal conductivity of common epoxy resins at present, while the most common metal thermal conductive fillers are easy to oxidize, have poor stability, will agglomerate in epoxy resin, and are compatible

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