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MRAM array and manufacturing method thereof

A manufacturing method and array technology, applied in the manufacture/processing of electromagnetic devices, electrical components, electrical solid devices, etc., can solve the problems of poor chip uniformity, achieve good uniformity, and shorten the removal time

Active Publication Date: 2019-01-22
CETHIK GRP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The main purpose of this application is to provide an MRAM array and its manufacturing method to solve the problem of poor chip uniformity caused by the inability to quickly remove low-K dielectric materials in the prior art

Method used

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  • MRAM array and manufacturing method thereof
  • MRAM array and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] A substrate 1 including a base and structures prepared through previous processes on the base is prepared.

[0083] On the substrate 1, a copper metal layer is deposited by a damascene process (the isolation dielectric layer 11 is arranged on the substrate, and then holes are opened in the isolation dielectric layer, and metal copper is filled in the holes), forming a plurality of connection metal layers 2, and more The surface of the connection metal layer 2 away from the substrate is on the same plane, such as Figure 10 shown.

[0084] N-BLOK is deposited on the surface of each connecting metal layer 2 away from the substrate 1 to form a barrier layer 3 . Formation of SiO by PECVD on barrier layer 3 using TEOS 2 layer, that is, the first isolation layer 41.

[0085] First through holes are opened in the barrier layer 3 and the first isolation layer 41 on each of the connecting metal layers 2 , and the first through holes correspond to the connecting metal layers 2...

Embodiment 2

[0097] The difference from Example 1 is that the thickness of the MTJ unit is the same as that of the low-K dielectric layer, both And after removing the first raised portion and the remaining polishing barrier layer, it is only necessary to use chemical mechanical polishing to remove the protective layer 7 on the plane where the first surface is located, and then deposit Ta on the first surface and the above-mentioned dielectric unit, and engrave The excess Ta is etched to form the top electrode.

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Abstract

The present application provides an MRAM array and a manufacturing method thereof. The manufacturing method comprises the following steps: step S1, arranging a pre-storage structure including an MTJ unit on the surface of the substrate, wherein the surface of the MTJ unit away from the substrate is a first surface; Step S2, setting a dielectric unit on the MTJ unit, with the dielectric unit comprising a low-K dielectric layer and a polishing barrier layer, the thickness of the low-K dielectric layer being greater than or equal to the thickness of the MTJ unit, the thickness of the polishing barrier layer being less than the thickness of the low-K dielectric layer, the low-K dielectric layer and the polishing barrier layer comprising a first protrusion portion and a second protrusion portion, respectively; 3, remoing the second protrusion portion ; Step S4, removing at least the first protrusion portion and the remaining polishing barrier layer, so that the surface of the remaining dielectric unit is a continuous plane, or the surface of the remaining low-K dielectric layer on both sides of the MTJ unit is on the same plane as the first surface. This method makes the MTJ unit have good uniformity.

Description

technical field [0001] The present application relates to the field of semiconductor technology, in particular, to an MRAM array and a manufacturing method thereof. Background technique [0002] Magnetic Random Access Memory (MRAM) is a new type of non-volatile memory. Compared with other types of memory at present, it has fast read and write speeds, can achieve unlimited erasing and writing, and is easy to integrate with current semiconductor processes. In addition, the spin transfer torque (Spin transfer torque, STT) MRAM array using spin current to achieve magnetic moment reversal can realize the miniaturization of the memory cell size. These advantages make MRAM the main development direction of new memory in the future. [0003] The main functional unit in MRAM is MTJ unit, and its structure mainly includes magnetic free layer / nonmagnetic oxide layer (MgO) / magnetic pinning layer. Driven by an external magnetic field or current, the direction of the magnetic moment of ...

Claims

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Application Information

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IPC IPC(8): H01L27/22H01L43/12
CPCH10B61/00H10N50/01
Inventor 王雷刘鲁萍
Owner CETHIK GRP
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