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Microcapsule mildew-proof additive, composite material and electric-control element housing

A technology of composite materials and microcapsules, which is applied in the field of microcapsule anti-mildew additives, composite materials and electric control component shells, can solve the problems of mechanical property degradation, easy mildew, easy aging, etc., and reduce the probability of thermal decomposition and speed, the effect of delaying the conduction velocity

Active Publication Date: 2019-01-25
BENSONG ENG PLASTICS HANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the above-mentioned environment, the plastic shell of the electronic control component is prone to mildew without adding an antifungal agent. Mildew will cause the following problems: electrical properties are changed, mycelium damages the structure and causes mechanical properties to decline, Increased water absorption, cracked plastic parts, resulting in internal exposure, making it easy to age, etc.
[0016] Trying to use all kinds of antifungal agents provided in the prior art as additives for the shell of electronic control components, there will always be problems caused by the above-mentioned specific limitations, which will lead to failure to meet the normal use specifications of electronic control components

Method used

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  • Microcapsule mildew-proof additive, composite material and electric-control element housing
  • Microcapsule mildew-proof additive, composite material and electric-control element housing
  • Microcapsule mildew-proof additive, composite material and electric-control element housing

Examples

Experimental program
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Effect test

Embodiment 10

[0062] The microcapsule antifungal agent used in Example 10 was prepared by the following process. At 25°C, 800 g of the organic antifungal agent was placed in 20 L of deionized water in a stirring state and completely dissolved; slowly added 8 g of dodecylbenzene After the sodium sulfonate is completely dissolved, the stirring is stopped to obtain a solution; the solution is spray-dried by a spray dryer to obtain the microcapsule anti-mildew additive.

Embodiment 11

[0063] The microcapsule antifungal agent used in Example 11 was prepared by the following process. At the same time, 5L of deionized water, 10g of organic antifungal agent and 0.1g of sodium dodecylbenzenesulfonate were added to the bubble liquid film reactor at the same time , to prepare a microcapsule foam, and then filter and dry to obtain the microcapsule anti-mildew additive.

[0064] 2. Preparation of composite materials

[0065] Weigh the corresponding amount of materials according to the formula ratio in the table below, mix them to obtain a mixed material, then extrude the mixed material through a twin-screw extruder, cool, granulate, and dry to obtain a composite material.

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PUM

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Abstract

The invention belongs to the technical field of high-molecular material modification, and provides a microcapsule mildew-proof additive, a composite material and an electric-control element housing. The microcapsule mildew-proof additive is prepared from the following components: a core and a coating layer, wherein the core is an organic mildew-proof agent which comprises a triazole bactericide; at least one coating layer coats outside the core; and the coating layer at the outermost layer is direct-chain alkylbenzene. The microcapsule mildew-proof additive mainly solves the three technical problems: necessary adding amount of the mildew-proof agent is too great; the mildew-proof agent has relatively poor dispersion in a plastic product; and in an injection moulding process, the mildew-proof agent is easily decomposed after being over-heated. The microcapsule mildew-proof additive has the main beneficial effects that the adding amount of the mildew-proof agent is small, the sterilizingeffect is good, sterilizing lasting time is long, and humidity of the using environment is higher.

Description

technical field [0001] The invention belongs to the technical field of polymer material modification, and relates to a microcapsule anti-mildew additive additive, a composite material and an electric control element shell. Background technique [0002] Simply looking at the plastic itself, many of them are not easy to breed bacteria and mold. The reason is that the main structure is composed of long chains of hydrocarbons. [0003] But this does not mean that regular plastic products will not be infected by bacteria and mold. [0004] The use of plastics is often accompanied by modifications. By adding various additives to make the plastic itself have some special properties, or to facilitate the processing and molding of the plastic itself. Among the above-mentioned additives, such as fatty acid plasticizer, lecithin dispersant, lubricant, antioxidant, etc., can provide nutrients for the growth of bacteria and mold, so that plastic products become high-quality culture med...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/10C08K5/3472C08K5/47C08L77/02C08L77/06C08L63/00C08K13/06C08K7/14
CPCC08K5/3472C08K5/47C08K9/10C08K2201/014C08L77/02C08L77/06C08L2203/20C08L2205/03C08L63/00C08K13/06C08K7/14
Inventor 周永松张光辉徐淑芬陈勇伟丁广军
Owner BENSONG ENG PLASTICS HANGZHOU
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