A kind of PCB copper surface oxidizer and preparation method thereof

Abstract

The invention discloses a PCB copper surface oxidizing agent. The PCB copper surface oxidizing agent is prepared from a component A and a component B. The mass ratio of the component A to the component B is 2:(1-2). The component A is prepared from following raw materials in percent by mass: 30%-50% of hydrogen peroxide, 1%-10% of a copper surface inhibitor, 1%-5% of a surfactant and 35%-68% of deionized water. The component B is prepared from following raw materials in percent by mass: 30%-50% of ammonium hydroxide, 9.5%-19.9% of table salt, 0.1%-0.5% of a smell covering agent and 30%-60% ofdeionized water. A copper surface circuit of a circuit board can be oxidized, a dense oxide complex layer is generated on the copper surface circuit of the circuit board, the oxide complex layer can be removed through simple acid washing, thus, the copper surface oxidizing agent is used for carrying out copper surface oxidization on the circuit board before black poration, micro-ethcing is not needed after black poration, thus, a copper substrate of the circuit board cannot be corroded, and the application range of the black poration process is greatly widened.

Description

technical field [0001] The invention belongs to the field of direct metallization of circuit boards, in particular to a PCB copper surface oxidizer and a preparation method thereof. Background technique [0002] The current circuit boards need to be black-holed, which is to use the black-hole solution to soak the black-hole solution. However, after soaking in the black-hole solution, the non-metallic holes on the circuit board that need to deposit a carbon layer are deposited with a carbon layer. A carbon layer will also be deposited on the copper surface circuit that does not need to deposit a carbon layer. If this layer of carbon layer is not removed, the subsequent electroplating copper and the copper substrate will be due to the difference in the stress of the carbon layer in the middle. Fracture, so the current process is to peel off a little copper layer on the copper surface circuit by micro-etching after depositing the carbon layer, so that the carbon loses its adhes...

AI Technical Summary

Problems solved by technology

[0002] The current circuit boards need to be black-holed, which is to use the black-hole solution to soak the black-hole solution. However, after soaking in the black-hole solution, the non-metallic holes on the circuit board that need to deposit a carbon layer are deposited with a carbon layer. A carbon layer will also be deposited on the copper surface circuit that does not need to deposit a carbon layer. If this layer of carbon layer is not removed, the subsequent electroplating copper and the copper substrate will be due to the difference in the stress of the carbon layer in the middle. Therefore, the current process is to peel off a little copper layer on the copper surface circuit by micro-etching after depositing the carbon layer, so that the carbon loses its adhesion and falls off.

But this process is only suitable for some low-layer circuit boards. When the number of circuit board layers exceeds six layers, the copper layer between the layers in the hole will have a greater risk of being over-corroded due to this micro-etching