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A packaging method of a QFN fingerprint identification chip

A technology of fingerprint identification and packaging method, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc. The effect of gold finger shaking amplitude

Pending Publication Date: 2018-12-18
星科金朋半导体(江阴)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, QFN products are ultra-thin and super-large-chip products, and their plastic covers are required to be thinner and thinner. The risk of breakage is extremely prone to occur during the packaging process, which reduces the product yield.

Method used

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  • A packaging method of a QFN fingerprint identification chip
  • A packaging method of a QFN fingerprint identification chip
  • A packaging method of a QFN fingerprint identification chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0094] The package structure of a kind of QFN fingerprint recognition chip of the present invention, refer to figure 2 As shown, which is a schematic cross-sectional view, the fingerprint chip package includes a lead frame 10, a chip 2 and a plastic package 3 wrapping the lead frame 10 and the chip 2, and its thickness range is below 300um. The lead frame 10 includes a chip holder 11 , ribs and golden fingers, and the chip holder 11 is arranged in the middle area of ​​the lead frame 10 . The lead frame 10 is the carrier of the chip 2, and is mainly used to connect the internal circuit of the chip 2 and the external PCB. The chip 2 is bonded and fixed on the lead frame 10, and the chip 2 is arranged in the chip holder 11 and fixedly connected with the chip holder 11. , the chip 2 is a silicon-based fingerprint chip, and in other embodiments, it can also be a chip of other materials or other functions.

[0095] The connecting rib is a frame made of metal material, including th...

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Abstract

The invention discloses a packaging method of a QFN fingerprint identification chip, belonging to the technical field of semiconductor chip packaging. The process comprises the following steps: mounting a loading film on the back of a lead frame; adhering the chip to the lead frame; curing silver paste; performing plasma cleaning; performing wire bonding; performing plastic packaging; removing theloading film; performing post curing; performing connecting rib half-cutting; performing burr polishing; removing residual glue; baking; thinning a plastic cover and pasting a reinforcing film; cutting off the connecting rib to carry out a strip test; printing a mark; removing the reinforcing film; and cutting for molding. The invention provides a packaging method capable of improving the yield of QFN fingerprint identification chip packaging.

Description

technical field [0001] The invention relates to a packaging method for a QFN fingerprint recognition chip, in particular to a packaging method for a fingerprint recognition QFN fingerprint recognition chip which becomes thinner and thinner, and belongs to the technical field of semiconductor chip packaging. Background technique [0002] Fingerprint identification technology is a systematic technical system, which involves a relatively complex industrial chain, involving fingerprint chip manufacturers, fingerprint identification module manufacturers, fingerprint identification solution providers, mobile phone terminal manufacturers, and software application vendors. From chip, package, coating, cover plate, metal ring, to the final module, all links have begun to work hard to break through the bottleneck. [0003] At present, Substrate packaging is generally used in the field of fingerprint recognition. The price of fingerprint modules keeps falling. As the price of fingerp...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/48
CPCH01L21/4821H01L21/56H01L2224/73265H01L2224/48091H01L2924/00014
Inventor 陶军峰熊伟李越付雷雷熊辉沈国强刘仁琦
Owner 星科金朋半导体(江阴)有限公司