Nano core-shell structure welding paste and preparation method thereof

Abstract

The invention relates to a nano core-shell structure welding paste and a preparation method thereof. The nano welding paste comprises the following components of, in percentage by weight, 0-70 parts of copper, 0-65 parts of silver, 0-98.5 parts of tin, 8-10 parts of bisphenol A diglycidyl ether, 8-10 parts of 3,4-epoxy cyclohexyl methyl group-3,4-epoxy cyclohexane carboxylic acid, 2-8 parts of novel capric acid-epoxy propane methyl ester, 0-5000 PPM of indium, germanium, selenium, cobalt, nickel and 1-5 parts of additives. According to the nano core-shell structure welding paste, a direct-current hydrogen arc plasma evaporation method is adopted to prepare the nano-silver-copper-tin powder, then a replacement reaction method is used for preparing the nano-core-shell structured silver-coated nano-silver-copper-tin powder, finally, the formula is mixed according to the proportion, the prepared nano core-shell structure comprises a silver-copper-tin element welding paste, filling and constant-temperature preservation, the manufacturing material and the preparation cost are low, the prepared nano core-shell structure contains silver-copper-tin elements and has excellent thermal conductivity and stability, and the preparation method is easy to realize mass production processing.

Description

technical field [0001] The invention relates to a solder paste with a nano core-shell structure and a preparation method thereof. Background technique [0002] With the development of science and technology, 3C products, the power is getting bigger and bigger, the frequency is getting higher and higher, and the heat generation is getting bigger and bigger! Thermal hazards are becoming more and more serious. For example, fans have high heat dissipation efficiency, but their lifespan is generally short, and they generate certain noise. How to deal with the harm of high heat to products? Positive effect; the existing nano-solder paste is composed of resin, fillers, additives, etc., and the filler is acted by nano-silver powder, which has excellent thermal conductivity, but silver is a precious metal, and its reserves and cost limit its use as a conventional material. development; or, the cost can be well controlled by nano-copper powder as a filler, but nano-copper powder is e...

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology, 3C products, the power is getting bigger and bigger, the frequency is getting higher and higher, and the heat generation is getting bigger and bigger! Thermal hazards are becoming more and more serious. For example, fans have high heat dissipation efficiency, but their lifespan is generally short, and they generate certain noise. How to deal with the harm of high heat to products? Positive effect; the existing nano-solder paste is composed of resin, fillers, additives, etc., and the filler is acted by nano-silver powder, which has excellent thermal conductivity, but silver is a precious metal, and its reserves and cost limit its use as a conventional material. development; or, the cost can be well controlled by nano-copper powder as a filler, but nano-copper powder is easily oxidized during processing and use, and the processing and use conditions are relatively harsh

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