Preparation method of layered gradient graphite film/aluminum composite material

A technology of aluminum composite material and graphite film, which is applied in the field of preparation of layered gradient graphite film/aluminum composite material, can solve the problems of unrelieved chip thermal stress, single thermal expansion coefficient, undesignability, etc., and achieve in-plane thermal conductivity Excellent, excellent thermophysical properties, short reaction time

Active Publication Date: 2019-01-04
HARBIN INST OF TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the thermal stress of the chip cannot be relieved and the service life is reduced due to the singleness and undesignability of the thermal expansion coefficient of the metal matrix composite material as the electronic packaging substrate, and provides a layered gradient graphite film / Preparation method of aluminum composite material

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  • Preparation method of layered gradient graphite film/aluminum composite material

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specific Embodiment approach 1

[0018] Specific embodiment one: the preparation method of a kind of layered gradient graphite film / aluminum composite material of this embodiment is carried out according to the following steps:

[0019] 1. Pretreatment graphite film and aluminum foil

[0020] Remove the residual organic matter on the surface of the graphite film, and then put it in an electric blast drying oven to dry for 5 to 10 minutes. After drying, wipe off the amorphous graphite powder on the surface of the graphite film to obtain a pretreated graphite film; remove the oxidation on the surface of the aluminum foil layer, and then put it into a vacuum drying oven to dry for 30-60 minutes to obtain a pretreated aluminum foil;

[0021] 2. Preparation of preforms

[0022] The pre-treated graphite film and aluminum foil are stacked crosswise to obtain a prefabricated block, wherein the volume fraction of the graphite film in the prefabricated block is 30-80%; the above prefabricated blocks with n different g...

specific Embodiment approach 2

[0030] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the graphite film is a high crystallinity graphite film in step one, the thickness of the graphite film is 0.012~0.1mm, and the thermal conductivity is 600~1900W / (m· K). Others are the same as in the first embodiment.

specific Embodiment approach 3

[0031] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the aluminum foil in step 1 is 1050, 1060, 1070, 1100, 1145, 1200, 1235, 2A11, 2A12, 3003, 3A21, 4A13, 5A02, 5052, 5082, 5083, 8006, 8011, 8011A or 8079 aluminum foil, the thickness of the aluminum foil is 0.016 ~ 0.2mm. Others are the same as those in the first or second embodiment.

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Abstract

The invention relates to a preparation method of a layered gradient graphite film/aluminum composite material, is applicable to the field of electronic packaging substrates and aims to solve the problems that when a meta-based composite material is used as an electronic packaging substrate, the substrate thermal expansion coefficient is single and cannot be designed, chip heat stress cannot be relieved, and chip service life is shortened. The preparation method includes the steps of firstly, preprocessing a graphite film and aluminum foil; secondly, preparing a preform; thirdly using a discharge plasma sintering method to perform sintering under atmosphere protection. The method has the advantages that two or more preform blocks of different graphite volume fractions are stacked, and thenpreform preparation and sintering are performed to allow the thermal expansion coefficient of the material to change in a gradient manner in a direction vertical to the layers; the heat stress of thechip can be effectively relieved through the gradient change, and chip service life can be prolonged.

Description

technical field [0001] The invention relates to a preparation method of a layered gradient graphite film / aluminum composite material. Background technique [0002] The upgrading of semiconductor technology is changing with each passing day, and electronic equipment is increasingly developing in the direction of miniaturization, light weight, high performance, and multi-function. Due to the rapid increase in the integration of chips, the heat generated per unit area of ​​integrated circuits is getting higher and higher. In order to dissipate the heat, there is a high requirement for the thermal conductivity of packaging materials. At the same time, high heat brings new problems. Due to the thermal expansion coefficient mismatch between the chip and the substrate, the thermal stress of the chip is concentrated and the reliability of electronic components is reduced. Therefore, there is also a high requirement for the thermal expansion coefficient of the sheet material between...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02
CPCC04B37/021C04B2235/666C04B2237/52
Inventor 张强佟兴宇武高辉芶华松杨文澍姜龙涛陈国钦修子扬
Owner HARBIN INST OF TECH
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