A kind of silver-coated plastic microspheres for solar cell conductive circuit and preparation method thereof

Abstract

A kind of silver-plated plastic microsphere that is used for the conductive circuit of solar cell, is coated with silver on the foamed microsphere surface, makes silver-plated plastic microsphere; Its preparation method comprises: (1) the preparation of silver ammonia solution B, (2) ) preparation of reducing solution A, (three) sensitization treatment of plastic microspheres, (four) putting the plastic microspheres after sensitization treatment into the silver ammonia solution B of step (1), pouring the solution into ultrasonic wave simultaneously Stir and disperse in the disperser, continuously add the reduction solution A of step (2) under the environment of ultrasonic dispersion treatment, after the reduction solution A is completely added, take out the plastic microsphere precipitate that has been plated with silver, then filter and clean; Ethanol is mixed with tallow amine as a dispersant, stirred, soaked, separated, and dried to obtain silver-plated plastic microspheres; the silver content of silver-plated plastic microspheres is actually only 30-50%, which is about 40% less than the traditional content , greatly reducing the amount of silver used, and reducing the cost by about 30-40%.

Description

Technical field[0001]The present invention relates to the preparation of the raw material of the solar electromagnetic conductive line and the preparation method thereof, specifically a silver-plated plastic microsphere for solar cell conductive line and its preparation method thereofBackground technique[0002]Conductive silver powder is generally used in the market, and the silver content is required to be more than 99.5% or more, and the wire printing is not in the functional surface of the electronic product, or the shape of the wire mesh or the adverse connection is not. The same conductive line, its purpose is to conduct electrically. There is also a silver-plated copper powder, silver-plated nickel powder, etc. to reduce the amount of silver to reduce costs, but there are various disadvantages after nickel or copper plated silver, especially in high temperature sintering, severe oxidation due to high temperatures, The conductivity performance of the last wire is then seriously ...

AI Technical Summary

Problems solved by technology

There are also silver-plated copper powder, silver-plated nickel powder, etc. to try to reduce the amount of silver to reduce costs, but both nickel and copper have various disadvantages after silver plating, especially in high-temperature sintering, copper or nickel will be oxidized severely due to high temperature. So it seriously affects the conductivity of the final wire

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