Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Halogen-free and antimony-free resin composition, prepreg, laminate and printed circuit board using same

A technology of resin composition and prepreg, which is applied in the fields of laminated boards and printed circuit boards, halogen-free antimony-free resin compositions, and prepregs. The flammability needs to be improved, etc., to make up for the brittleness problem, make up for the low reactivity, and reduce the water absorption effect

Active Publication Date: 2021-03-30
SHAANXI SHENGYI TECH
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The flame retardant function of this scheme is mainly achieved by adding montmorillonite, hydrotalcite, magnesium-aluminum flame retardants, organosilicon flame retardants, nitrogen-phosphorus flame retardants, and phosphate flame retardants. Nano-calcium carbonate filler, and calcium carbonate has poor acid and alkali resistance, which will affect the later processability of the board in copper clad laminates
In addition, the patent mainly involves the field of thermoplastic engineering plastic wire and cable materials, and has little relevance to the technical field of copper clad laminates (thermosetting materials)
[0005] CN106739390A discloses a preparation method of high heat-resistant CEM-1 copper-clad laminate, adopting novolac epoxy resin as heat-resistant epoxy resin, adopting silicon micropowder as heat-resistant filler, and adopting novolak resin as curing agent, the obtained Although the heat resistance of copper clad laminates has been improved, it needs to be further improved, and the performance of flame retardancy and water absorption needs to be improved.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Halogen-free and antimony-free resin composition, prepreg, laminate and printed circuit board using same
  • Halogen-free and antimony-free resin composition, prepreg, laminate and printed circuit board using same
  • Halogen-free and antimony-free resin composition, prepreg, laminate and printed circuit board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8 and comparative example 1～14

[0068] The specific components and component contents (in parts by weight) of the resin compositions of Examples 1-8 and Comparative Examples 1-14 are shown in Table 1 and Table 2.

[0069] Concrete components and component content of the resin composition of table 1 embodiment 1~8

[0070]

[0071] Concrete components and component contents of the resin compositions of Table 2 Comparative Examples 1 to 14

[0072]

[0073]

[0074] Each component code and its corresponding component name in Table 1 and Table 2 are as follows:

[0075] A Flame-retardant epoxy resin: Among them, the weight ratio of phosphorus-containing epoxy resin, brominated epoxy resin and nitrogen-containing epoxy resin in A-1~A-3 is (1.3:1.5:1); A-7 The weight ratio in A-8 is (1.5:1.75:1.2); the weight ratio in A-8 is (1.4:1.6:1.1); the weight ratio in A-9 is (0.8:2.5:0.5);

[0076] A-1 phosphorus content is the combination of 3% DOPO base epoxy resin, bromine content is 21% BPA epoxy resin, nit...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
epoxy equivalentaaaaaaaaaa
Login to View More

Abstract

The invention provides a halogen antimony-free resin composition, as well as prepreg, laminate and printed circuit board using the same. The halogen antimony-free resin composition is prepared from the following components in parts by weight: 25-70 parts of flame-retardant epoxy resin, 10-40 parts of non-flame-retardant epoxy resin, 20-60 parts of a compound curing agent and 0.05-1.0 part of a curing accelerant, wherein the flame-retardant epoxy resin is a composition comprising phosphorus containing epoxy resin, brominated epoxy resin and nitrogen containing epoxy resin. The compound curing agent is further compounded by combining the flame-retardant epoxy resin and non-flame-retardant epoxy resin, so that the phosphorus-bromine-nitrogen synergistic flame-retardant effect can be achieved;and excellent flame retardance is given to a CEM-1 copper cladded laminate, and the technical bottleneck that the halogen antimony synergistic flame-retardant system in a traditional halogen CEM-1 copper cladded laminate cannot be substituted is broken through. The halogen antimony-free resin composition has comprehensive performance advantages of high heat resistance, high damp-heat resistance,low water absorption rate and the like.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a halogen-containing antimony-free resin composition, a prepreg using the same, a laminated board and a printed circuit board. Background technique [0002] CEM-1 copper-clad laminate is made of electronic grade glass fiber cloth and bleached wood pulp paper, which are respectively impregnated with resin composition for copper-clad laminate to make fabric and core material, and covered with copper foil. Made by hot pressing. Flame retardancy is the primary performance that CEM-1 copper-clad laminates must achieve. However, CEM-1 copper-clad laminates use wood pulp paper as the core material. The wood pulp paper itself is combustible. It is necessary to ensure that CEM- 1. Under the premise of other properties of copper clad laminates, especially heat resistance, toughness, moisture resistance and other properties, it is very difficult to improve the flame retardancy of CE...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/22
CPCC08K2003/2224C08L63/00C08L2201/02C08L2201/08C08L2205/025C08K3/22
Inventor 张龙霍国洋李莎
Owner SHAANXI SHENGYI TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com