Oxidized Dumet wire and molding processing method thereof

A technology of cuprous oxide and wire drawing machine, which is applied in the direction of metal/alloy conductors, electrical components, circuits, etc. It can solve problems such as environmental pollution, affecting product quality, and poor welding performance of guide wires, so as to avoid environmental pollution and burnout. Dots or leaks, tighter and more firm effect

Active Publication Date: 2018-11-13
JIANGYIN SIX CIRQUE ALLOY WIRE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The current production of Dumet silk, its product disadvantages are easy to produce bubbles and chronic air leakage when sealing with glass, easy to absorb moisture, oxidize and mildew, short shelf life, poor surface boron layer firmness, poor welding performance when making guide wire, etc.
Its traditional production process usually adopts copper p

Method used

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  • Oxidized Dumet wire and molding processing method thereof
  • Oxidized Dumet wire and molding processing method thereof
  • Oxidized Dumet wire and molding processing method thereof

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0038] Example 1

[0039] As shown in the figure, the present invention provides an oxidized Dumet wire, which includes a nickel-iron alloy core wire and a copper clad layer wrapped on the outer side of the total nickel-iron core wire. The outer side of the copper clad layer is provided with a cuprous oxide layer. The thickness of the layer is 1 / 8 to 1 / 7 times the diameter of the nickel-iron alloy core wire. The preferred thickness of the copper-clad layer is 0.125 times the diameter of the nickel-iron alloy core wire. The cuprous oxide layer is used for glass in the semiconductor industry. The capacitor inlay in the sealed diode and the circuit board can be effectively sealed with the heated glass to achieve the sealing effect; the oxidized Dumet wire contains 30-32% Ni and 16.8 Co. ~17.8%, the total amount of trace elements is <0.1%, the Cu content is 18%-22%, and the rest is Fe element.

[0040] In this embodiment, nickel-iron-cobalt alloy is preferably used as the core materia...

Example Embodiment

[0041] Example 2

[0042] As shown in the figure, the present invention provides an oxidized Dumet wire, which includes a nickel-iron alloy core wire and a copper clad layer wrapped on the outer side of the nickel-iron total core wire. Cuprous oxide layer, the thickness of the copper-clad layer is 1 / 8 to 1 / 7 times the diameter of the nickel-iron alloy core wire, and the preferred thickness of the copper-clad layer is 0.125 times the diameter of the nickel-iron alloy core wire. The copper layer is used in the glass-sealed diodes in the semiconductor industry and the capacitor inlay of the circuit board. It can be effectively sealed with the heated glass to achieve the sealing effect; the oxidized Dumet wire contains Ni The content is 40-42%, the total amount of trace elements is <0.1%, the Cu content is 22-24%, and the rest is Fe element.

[0043] In this embodiment, nickel-iron alloy is used as the wire core material, and the dumet wire formed by coating with copper clad is partic...

Example Embodiment

[0044] Example 3

[0045] Based on Example 1 or 2, the manufacturing process for preparing the oxidized Dumet wire in Example 1 or 2 includes the following steps:

[0046] Step one, select materials, select nickel-iron alloy bars and copper tubes made of nickel-iron alloy materials; perform surface cleaning treatment on the nickel-iron alloy bars, including deoxidation, deburring and stain cleaning, and then dry; among them, the nickel-iron alloy bars Meet the processing requirements, no bubbles, scratches, dirt, burrs, black spots, etc. on the surface; no bubbles, scratches, dirt, burrs, black spots, etc. on the surface of the copper pipe; no bubbles, scratches, dirt, burrs, black spots on the surface, etc.; copper pipe meets the processing requirements, no bubbles on the surface , Scratches, dirt, burrs, black spots, etc.; the copper pipe meets the processing requirements without bubbles, scratches, dirt, burrs, black spots, etc.;

[0047] Step two, for the first wire drawing, use...

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Abstract

The invention relates to an oxidized Dumet wire and a molding processing method thereof. The oxidized Dumet wire comprises a nickel-iron alloy core wire and a copper cladding layer covering the outside of the nickel-iron alloy core wire. The processing technology comprises the following steps: step I, selecting materials; step II, performing the primary wire drawing; step III, pretreating, and polishing and processing; step IV, sleeving a copper pipe; step V, performing the surface treatment; step VI, laminating; step VII, annealing; step VIII, performing the secondary wire drawing; step IX, performing the tertiary wire drawing; step X, oxidizing; and step XI, collecting the wire. By adopting the copper pipe sleeving copper cladding technology, the production efficiency is greatly improved, and the product quality is improved; and by optimizing the oxidization process, and by combining the primary oxidization and gas burning secondary oxidization process, the stability and uniformity of a surface cuprous oxide layer can be improved, a burnt point or a leak point can be avoided, and the product quality is improved.

Description

technical field [0001] The invention relates to the technical field of Dumet silk production, in particular to an oxidized Dumet silk and a forming processing method thereof. Background technique [0002] Dumet wire, also known as copper-clad nickel-iron alloy wire, is pure copper coated on nickel-iron alloy. Oxidized Dumet wire is the production of cuprous oxide on the surface of the copper layer, which is mainly used in glass-encapsulated diodes in the semiconductor industry and inlaid capacitors on circuit boards. Cuprous oxide can be effectively sealed together with the heated glass to achieve the sealing effect. The outer layer of oxidized Dumet silk has a similar expansion coefficient to glass, and can shrink with glass at the same time when heating and sealing, so that the surface-processed Dumet silk and glass are closely combined to avoid the possibility of mismatching expansion coefficients Caused glass breakage and poor sealing. [0003] Since Finr and Eidred f...

Claims

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Application Information

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IPC IPC(8): H01B1/02H01B13/00H01B13/30C22C30/02
CPCC22C30/02H01B1/02H01B13/0016H01B13/30
Inventor 朱向阳
Owner JIANGYIN SIX CIRQUE ALLOY WIRE CO LTD
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