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A substrate uniform polishing device and its working method

A technique for polishing devices and substrates, applied in grinding/polishing equipment, machine tools for surface polishing, automatic grinding control devices, etc., can solve the problems of low geometric accuracy, poor controllability and stability of substrates, etc., and achieve Good controllability and stability, improving production efficiency and avoiding the effect of measuring deformation

Active Publication Date: 2020-12-11
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems of poor controllability and stability and low geometric precision of the substrate during the polishing process, the present invention provides a substrate uniform polishing device with good controllability and stability and geometric precision of the substrate and how it works

Method used

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  • A substrate uniform polishing device and its working method
  • A substrate uniform polishing device and its working method
  • A substrate uniform polishing device and its working method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Such as Figure 1-6 As shown, a working method of a polishing device for uniform removal of substrates, based on the principle of the annular polishing disc method, the automatic counterweight unit includes a voice coil motor A7, a voice coil motor C12, a voice coil motor E17 and a voice coil motor G22, specifically including the following step:

[0052] Step 1. Adsorb the ground substrate under the base 5 by vacuum, bond the polishing pad 3 to the polishing disc 4, place the polishing module 1 on the polishing pad 3, set the polishing pre-removal thickness h, and adjust to zero At this time, the indication values ​​of micro-displacement sensor A6, micro-displacement sensor B11, micro-displacement sensor C16 and micro-displacement sensor D21, namely h P1 = h P2 = h P3 = h P4 =0.

[0053] Step 2: Start the polishing process, the fork 2 drives the polishing module 1 to rotate, the micro-displacement sensor A6, the micro-displacement sensor B11, the micro-displacement...

Embodiment 2

[0057] Such as Figure 1-4 , Shown in 7, a kind of substrate evenly removes the working method of polishing device, based on the principle of annular polishing disk method, automatic counterweight unit comprises voice coil motor A7, voice coil motor B9, voice coil motor C12, voice coil motor D14, Voice coil motor E17, voice coil motor F19, voice coil motor G22 and voice coil motor H24, specifically include the following steps:

[0058] Step 1. Adsorb the polished substrate under the base 5 by vacuum, bond the polishing pad 3 to the polishing disc 4, place the polishing module 1 on the polishing pad 3, set the polishing pre-removal thickness h, and adjust At this time, the indication values ​​of micro-displacement sensor A6, micro-displacement sensor B11, micro-displacement sensor C16 and micro-displacement sensor D21 are h P1 = h P2 = h P3 = h P4 =0.

[0059] Step 2: Start the polishing process, the fork 2 drives the polishing module 1 to rotate, the micro-displacement se...

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Abstract

The invention discloses a substrate uniform removal polishing device and a working method of the substrate uniform removal polishing device. The polishing device at least comprises a control system, adriver, a polishing module, a shifting fork, a polishing pad, a polishing disc and a connector, the polishing module comprises a base, an online detection unit and an automatic balance weight unit, the online detection unit and the automatic balance weight unit are combined to be of an integrated structure and installed on the base, the output end o the online detection unit is connected with thecontrol system, and the control system controls the automatic balance weight unit through the driver. Accurate substrate thickness online measurement and automatic balance weight adjustment are achieved, and controllability and stability in the machining process are good. By means of substrate thickness online detection, uniform polishing machining of a substrate can be completed only through one-time clamping, the results of measurement deformation or even measurement failing caused by the substrate removal measuring process are avoided, operation is easy, time and labor are saved, and substrate precision is improved.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision processing of substrates, and in particular relates to a method and device for uniformly polishing planar parts of various materials such as laser wafers, optical glass, sapphire substrates, ceramic sheets, and tungsten steel sheets. Background technique [0002] With the development of cutting-edge technologies such as nuclear energy, large-scale integrated circuits, lasers, and aerospace, the processing accuracy of various materials such as laser wafers, optical glass, sapphire substrates, ceramic sheets, and tungsten steel sheets used in these fields have been raised. higher requirement. [0003] Taking laser wafers as an example, as the working medium for making solid-state lasers, it is the basic support material for solid-state laser technology. In order to enhance the heat dissipation effect of the laser chip, reduce the thermal lens effect and birefringence effect at high power, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B29/02B24B1/00B24B49/04B24B41/06B24B51/00B24B41/00
CPCB24B1/00B24B29/02B24B41/007B24B41/06B24B49/045B24B51/00
Inventor 朱祥龙康仁科董志刚李彧高尚郭江金洙吉
Owner DALIAN UNIV OF TECH