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A technology for etch high-frequency microwave copper clad laminate

A high-frequency microwave and copper-clad laminate technology, which is applied in the manufacture of electrical components, printed circuits, and the removal of conductive materials by chemical/electrolytic methods, can solve the problem of affecting the etching effect of copper-clad laminates, increasing the cost of sewage treatment, and irregular edges of copper wires And other problems, to achieve the effect of improving etching efficiency, neat edges, convenient hot pressing and transfer printing

Inactive Publication Date: 2019-01-08
铜陵市超远科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the following problems still exist in the etching process of high-frequency microwave copper-clad laminates: 1. Due to the use of an etching solution compounded by inorganic non-metallic solutions, strong acids and strong oxidants, and inorganic salts, inorganic salts and inorganic salts remain on the surface of copper-clad laminates after cleaning. solution, which affects the subsequent process and the quality of the product, and the cost of sewage treatment in the later period also increases a lot; 2. The static low-temperature etching usually used has the problem of slow etching speed, not only the etching time is long, the etching accuracy is poor, and the section observation can also be seen The edge of the copper wire is not neat, which affects the etching effect of the copper clad laminate

Method used

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  • A technology for etch high-frequency microwave copper clad laminate

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Comparison scheme
Effect test

Embodiment 1

[0028] A high-frequency microwave etching process for copper-clad laminates, comprising the following steps:

[0029] 1) Pre-processing: According to the actual size requirements, use a cutting machine to cut the base material of the copper clad laminate, and manually polish to remove the surrounding burrs; print the printed circuit board wiring diagram on the thermal transfer paper, and transfer the thermal transfer paper to the The copper-clad board is sent to the thermal transfer machine for repeated heat pressing three times; after the copper-clad board is cooled, the thermal transfer paper is removed; among them, sandpaper with a mesh number ≥ 500 is used for manual grinding.

[0030] 2) Revision inspection: Detect the thermal transfer effect of the copper clad laminate, and observe whether there are broken wires or trachoma. If there are, use an oil-based pen to trace and repair, and if not, go directly to the next process;

[0031] 3) One-time etching: Use a needle brus...

Embodiment 2

[0035] A high-frequency microwave etching process for copper-clad laminates, comprising the following steps:

[0036] 1) Pre-processing: According to the actual size requirements, use a cutting machine to cut the base material of the copper clad laminate, and manually polish to remove the surrounding burrs; print the printed circuit board wiring diagram on the thermal transfer paper, and transfer the thermal transfer paper to the The copper-clad board is sent to the thermal transfer machine for repeated heat pressing three times; after the copper-clad board is cooled, the thermal transfer paper is removed; among them, sandpaper with a mesh number ≥ 500 is used for manual grinding.

[0037]2) Revision inspection: Detect the thermal transfer effect of the copper clad laminate, and observe whether there are broken wires or trachoma. If there are, use an oil-based pen to trace and repair, and if not, go directly to the next process;

[0038] 3) One-time etching: Use a needle brush...

Embodiment 3

[0042] A high-frequency microwave etching process for copper-clad laminates, comprising the following steps:

[0043] 1) Pre-processing: According to the actual size requirements, use a cutting machine to cut the base material of the copper clad laminate, and manually polish to remove the surrounding burrs; print the printed circuit board wiring diagram on the thermal transfer paper, and transfer the thermal transfer paper to the The copper-clad board is sent to the thermal transfer machine for repeated heat pressing three times; after the copper-clad board is cooled, the thermal transfer paper is removed; among them, sandpaper with a mesh number ≥ 500 is used for manual grinding.

[0044] 2) Revision inspection: Detect the thermal transfer effect of the copper clad laminate, and observe whether there are broken wires or trachoma. If there are, use an oil-based pen to trace and repair, and if not, go directly to the next process;

[0045] 3) One-time etching: Use a needle brus...

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Abstract

The invention discloses an etching process of a high-frequency microwave copper clad laminate, which relates to the technical field of high-frequency microwave product processing. The etching processcomprises the steps of pretreatment, plate revision detection, primary etching, secondary etching, flushing and the like, wherein, the primary etching is carried out by using a needle brush grinder topolish the copper clad laminate and spraying an etching solution on the surface of the copper clad laminate uniformly; Secondary etching is that the copper clad laminate is pasted, exposed, developed, immersed in secondary etching solution, etched in ultrasonic cleaner, the copper clad laminate is moved up and down to etch, and the printed pattern is formed by temperature-programmed method. A surface micro etch of that copper clad plate is realized by one etching, A method for etch copper clad laminate includes such steps as ultrasonic wave, temperature program and secondary etching with etching solution to obtain printed pattern, flushing and detecting without small molecule residue of inorganic salt, improving etching efficiency and etching precision, neatly observing edge of copper wire by slice, and improving etching effect of copper clad laminate.

Description

technical field [0001] The invention relates to the technical field of high-frequency microwave product processing, in particular to an etching process for high-frequency microwave copper-clad laminates. Background technique [0002] With more and more functional requirements of electronic products, and at the same time more and more emphasis on short, small, light and thin appearance, the printed circuit board industry is also constantly developing towards high-quality, dense layout, and high-frequency microwave copper-clad laminates are also following It came into being. Copper-clad laminates are often used as PCB substrates. They are plate-shaped materials that are impregnated with resin, coated with copper foil on one or both sides, and hot-pressed. [0003] The preparation process of high-frequency microwave copper-clad laminates generally includes the following processes: 1. Glue mixing: pump special resins, solvents, and fillers in a certain proportion through pipeli...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/06H05K3/067H05K2203/0285
Inventor 汪海燕程赛
Owner 铜陵市超远科技有限公司