Ultrahigh-frequency electromagnetic wave shielding film without chemical electroplating process and conductive particles, and manufacturing method of circuit board comprising film

Abstract

The invention relates to the field of electromagnetic wave shielding films, in particular to an ultrahigh-frequency electromagnetic wave shielding film without a chemical electroplating process and conductive particles, and a manufacturing method of a circuit board comprising the film. The shielding film at least comprises an alloy shielding layer, wherein the outer surface of one side of the alloy shielding layer is coated with a pure adhesive layer; one or more of specially-processed coarsening insulation layers are arranged on the outer surface of the other side of an alloy shielding grounding layer; a carrier film layer is arranged on the outer surface of an insulating film layer; and the lower surface of a conductive adhesive layer is covered with a protection film. According to the shielding film, the pure adhesive film layer of the shielding film does not contain conductive particles, so that the cost can be lowered, and the insertion loss is reduced; and the pure adhesive filmlayer is punctured through the rough surface of the alloy shielding layer to realize grounding, so that extremely high shielding efficiency is achieved, the overall shielding effect is improved, pollution to the environment is reduced, the energy consumption is reduced, and the cost is lowered.

Description

technical field [0001] The invention relates to the technical field of electromagnetic wave shielding films, in particular to an ultra-high frequency electromagnetic wave shielding film without chemical plating process and conductive particles and a method for manufacturing a circuit board containing the film. Background technique [0002] Both flexible circuit boards and rigid-flexible circuit boards are printed circuit boards with high reliability and high flexibility made of polyimide or polyester film as the main flexible substrate. This kind of circuit board can be bent, folded, curled, and can be moved and stretched freely in three-dimensional space. The characteristics of flexible circuit boards can be used to reduce the size of electronic products, and realize the functions of light, thin, short or small products, so as to realize the integration of component devices and wire connections. Widely used in mobile phones, cameras, computers, communications or aerospace ...

AI Technical Summary

Problems solved by technology

Although this method can realize the free grounding of the shielding film and overcome the above technical difficulties, it has relatively high requirements on the size of conductive particles and high cost

Particles with special shapes and larger diameters are required to pierce the insulating covering film layer of the shielding film, and the particle size distribution of the conductive particles is required to be relatively uniform. If there are conductive particles with a particle size lower than the average particle size, there will be local failure to pierce the shielding film Insulating cover film, which in turn affects grounding

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