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Femtosecond laser processing device and 1x8 ridge type optical splitter processed through device

A femtosecond laser processing and femtosecond laser technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of cumbersome processing steps, high processing costs, and high processing environment requirements, and achieve low processing environment requirements. , The processing method has fewer steps, and the effect of improving the processing environment

Inactive Publication Date: 2018-12-07
HUBEI UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the production of optical splitters mostly adopts methods such as chemical etching and ion etching. The above-mentioned methods have cumbersome processing steps, high requirements on the processing environment, and high processing costs.

Method used

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  • Femtosecond laser processing device and 1x8 ridge type optical splitter processed through device
  • Femtosecond laser processing device and 1x8 ridge type optical splitter processed through device
  • Femtosecond laser processing device and 1x8 ridge type optical splitter processed through device

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Embodiment Construction

[0013] The invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0014] Such as figure 1 , a femtosecond laser processing device, comprising a femtosecond laser 10, a half-wave plate 11, a mirror 12, a microscope objective lens 13, an air blowing part 14, a six-degree-of-freedom working platform 15, a base material 16, an air suction part 17, CCD camera 18, computer 19.

[0015] Along the path of the femtosecond pulsed laser beam emitted by the femtosecond laser 10, a half-wave plate 11, a mirror 12, a microscopic objective lens 13 and a six-degree-of-freedom working platform 15 are sequentially arranged. Femtosecond laser 10 , six-degree-of-freedom work platform 15 and CCD camera 18 are all connected to computer 19 .

[0016] The processing wavelength of the femtosecond laser 10 is 800nm, the repetition frequency is 10kHZ, the laser pulse is 100fs, and the average power is 300mW.

[0017] The reflector...

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Abstract

The invention relates to a femtosecond laser processing device and a 1x8 ridge type optical splitter processed through device. When an optical device is processed through the femtosecond laser processing device, femtosecond pulsed laser beams sequentially pass through a half wave plate, a mirror and a microscope objective and then are focused to a substrate material fixed on a six-degree-of-freedom working platform, the focused femtosecond pulsed laser beams lithograph the substrate material into the optical device in the movement process of the six-degree-of-freedom working platform, and airflow between a blowing part and a sucking part is used for dedusting in the lithography process. The processing device is simple in structure, and the optical device processed by the processing deviceis low in processing cost, high in precision and good in consistency.

Description

technical field [0001] The invention belongs to the field of laser processing, and in particular relates to a femtosecond laser processing device and a 1x8 ridge optical splitter processed therewith. Background technique [0002] With the birth of lasers and the outstanding contribution of quartz glass optical fibers using cladding materials to reduce losses proposed by Kao et al., the application of light in communications has a foundation, and optical fibers are the original waveguides. As a basic component of a passive optical network, an optical splitter is used for power coupling and redistribution of optical signals. It can confine light waves in a medium with the size of the light wavelength and transmit them over long distances without radiation. It has the characteristics of wavelength insensitivity, small size, high reliability, good uniformity of light beam splitting, and wide working wavelength range. At present, methods such as chemical etching and ion etching...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/0622B23K26/06B23K26/03B23K26/142B23K103/00
CPCB23K26/03B23K26/0624B23K26/0643B23K26/142B23K26/361
Inventor 陶青卢博闻刘顿陈列娄德元杨奇彪翟中生郑重成健
Owner HUBEI UNIV OF TECH
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