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Low-energy UV-curing solder resist ink and preparation method thereof

A solder resist ink and photocuring technology, which is applied in the field of preparing the solder resist ink and low-energy UV photocurable solder resist ink, can solve the problems of limiting the popularization and application of UV photocuring, low production efficiency, and slow curing speed, and achieves improvement Curing rate, increase in production efficiency, and the effect of increasing the curing rate

Active Publication Date: 2018-12-11
丰顺县三和电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, directly applying UV light sources to traditional solder resist inks for photocuring still has defects such as slow curing speed, high energy consumption, and low production efficiency, which limits the popularization and application of UV photocuring in solder resist inks.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Epoxy acrylate resin formula (mass percentage): novolac epoxy resin 30%, acid anhydride 25%, acrylic acid 41%, catalyst 2% and polymerization inhibitor 2%.

[0035] Solder resist ink formula: 15 parts of epoxy acrylate resin, 5 parts of difunctional or trifunctional polyurethane acrylic resin, 1 part of anthraquinone, 4 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 32 parts of talcum powder, 3 parts of silicon dioxide, 0.5 parts of titanium green powder, 12 parts of hydroxyethyl methacrylate, 7 parts of trimethylolpropane triacrylate, 2 parts of phosphate ester, 0.15 parts of polyether silicone oil and BYK- 104S 0.2 parts.

[0036] Preparation method of solder resist ink: (1) preparation of epoxy acrylate resin

[0037] (a) take by weighing each component that prepares epoxy acrylate resin by formula quantity, for subsequent use;

[0038] (b) under the environment of 60°C to 70°C, add acid anhydride to the novolac epoxy resin and stir evenly;

[0039] (c) ...

Embodiment 2

[0043] Epoxy acrylate resin formula (mass percentage): novolak epoxy resin 65%, acid anhydride 5%, acrylic acid 29.74%, catalyst 0.25% and polymerization inhibitor 0.01%.

[0044] Solder resist ink formula: 20 parts of epoxy acrylate resin, 10 parts of difunctional or trifunctional polyurethane acrylic resin, 3 parts of anthraquinone, 7 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 38 parts of talcum powder, 4 parts of silicon dioxide, 1.5 parts of titanium green powder, 18 parts of hydroxyethyl methacrylate, 12 parts of trimethylolpropane triacrylate, 6 parts of phosphate ester, 0.4 parts of polyether silicone oil and 0.5 parts of S5200 share.

[0045] Preparation method of solder resist ink: (1) preparation of epoxy acrylate resin

[0046] (a) take by weighing each component that prepares epoxy acrylate resin by formula quantity, for subsequent use;

[0047] (b) under the environment of 70°C to 80°C, add acid anhydride to the novolak epoxy resin and stir evenly;...

Embodiment 3

[0052] Epoxy acrylate resin formula (mass percentage): novolak epoxy resin 38%, acid anhydride 15%, acrylic acid 45%, catalyst 1% and polymerization inhibitor 1%.

[0053] Solder resist ink formula: 18 parts of epoxy acrylate resin, 8 parts of difunctional or trifunctional polyurethane acrylic resin, 2 parts of anthraquinone, 5 parts of 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 35 parts of talcum powder, 3 parts of silicon dioxide, 1 part of titanium green powder, 15 parts of hydroxyethyl methacrylate, 10 parts of trimethylolpropane triacrylate, 4 parts of phosphate ester, 0.2 parts of polyether silicone oil and BYK- 104S 0.35 parts.

[0054] Solder resist ink preparation method:

[0055] (1) Preparation of epoxy acrylate resin

[0056] (a) take by weighing each component that prepares epoxy acrylate resin by formula quantity, for subsequent use;

[0057] (b) under the environment of 80°C to 90°C, add acid anhydride to the novolak epoxy resin and stir evenly;

[0058...

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PUM

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Abstract

The invention discloses low-energy UV-curing solder resist ink and a preparation method thereof and belongs to the technical field of solder resist ink. The solder resist ink is mainly prepared from the following raw materials in parts by weight: 22-28 parts of epoxy acrylate resins, 5-10 parts of a photoinitiator, 32-38 parts of talcum powder, 3-4 parts of silica, 0.5-1.5 parts of titanium greenpowder, 12-18 parts of hydroxyethyl methylacrylate, 7-12 parts of trimethylolpropane triacrylate, 2-6 parts of phosphate, 0.15-0.4 part of an antifoaming agent and 0.2-0.5 part of a dispersing agent.The invention aims to provide the low-energy UV-curing solder resist ink with advantages of being scientific in formula and low in energy consumption and the preparation method thereof; and the solderresist ink is applied to circuit board production.

Description

technical field [0001] The invention relates to a solder resist ink, more specifically, to a low-energy UV photocurable solder resist ink. The present invention also relates to a method for preparing the solder resist ink. Background technique [0002] At present, solder resist inks for printed circuit boards are showing rapid growth. Traditional solder resist inks are usually composed of polymerized monomers, photoinitiators, polymerization inhibitors and other components, which can be quickly cured under the action of ultraviolet (UV) light, thereby forming a solder resist protective layer on the surface of the printed circuit board. UV curing technology is known as "5E" technology, which has the advantages of environmental protection, energy saving, short drying time, good gloss, and wide application range. [0003] LED-UV light source is a low-energy curing light source that emits single-wavelength ultraviolet light at 365nm, 375nm, 385nm, 395nm, and 405nm. Compared w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/102C09D11/03C08G59/17C08G59/16
CPCC09D11/03C09D11/101C09D11/102C08G59/1455C08G59/1466
Inventor 黄春锐彭燕娟程祥桂
Owner 丰顺县三和电子材料有限公司