Vertical magnetization mtj device and stt-mram

A vertical magnetization and device technology, applied in semiconductor devices, electric solid state devices, magnetic field controlled resistors, etc., can solve the problem of high critical write current

Active Publication Date: 2021-04-13
CETHIK GRP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The main purpose of this application is to provide a vertical magnetization MTJ device and STT-MRAM to solve the problem of high critical writing current of the vertical magnetization MTJ device in the prior art

Method used

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  • Vertical magnetization mtj device and stt-mram
  • Vertical magnetization mtj device and stt-mram
  • Vertical magnetization mtj device and stt-mram

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] The STT-MRAM memory includes a plurality of MTJ devices, and also includes a switch circuit electrically connected to the MTJ devices, and the switch circuit includes a switch, a word line, a bit line and a source line. The specific connection relationship is the same as that in the prior art, and will not be repeated here.

[0062] The structure of the MTJ unit is as figure 2 As shown, the first electrode layer 1 is a Ta layer with a thickness of The reference layer 2 includes a plurality of structural layers, along the direction away from the first electrode layer. Wherein the reference structure layer is CoFeB, and its magnetization direction is perpendicular to the film plane (i.e. the thickness direction of each layer); the insulating barrier layer 3 is a MgO layer, and its thickness is Its forbidden band width η 1 =7.6eV; the free layer 4 is Thick CoFeB layer; enhancement layer 5 is Pd layer, its thickness is The decoupling layer 6 is a Cu layer, and it...

Embodiment 2

[0064] The difference from Example 1 is that the thickness of the reinforcement layer is The thickness of the decoupling layer is

Embodiment 3

[0066] The difference from Example 1 is that the thickness of the reinforcement layer is The thickness of the decoupling layer is

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Abstract

The present application provides a vertical magnetization MTJ device and STT-MRAM. The vertical magnetization MTJ device includes a reference layer, an insulating barrier layer, a free layer, an enhancement layer, a demagnetic coupling layer, and a pinned layer stacked in sequence, wherein the magnetization direction of the reference layer is opposite to that of the pinned layer, and the enhancement layer is used to enhance The perpendicular magnetic anisotropy of the free layer, the decoupling layer is used to isolate the free layer from the pinned layer. The critical write current is reduced, the energy consumption of the STT-MRAM chip is reduced, and the data write rate is also increased. Moreover, the fixed layer can offset the stray magnetic field that the reference layer acts on the free layer, and avoid the gap between different bits. In addition, the enhancement layer in the vertical magnetization MTJ device can enhance the magnetic anisotropy of the free layer, thereby improving the thermal stability of the free layer.

Description

technical field [0001] The present application relates to the technical field of computer storage, in particular to a vertical magnetization MTJ device and STT-MRAM. Background technique [0002] Spin Transfer Torque Magnetic Random Access Memory (STT-MRAM for short) is a new type of non-volatile memory whose core storage unit is an MTJ device. MTJ is mainly composed of reference layer, insulating barrier layer and free layer. The reference layer is also called the pinned layer, its magnetization direction remains unchanged, only the magnetization direction of the free layer is changed to make it the same direction or opposite to the reference layer. [0003] MTJ devices rely on quantum tunneling to allow electrons to pass through insulating barrier layers. The tunneling probability of polarized electrons is related to the relative magnetization directions of the reference layer and the free layer. When the magnetization direction of the free layer is the same as that of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L43/12H01L43/08H01L27/22
CPCH10B61/00H10N50/10H10N50/01G11C11/16H10N59/00
Inventor 简红蒋信
Owner CETHIK GRP
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