Planar array electrical capacitance tomography method and system thereof

A technology of capacitive imaging and planar array, which is applied in the direction of material capacitance, etc., can solve the problems of capacitive data influence, detection of environmental noise interference, etc., and achieve the effect of stable capacitive value data, guaranteed validity, and clear image reconstruction

Active Publication Date: 2019-01-29
YANSHAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a planar array capacitance imaging method and system, which solves the problem that the capacitance data is affected by the position of the electrode sheet and the noise interference of the detection environment

Method used

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  • Planar array electrical capacitance tomography method and system thereof
  • Planar array electrical capacitance tomography method and system thereof
  • Planar array electrical capacitance tomography method and system thereof

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Embodiment 1

[0070] This embodiment provides a planar array capacitive imaging method, which is applied to a planar array capacitive imaging device.

[0071] figure 1 It is a schematic diagram of the structure of the planar capacitive imaging device of the present invention.

[0072] see figure 1 , a planar array capacitive imaging device, the device includes: a capacitive sensor 1, a data measurement and acquisition module 2 and a computer 3.

[0073] The capacitive sensor 1 includes an electrode sheet 4 , the measured object 5 is located in the middle of the electrode sheet 4 , the electrode sheet 4 is connected to the data measurement and acquisition module 2 , and the data measurement and acquisition module 2 is connected to the computer 3 .

[0074] The capacitive sensor 1 is used to convert the distribution of the object field medium of the measured object 5 into a capacitance value.

[0075] The data measurement and collection module 2 is used to measure and collect the capacitan...

Embodiment 2

[0097] image 3 It is a structural diagram of the planar array capacitive imaging system of the present invention.

[0098] see image 3 , the planar array capacitive imaging system provided in this embodiment includes:

[0099] Capacitance value obtaining module 301, configured to obtain the capacitance value of the measured object.

[0100] The capacitance value screening module 302 is configured to classify the initial capacitance values ​​through the fuzzy C-means clustering algorithm, and retain the capacitance values ​​that meet the convergence of the fuzzy C-means clustering algorithm.

[0101]The image reconstruction module 303 is used to use the capacitance value conforming to the convergence of the fuzzy C-means clustering algorithm as the image reconstruction value, and use a non-iterative image processing algorithm or an iterative image processing algorithm for the image reconstruction value to reconstruct the defect image.

[0102] The capacitance value screeni...

Embodiment 3

[0115] This embodiment provides a planar array capacitive imaging method.

[0116] The basic principle of planar array capacitive imaging is to use the capacitive sensor array to scan the measured object in a cyclic excitation scanning mode according to the physical properties of each type of medium with a specific dielectric constant, to obtain the capacitance change between the corresponding electrode pair, and then The imaging algorithm is used to calculate the pixel matrix, and then the reconstructed image of the measured object field is obtained.

[0117] The mathematical principle of the planar array capacitive imaging system is the same as that of the traditional ECT technology. It can be analyzed from two aspects: the modeling of the forward problem and the solution of the inverse problem. The forward problem of the planar array capacitive imaging system is to use the known Medium distribution, boundary conditions, sensor structure and size to obtain the distribution o...

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Abstract

The invention discloses a planar array electrical capacitance tomography method and a system thereof, and relates to the technical field of image reconstruction. In the invention, the planar array electrical capacitance tomography system comprises a capacitance sensor, a data measurement and acquisition module and a computer. The capacitance sensor converts the distribution of the substance-fieldmedium of the object detected to a capacitance value; the data measurement and acquisition module is used for measuring and acquiring the capacitance value between any two electrode plates, and transmitting the measured capacitance data to the computer; the computer optimizes the capacitance data through fuzzy C-mean clustering algorithm, uses the optimized capacitance value as an image reconstruction value, reconstructs the defect image in combination with a non-iterative image processing algorithm or an iterative image processing algorithm, and obtains a reconstructed image. Compared to conventional imaging methods, the planar array electrical capacitance tomography method and the system thereof can solve the problem that the capacitance data is influenced by the position of the electrode plates and the noise interference of the detection environment, and obtain more stable and high-quality image of the measured field.

Description

technical field [0001] The invention relates to the technical field of image reconstruction, in particular to a method and system for plane array capacitive imaging. Background technique [0002] Advanced thermal insulation materials have the remarkable advantages of high rigidity, high strength, high temperature resistance, and light weight, and have been widely used in the design and manufacture of modern aviation vehicles. At present, adhesives are usually used to bond heat insulation materials to the substrate of aerospace vehicles, so as to slow down the damage to the aircraft caused by the large amount of heat generated by the friction between the aircraft shell and the atmosphere, and achieve the effect of heat insulation. However, various defects and damages will inevitably occur in the process of manufacturing and using heat insulation materials. In addition to the special operating environment and extremely high flight speed of the aircraft, if the bonding quality ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/24
CPCG01N27/24
Inventor 温银堂张玉燕曹鹏鹏罗小元梁波韩勇
Owner YANSHAN UNIV
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