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A method of in-situ self-assembly toughening modified bismaleimide resin

A technology of bismaleimide and toughening modification, which is applied in the field of thermosetting resins, can solve the problems of lowering the glass transition temperature and modulus of polymers, high viscosity of modified resin systems, and poor processing technology to achieve bending Increased strength, improved tensile strength, and high universality

Active Publication Date: 2020-11-13
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Diamine chain extension and toughening can reduce the crosslinking density by increasing the molecular weight of the monomer or the distance between two functional groups, which can increase the degree of freedom of the molecular chain, improve the energy absorption capacity of the material, and improve the impact performance. However, in essence, this This modification method will reduce the glass transition temperature and modulus of the polymer, which is extremely unfavorable
In addition, thermoplastic resins generally have high modulus and high glass transition temperature, which can improve the toughness of modified bismaleimide resin while ensuring its heat resistance and rigidity, but a better toughening effect must be achieved , need to add more thermoplastic resin (15% ~ 30%), due to the high melting point and high viscosity of the thermoplastic resin itself, the viscosity of the modified resin system is extremely high, and the processability is poor

Method used

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  • A method of in-situ self-assembly toughening modified bismaleimide resin
  • A method of in-situ self-assembly toughening modified bismaleimide resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Bismaleimide is preferably N,N'-(4,4'-methylenediphenyl) bismaleimide, diallyl phenyl compound is preferably diallyl bisphenol A, reactive diluent The preferred N-phenyl maleimide of agent, the preferred n-dodecyl maleimide of active flexible chain additive;

[0017] Add 185g of diallyl bisphenol A into a three-necked flask, raise the temperature to 130°C, and add 358g of N,N'-(4,4'-methylenediphenyl)bismaleimide while stirring, Insulate and dissolve into a homogeneous phase, then add 38g of N-phenylmaleimide, and keep at 120°C for 30min to obtain bismaleimide resin I;

[0018] Add 29g of n-dodecylmaleimide into the above-mentioned bismaleimide resin I, stir and mix evenly at 90°C to obtain modified bismaleimide resin I-1.

Embodiment 2

[0020] Bismaleimide is preferably N,N'-(4,4'-methylenediphenyl) bismaleimide, diallyl phenyl compound is preferably diallyl bisphenol A, reactive diluent The preferred o-allyl phenol of the agent, the preferred n-octylmaleimide of the active flexible chain additive;

[0021] Add 136g of diallyl bisphenol A into the flask, raise the temperature to 130°C, and add 330g of N,N'-(4,4'-methylenediphenyl)bismaleimide while stirring, Heat preservation and dissolve into a homogeneous phase, then add 67g of o-allylphenol, and heat at 120°C for 30min to obtain bismaleimide resin II;

[0022] 16g of n-octylmaleimide was added to the above-mentioned bismaleimide resin II, stirred and mixed uniformly at 90°C to obtain modified bismaleimide resin II-1.

Embodiment 3

[0024] Bismaleimide is preferably N,N'-(4,4'-methylenediphenyl)bismaleimide and N,N'-m-phenylene bismaleimide, according to the mass ratio 80:20 combination, the diallyl phenyl compound is preferably diallyl bisphenol A, the reactive diluent is preferably o-allyl phenol, and the active flexible chain additive is preferably n-octylamine;

[0025] Add 215g of diallyl bisphenol A into the flask, raise the temperature to 130°C, add 64g of N,N'-m-phenylene bismaleimide bismaleimide under stirring, keep warm until it dissolves into a homogeneous phase, then add 256g N,N'-(4,4'-methylenediphenyl)bismaleimide, keep warm to dissolve into a homogeneous phase, then add 50g o-allylphenol, keep warm at 120°C for 30min, Obtain bismaleimide resin III;

[0026] Add 5.8g of n-octylamine to the above-mentioned bismaleimide resin III, stir and mix evenly at 90°C to obtain modified bismaleimide resin III-1, vacuumize to remove air bubbles, and cure as usual Process pouring and curing, you can o...

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Abstract

The invention discloses a method for in-situ self-assembly of toughened and modified bismaleimide resin and belongs to the technical field of thermosetting resin. Flexible side chains are introduced to a bismaleimide resin cross-linked network and are utilized to form the in-situ toughened and modified bismaleimide resin of a microphase separation structure through self assembly. A modified bismaleimide resin system comprises a bismaleimide component, a diallyl phenyl compound component, a reactive diluent component and an active flexible chain additive component, wherein the use amount of bismaleimide is 40%-65%, the use amount of a diallyl phenyl compound is 25%-50%, the use amount of the a reactive diluent is 5%-15%, the use amount of an active flexible chain additive is 0.5%-5%, and the total mass percentage is 100%. By adopting the method for in-situ self-assembly of toughened and modified bismaleimide resin, the mechanical property and breaking tenacity of the bismaleimide resinare improved while the heat-resistant performance, heat stability performance and process performance of the bismaleimide resin can be kept.

Description

technical field [0001] The invention designs a method for in-situ self-assembly and toughening modified bismaleimide resin, which belongs to the technical field of thermosetting resins. Background technique [0002] Bismaleimide resin is a high-performance thermosetting polymer, which has a high glass transition temperature (generally ≥ 230 ° C), good heat and humidity resistance, electrical properties and low flammability, so bismaleimide Resin has a wide range of applications, especially advanced composite material matrix resins and high temperature resistant insulating materials used in the aerospace field. [0003] The high crosslink density is the reason why the bismaleimide resin cured product has excellent high temperature performance, but it is also the reason why the cured product has low fracture toughness and high brittleness. Many other thermosetting materials (such as polyfunctional epoxy resins) also have the characteristics of high crosslink density, but bism...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F267/00C08F222/40C08F212/34
CPCC08F212/34C08F222/40C08F267/00C08F222/402
Inventor 邹齐刘燕峰肖锋顾善群李军张代军陈祥宝
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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