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A kind of silver alloy bonding wire and its manufacturing method

A technology of silver alloy bond and manufacturing method, which is applied in the field of bonding wire, can solve problems such as unsatisfactory anti-sulfurization performance and anti-aging performance, affecting the service life of bonding wire application products, and high resistivity, so as to increase the bonding operation Window, improve anti-oxidation ability and anti-sulfurization ability, effect of low resistivity

Active Publication Date: 2020-10-13
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The anti-sulfurization and anti-aging properties of the existing silver alloy bonding wire are still not ideal, and the resistivity is high, which affects the application of the bonding wire and the service life of the packaged product

Method used

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  • A kind of silver alloy bonding wire and its manufacturing method
  • A kind of silver alloy bonding wire and its manufacturing method

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Experimental program
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Effect test

Embodiment 1

[0031] The silver alloy bonding wire of this embodiment contains Au 1%, Pd 2%, Ca 100ppm, Cu 100ppm, Be 80ppm by weight, and the balance is silver.

[0032] The manufacture method of above-mentioned silver alloy bonding wire comprises the following steps:

[0033] (1) Melting and casting: Au, Pd, Ca, Cu and Be are added to the silver raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 6 mm is obtained;

[0034] (2) wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy wire with a diameter of 220um;

[0035] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the silver alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 800mm, the annealing temperature is 500°C, and the annealing rate is 100m / min;

[0036] (4) Continue to draw the silver alloy wire after the intermediate an...

Embodiment 2

[0040] The silver alloy bonding wire of this embodiment contains Au 2%, Pd 0.2%, In 50ppm, Ge 150ppm, Ca 10ppm by weight, and the balance is silver.

[0041] The manufacture method of above-mentioned silver alloy bonding wire comprises the following steps:

[0042] (1) Melting and casting: Au, Pd, In, Ge and Ca are added to the silver raw material in proportion, and a wire rod with a diameter of 8 mm is obtained through vacuum melting and directional continuous casting process;

[0043] (2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy wire with a diameter of 200um;

[0044] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the silver alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 1000mm, the annealing temperature is 500°C, and the annealing rate is 100m / min;

[0045] (4) Continue to draw the silver alloy wire after the intermediate...

Embodiment 3

[0049] The silver alloy bonding wire of this embodiment contains 0.5% by weight of Au, 3% of Pd, 150ppm of In, 150ppm of Cu, and the balance is silver.

[0050] The manufacture method of above-mentioned silver alloy bonding wire comprises the following steps:

[0051] (1) Melting and casting: Au, Pd, In and Cu are added to the silver raw material in proportion, and after vacuum melting and directional continuous casting process, a wire rod with a diameter of 8 mm is obtained;

[0052](2) Wire drawing: drawing the wire rod obtained in step (1) to obtain a silver alloy wire with a diameter of 150um;

[0053] (3) Intermediate annealing: After step (2) wire drawing is completed, intermediate annealing is performed on the silver alloy wire, and N 2 As the annealing atmosphere, the effective length of the annealing furnace is 600mm, the annealing temperature is 500°C, and the annealing rate is 60m / min;

[0054] (4) Continue to draw the silver alloy wire after the intermediate anne...

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Abstract

The invention discloses a silver alloy bonding wire. The silver alloy bonding wire is characterized by comprising the following components including, by weight:, 0.1-2% of Au, 0.1-3% of Pd, 1-7000 ppmof race additive elements, and the balance Ag, and the race additive elements are one or more than two of the combinations of Ca, Cu, Be, In and Ge. The invention further provides a manufacturing method for the silver alloy bonding wire. The silver alloy bonding wire has the following beneficial effects that (1) the anti-vulcanization performance is excellent; (2) the anti-aging performance is excellent, and the reliability of the packaging products in the thermal impact test is improved; (3) the electrical resistivity is low (as low as 2.0 0 microhms-cm); (4) a line operation window is largeand has excellent operation performance; and (5) the FAB ball burning is excellent, no ball sliding exists, the welding point bonding strength is high, and the reliability is high.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a silver alloy bonding wire and a manufacturing method thereof. Background technique [0002] Bonding wire (bonding wire, also known as bonding wire) is the main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Due to the development requirements of miniaturization and thinning of electronic products, the sem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/06C22F1/14H01L33/62
CPCC22C5/06C22F1/14H01L33/62
Inventor 周振基周博轩麦宏全彭政展
Owner NICHE TECH KAISER SHANTOU
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