Ribbon trimming machine for encapsulating semiconductor elements and method of use thereof

Abstract

The invention discloses a rib cutting forming machine used for packaging semiconductor elements. The rib cutting forming machine comprises a supporting table with an inner cavity. A guiding device, afeeding device and a rib cutting device are fixedly installed at the upper portion of the supporting table, and four supporting legs are symmetrically installed at the bottom of the supporting table.The guiding device comprises an n-shaped guide rail which is fixedly installed at the upper portion of the supporting table, and a guide through groove is formed in the center of the top wall of the n-shaped guide rail. The feeding device comprises a supporting block which is installed in the guide through groove in a sliding manner. The invention further provides a use method of the rib cutting forming machine used for packaging the semiconductor elements, and the use method includes four steps. By means of the rib cutting forming machine used for packaging the semiconductor elements and theuse method of the rib cutting forming machine used for packaging the semiconductor elements, running is stable, the performance is reliable, residual ribs at the outer portion of a cylindrical shell can be cut thoroughly, damage is not likely to happen, the maintenance cost is low, the service life is long, use is facilitated, the work efficiency is greatly improved, replacing and installing of acutter are facilitated, a waste material collecting function is achieved, cleaning is facilitated, and the labor intensity of workers can be relieved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor packaging, more specifically, it relates to a cutting rib forming machine used for packaging semiconductor elements and a usage method thereof. Background technique [0002] Semiconductor packaging refers to the process of processing the tested wafers according to the product model and functional requirements to obtain independent chips. The packaging process is: the wafer from the wafer front-end process is cut into small chips (Die) after the dicing process, and then the cut chip is glued to the island of the corresponding substrate (lead frame) frame Then use ultra-fine metal (gold-tin-copper-aluminum) wires or conductive resin to connect the bonding pad (Bond Pad) of the chip to the corresponding pin (Lead) of the substrate to form the required circuit; Independent chips are packaged and protected with plastic casings. After plastic packaging, a series of operations are required...

AI Technical Summary

Problems solved by technology

[0003] In the packaging process of semiconductor components, it is necessary to cut ribs to protect the shell of semiconductor components. The existing rib trimming and forming machines for packaging semiconductor components are unstable in operation and poor in performance reliability, especially for the external residues of cylindrical shells. The ribs are not completely removed, and they are easily damaged, the maintenance cost is high, the service life is short, and it is inconvenient to use. It is impossible to realize loading and unloading while cutting the ribs, which seriously affects the work efficiency. The cutter is often damaged due to violent impact. , thereby affecting the service life of the cutter, and at the same time, the cutter used in the existing cutting rib molding machine used for packaging semiconductor components is not easy to replace and install, and does not have the function of collecting waste, causing waste to be all over the floor during work , not only is not easy to clean, but also increases the labor intensity of the workers. At the same time, the cutters used in the existing rib trimming machines for packaging semiconductor components are severely worn, which seriously affects the service life of the cutters.

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