Micro component liquid forming method conducted under composite action of multiple physical fields
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HARBIN INST OF TECH
- Publication Date
- 2019-02-19
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Abstract
Description
technical field
[0001] The invention relates to the field of micro-component liquid forming methods. Background technique
[0002] With the continuous deepening of the application of various commercial micro-products in military, civil and aerospace fields, the processing methods of micro-components are also constantly enriched. From the surface etching technology and LIGA technology initially applied to silicon-based materials, to the micro-EDM technology, ultra-precision machining technology and micro-forming technology applicable to metal materials. Moreover, as the proportion of metal materials in micro-products continues to increase, the micro-forming technology that can be used for the processing and shaping of metal micro-components has also attracted more attention. Among the above-mentioned technologies, the micro-hydroforming method, as a near-net forming technology that can efficiently and rapidly process highly complex metal micro-components, has always been the...