Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Special glue for producing composite plate

A composite board and glue technology, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of endangering human health, easy to emit formaldehyde, etc., and achieve the effect of enhancing the adhesion

Inactive Publication Date: 2019-02-26
广西霖昇实业有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a special glue for the production of composite boards, which can solve the problem that the existing special glue for composite boards is easy to emit formaldehyde and endanger human health

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] The glue of this example adopts the raw material of following weight portion:

[0016] 15 parts of butyl methacrylate, 4 parts of epoxy alkyl linear polymer, 1.5 parts of chaff extract, 2.5 parts of rice bran extract, 1.5 parts of wheat bran extract, 0.6 parts of hemicellulose degrading enzyme, trihydroxy 6 parts of methyl methane, 100 parts of deionized water;

[0017] Its production method is as follows:

[0018] First put butyl methacrylate, trimethylolmethane and deionized water into the reactor to mix and dissolve, then put in the epoxy alkyl linear polymer, adjust the pH value to 6.5, and then heat to 55°C, Insulate for 15 minutes, then cool to obtain a solution; dilute the chaff extract, rice bran extract and wheat bran extract with water and stir into the above obtained solution, after stirring evenly, add hemicellulose degrading enzyme, continue stirring evenly, The glue is obtained after packaging.

Embodiment 2

[0020] The glue of this example adopts the raw material of following weight portion:

[0021] 30 parts of butyl methacrylate, 2 parts of epoxy alkyl linear polymer, 2.5 parts of chaff extract, 1.5 parts of rice bran extract, 2.5 parts of wheat bran extract, 1.5 parts of hemicellulose degrading enzyme, boric acid 3 parts of salt, 200 parts of deionized water;

[0022] Its production method is as follows:

[0023] First put butyl methacrylate, borate and deionized water into the reaction kettle to mix and dissolve, then put in the epoxy alkyl linear polymer, adjust the pH value to 6.5, then heat to 55°C and keep warm for 15 Minutes, then cooled to obtain a solution; Dilute the chaff extract, rice bran extract and wheat bran extract with water and stir into the above obtained solution, after stirring evenly, add hemicellulose degrading enzyme, continue stirring evenly, after packaging Get this glue.

[0024] The performance parameters of this urea-formaldehyde glue in this exa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a special glue for producing a composite plate, and relates to the technical field of adhesives. The adopted raw materials are 15-30 parts of butyl methacrylate, 2-4 parts of epoxy alkyl linear polymer, 1.5-2.5 parts of a chaff extract, 1.5-2.5 parts of a rice bran extract, 1.5-2.5 parts of a wheat bran extract, 0.6-1.5 parts of a hemicellulose degrading enzyme, 3-6 parts of a buffering agent, and 100-200 parts of deionized water. Compared with the prior art, the chaff extract, the rice bran extract and the wheat bran extract added as enzyme activators in the special glue provided by the invention can promote the degradation of soluble lignin in the glue, enable the glue to be subjected to a chemical reaction with lignin on the surface of a wood board, and enhance the bonding degree of the glue without pollution.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a special glue for composite plate production. Background technique [0002] Glue is a substance with good adhesive properties. Glue and bonding technology have shown incomparable vigor and vitality. Its importance is increasing day by day. The glue used is different from ordinary glue in that it has high adhesion and keeps sticky for a long time. At present, my country's glue mainly uses formaldehyde as the main raw material for production, namely urea-formaldehyde resin glue, phenolic resin glue and melamine-formaldehyde resin glue, and its output accounts for more than 90% of the adhesives used in the entire wood-based panel industry. For formaldehyde, we all know that formaldehyde is a colorless, irritating gas with a strong smell. It is a protoplasmic poison that destroys the protein of biological cells. It can combine with protein and cause damage to human skin, respirat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J11/06C09J11/08
CPCC09J4/06C09J11/06C09J11/08
Inventor 李昕霖
Owner 广西霖昇实业有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com