Preparation method of epoxy resin conductive adhesive
An epoxy resin, epoxy resin curing technology, applied in the field of conductive adhesive, can solve the problems of poor dispersion, nano powder agglomeration, hindering particle-particle contact, etc., to achieve excellent electrical conductivity, large diffusivity coefficient, and diffusion boundary layer. small effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment
[0021] A preparation method of epoxy resin conductive adhesive, comprising the following steps:
[0022] (1) Send nano-graphite powder into the autoclave, feed carbon dioxide gas, adjust the pressure in the autoclave to be 60MPa, and the temperature is 120°C, so that carbon dioxide becomes a supercritical fluid;
[0023] (2) Keep the pressure and temperature constant in the autoclave, stir with a magnetic stirrer for 5 hours until the nano-graphite powder is completely dissolved in the supercritical carbon dioxide fluid, then add epoxy resin, polybutadiene epoxy resin, and Continue to stir for 15 hours under the condition of a power of 500W, keep the temperature constant and reduce the pressure to 4MPa, then ultrasonically treat for 2 hours, deflate and cool to obtain a conductive adhesive;
[0024] (3) Mix and stir the above-mentioned conductive adhesive and epoxy resin curing agent evenly, send it into a vacuum drying oven, and take it out after degassing for 40 minutes unde...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com