Oxidized Dumet wire and molding processing method thereof

Abstract

The invention relates to an oxidized Dumet wire and a molding processing method thereof. The oxidized Dumet wire comprises a nickel-iron alloy core wire and a copper cladding layer covering the outside of the nickel-iron alloy core wire. The processing technology comprises the following steps: step I, selecting materials; step II, performing the primary wire drawing; step III, pretreating, and polishing and processing; step IV, sleeving a copper pipe; step V, performing the surface treatment; step VI, laminating; step VII, annealing; step VIII, performing the secondary wire drawing; step IX, performing the tertiary wire drawing; step X, oxidizing; and step XI, collecting the wire. By adopting the copper pipe sleeving copper cladding technology, the production efficiency is greatly improved, and the product quality is improved; and by optimizing the oxidization process, and by combining the primary oxidization and gas burning secondary oxidization process, the stability and uniformity of a surface cuprous oxide layer can be improved, a burnt point or a leak point can be avoided, and the product quality is improved.

Description

technical field [0001] The invention relates to the technical field of Dumet silk production, in particular to an oxidized Dumet silk and a forming processing method thereof. Background technique [0002] Dumet wire, also known as copper-clad nickel-iron alloy wire, is pure copper coated on nickel-iron alloy. Oxidized Dumet wire is the production of cuprous oxide on the surface of the copper layer, which is mainly used in glass-encapsulated diodes in the semiconductor industry and inlaid capacitors on circuit boards. Cuprous oxide can be effectively sealed together with the heated glass to achieve the sealing effect. The outer layer of oxidized Dumet silk has a similar expansion coefficient to glass, and can shrink with glass at the same time when heating and sealing, so that the surface-processed Dumet silk and glass are closely combined to avoid the possibility of mismatching expansion coefficients Caused glass breakage and poor sealing. [0003] Since Finr and Eidred f...

AI Technical Summary

Problems solved by technology

[0004] The current production of Dumet silk, its product disadvantages are easy to produce bubbles and chronic air leakage when sealing with glass, easy to absorb moisture, oxidize and mildew, short shelf life, poor surface boron layer firmness, poor welding performance when making guide wire, etc.

Its traditional production process usually adopts copper plating technology, which has the problem of unstable plating layer, which affects product quality, and the traditional electroplating copper process has environmental pollution; and the cuprous oxide layer on the outer layer of the existing oxidized Dumet wire usually uses electro Oxidation process, resulting in defects such as burn points and leak points

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