Halogen antimony-free resin composition, as well as prepreg, laminate and printed circuit board using same

Abstract

The invention provides a halogen antimony-free resin composition, as well as prepreg, laminate and printed circuit board using the same. The halogen antimony-free resin composition is prepared from the following components in parts by weight: 25-70 parts of flame-retardant epoxy resin, 10-40 parts of non-flame-retardant epoxy resin, 20-60 parts of a compound curing agent and 0.05-1.0 part of a curing accelerant, wherein the flame-retardant epoxy resin is a composition comprising phosphorus containing epoxy resin, brominated epoxy resin and nitrogen containing epoxy resin. The compound curing agent is further compounded by combining the flame-retardant epoxy resin and non-flame-retardant epoxy resin, so that the phosphorus-bromine-nitrogen synergistic flame-retardant effect can be achieved;and excellent flame retardance is given to a CEM-1 copper cladded laminate, and the technical bottleneck that the halogen antimony synergistic flame-retardant system in a traditional halogen CEM-1 copper cladded laminate cannot be substituted is broken through. The halogen antimony-free resin composition has comprehensive performance advantages of high heat resistance, high damp-heat resistance,low water absorption rate and the like.

Description

technical field [0001] The invention belongs to the technical field of laminates, and relates to a halogenated and antimony-free resin composition, a prepreg, a laminate and a printed circuit board using the same. Background technique [0002] CEM-1 copper clad laminate is made of electronic grade glass fiber cloth and bleached wood pulp paper as reinforcing materials, respectively impregnated with resin composition for copper clad laminate to make fabric and core material, and covered with copper foil, Made by hot pressing. Flame retardancy is the primary performance that CEM-1 copper clad laminates must achieve, but CEM-1 copper clad laminates use wood pulp paper bonding sheets as the core material, and wood pulp paper itself is flammable. 1 Under the premise of other properties of copper clad laminates, especially heat resistance, toughness, moisture resistance and other properties, it is very difficult to improve the flame retardancy of CEM-1 copper clad laminates. At ...

AI Technical Summary

Problems solved by technology

The flame retardant function of this scheme is mainly achieved by adding montmorillonite, hydrotalcite, magnesium-aluminum flame retardants, organosilicon flame retardants, nitrogen-phosphorus flame retardants, and phosphate flame retardants. Nano-calcium carbonate filler, and calcium carbonate has poor acid and alkali resistance, which will affect the later processability of the board in copper clad laminates

In addition, the patent mainly involves the field of thermoplastic engineering plastic wire and cable materials, and has little relevance to the technical field of copper clad laminates (thermosetting materials)

[0005] CN106739390A discloses a preparation method of high heat-resistant CEM-1 copper-clad laminate, adopting novolac epoxy resin as heat-resistant epoxy resin, adopting silicon micropowder as heat-resistant filler, and adopting novolak resin as curing agent, the obtained Although the heat resistance of copper clad laminates has been improved, it needs to be further improved, and the performance of flame retardancy and water absorption needs to be improved.

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