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Bearing pedestal and pre-cleaning device

A base and bearing surface technology, applied in the manufacture of discharge tubes, electrical components, semiconductor/solid-state devices, etc., can solve the problems of high wafer etching rate, affecting process effect, and fast etching rate in the central area of ​​the wafer, etc. Achieve the effect of improving etching uniformity, reducing ion energy and reducing etching rate

Pending Publication Date: 2018-12-07
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the substrate stage carrying the wafer is usually a simple planar disc structure, in the pre-cleaning process, on the one hand, because the size of the substrate stage is similar to the wafer, and the edge electric field of the substrate stage is strong, it will make the wafer The etching rate at the edge of the circle is relatively fast; on the other hand, because the distribution of plasma density is often uneven in the radial direction, and usually the plasma density in the central area of ​​the substrate table is relatively high, resulting in the etching of the central area of ​​the wafer Speed ​​is too fast
To sum up the above two reasons, the overall etching uniformity of the wafer is poor, which affects the process effect.

Method used

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  • Bearing pedestal and pre-cleaning device

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Embodiment Construction

[0029] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0030] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0031] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0032] In all examples shown and discussed herein, any specific values ​​should be construed as illustrative only, and not as limiting. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention provides a bearing pedestal and a pre-cleaning device. The bearing pedestal is used to bear a workpiece to be processed, and a first recess is formed on the bearing pedestal, and the workpiece to be processed is accommodated in the first recess. The bottom wall of the first recess is provided with a second recess, and the second recess is used for reducing the etching rate of the central region of the workpiece to be processed. The bearing pedestal can be applied to a pre-cleaning device.

Description

technical field [0001] The present invention relates to the field of plasma equipment, more specifically, to a bearing base and a pre-cleaning device. Background technique [0002] Plasma equipment is widely used in manufacturing fields such as semiconductors, solar cells, and flat panel displays. Common plasma equipment includes capacitively coupled plasma (Capacitively Coupled Plasma, CCP), inductively coupled plasma (Inductively Coupled Plasma, ICP), and electron cyclotron resonance plasma (Electron Cyclotron Resonance, ECR) and other types of plasma processing equipment. These plasma equipment can usually be used in processing processes such as plasma etching, physical vapor deposition (Physical Vapor Deposition, PVD), chemical vapor deposition (Chemical Vapor Deposition, CVD) and enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) use. [0003] The physical vapor deposition process is the most widely used type of film preparation tech...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01J37/32
CPCH01J37/32431H01J37/32715H01L21/68714H01L21/68785H01L21/687H01J37/32
Inventor 常大磊陈鹏赵梦欣李冬冬李萌刘菲菲刘建生
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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