Preparation method of epoxy resin conductive adhesive

An epoxy resin, epoxy resin curing technology, applied in the field of conductive adhesive, can solve the problems of poor dispersion, nano powder agglomeration, hindering particle-particle contact, etc., to achieve excellent electrical conductivity, large diffusivity coefficient, and diffusion boundary layer. small effect

Inactive Publication Date: 2019-01-18
安徽科纳家居饰材有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Compared with gold surface, silver is the most suitable conductive filler because it is relatively cheap and has low resistance. However, under the conditions of high temperature and DC potential, silver will electrolytically migrate to the surface of the adhesive layer. Nickel, aluminum and copper Metals such as graphite have special oxidation problems. The oxide film formed hinders the contact between particles and particles, th

Method used

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Experimental program
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Embodiment

[0021] A preparation method of epoxy resin conductive adhesive, comprising the following steps:

[0022] (1) Send nano-graphite powder into the autoclave, feed carbon dioxide gas, adjust the pressure in the autoclave to be 60MPa, and the temperature is 120°C, so that carbon dioxide becomes a supercritical fluid;

[0023] (2) Keep the pressure and temperature constant in the autoclave, stir with a magnetic stirrer for 5 hours until the nano-graphite powder is completely dissolved in the supercritical carbon dioxide fluid, then add epoxy resin, polybutadiene epoxy resin, and Continue to stir for 15 hours under the condition of a power of 500W, keep the temperature constant and reduce the pressure to 4MPa, then ultrasonically treat for 2 hours, deflate and cool to obtain a conductive adhesive;

[0024] (3) Mix and stir the above-mentioned conductive adhesive and epoxy resin curing agent evenly, send it into a vacuum drying oven, and take it out after degassing for 40 minutes unde...

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Abstract

The invention discloses a preparation method of an epoxy resin conductive adhesive. The conductive adhesive is prepared from nanometer graphite powder, epoxy resin and polybutadiene epoxy resin by weight percentage of 70-80% to 15-20 % to 5-10%. The nano graphite powder is dissolved in a supercritical carbon dioxide fluid, the supercritical carbon dioxide fluid is low in viscosity, big in diffusivity coefficient and small in diffusion boundary layer, and the dissolved nanometer graphite powder can quickly penetrate into gaps in the epoxy resin matrix, after the graphite powder completely penetrates, carbon dioxide is recycled and reused by decompression expansion, the production efficiency is high, the time period is short, the surface treatment on the nano graphite powder is not required,the nano-graphite powder can be uniformly dispersed in the epoxy resin matrix without adding a coupling agent, it is ensured that the excellent conductivity of the nano-graphite powder is not lowered, and the conductivity of the finished conductive adhesive is further improved.

Description

technical field [0001] The invention relates to a conductive adhesive, in particular to a preparation method of an epoxy resin conductive adhesive. Background technique [0002] Conductive adhesive, referred to as conductive adhesive, is an adhesive that can effectively bond various materials and has conductive properties. Conductive adhesive can be divided into two categories: structural type and filling type according to the composition of the matrix. The structural type refers to the conductive adhesive in which the polymer material itself as the matrix of the conductive adhesive has conductivity; the filled type refers to the adhesive as the matrix, adding conductivity. The filler is a conductive adhesive that makes the glue conductive. At present, the preparation of conductive polymer materials is very complicated, and there is still a long way to go from practical application, so filled conductive adhesives are widely used in the market. [0003] The matrix of filled...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02
CPCC08K2201/011C08L2205/025C09J9/02C09J163/00C08L63/00C08K3/04Y02P20/54
Inventor 李二朋
Owner 安徽科纳家居饰材有限公司
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