Nanoparticle filled barrier adhesive compositions

A nanoparticle and composition technology, which is applied in the direction of film/flaky adhesives, non-polymer adhesive additives, adhesives, etc., can solve the problem of damage to the flexibility of devices, and achieve the effect of improving barrier properties

Active Publication Date: 2019-03-01
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Glass is a commonly used encapsulation material,

Method used

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  • Nanoparticle filled barrier adhesive compositions
  • Nanoparticle filled barrier adhesive compositions
  • Nanoparticle filled barrier adhesive compositions

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0072] Example

[0073] The following examples further explain the purpose and beneficial effects of the present invention, but the specific materials, amounts and other conditions and details listed in these examples should not be construed as improper limitations on the present invention. Unless otherwise specified, all parts, percentages and ratios mentioned in the following examples are by weight. Unless otherwise specified, reagents were purchased from Sigma Aldrich Company (St. Louis, MO) in St. Louis, Missouri.

[0074] Table 1: Materials and sources .

[0075]

[0076]

[0077] Optical properties

[0078] The transmittance, clarity, and haze data were obtained using BYK Gardner Haze-Gard Plus (BYK-Gardner USA, Inc., Columbia, MD).

[0079] Moisture barrier test

[0080] By laminating the barrier component to glass deposited with elemental calcium to produce a sample, the ability of the barrier component to prevent the transportation of moisture or water vapor was tested. T...

Example Embodiment

[0089] Preparation Example 1: Polyisobutylene-based adhesive mixture

[0090] Cut large pieces of Oppanol B80 and Oppanol B50SF polyisobutylene polymer resin into approximately 1 inch (2.5 cm) cubes. These weighed resin cubes were then mixed with Escorez 5300 tackifier in toluene in a covered glass jar. The weight ratio of the binder mixture is two parts Oppanol B80, one part Oppanol B50SF and one part Escorez 5300 in sufficient toluene to provide a 25% by weight solution. The resulting formulation was mixed using a roller mixer for 2 weeks until the solution was homogeneous.

Example Embodiment

[0091] Preparation Example 2-4: Nanoparticle dispersion

[0092] The nanoparticles were calcium oxide nanopowder (CaO) and Claytone APA ("clay"), which were added to toluene in the weight ratio provided in Table 2. The nanoparticles were directly added to toluene at 5 wt% solids, and then a Sonics VibraCell VCX750 ultrasonic system (Sonics & Materials Inc., Newtown, CT) was used at 18%-20% amplitude. Disperse for 20 minutes.

[0093] Table 2: Ratio of nanoparticles in the dispersion used in this work .

[0094]

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Abstract

Provided is a barrier adhesive composition comprises polyisobutylene resin, organically modified nanoclay (e.g. montmorillonite or bentonite) and sorbent nanoparticles (e.g. CaO which acts as a desiccant and/or getter). In a preferred embodiment, the barrier adhesive composition is disposed on a gas-barrier film to form an adhesive barrier film. The adhesive barrier film can then be used for protection from oxygen and moisture in OLED displays and solid state lightings, solar cells, electrophoretic and electrochromic displays, thin film batteries, quantum dot devices, sensors (e.g. touch sensor) and other organic electronic devices. The adhesive barrier film is especially well-suited for applications that require oxygen and moisture protection as well flexibility and good optical transmittance.

Description

technical field [0001] The present invention relates to barrier adhesive compositions and adhesive barrier films. Background technique [0002] Organic electronics need to be protected from moisture and oxygen in order to provide a lifetime long enough for commercial applications. Encapsulation materials are therefore utilized to protect the device from moisture and oxygen. Glass is a commonly used encapsulation material, but glass greatly compromises the flexibility of the device. Therefore, it may be desirable to replace glass with flexible barrier films. Flexible barrier films can enable flexible devices as well as lighter, thinner, stronger rigid devices. [0003] Flexible barrier films have been commercialized for general use in organic electronics. Adhesives are typically used to laminate flexible barrier films to the device they are to protect. It is therefore important that the adhesive also has good barrier properties to minimize moisture and oxygen bond line e...

Claims

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Application Information

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IPC IPC(8): C09J123/20C09J11/04C09J7/29H01L51/52H05B33/04C09J7/30C09J7/40
CPCC09J123/20H05B33/04C08K3/346C08K9/04C08K2003/2206C09J2203/318C09J2400/10C09J2423/00C09J2467/006C09J2400/221C09J7/30C09J123/22C08K2201/005C09J2301/408Y02P70/50Y02E10/549H10K50/84H10K2102/331C08K3/22C09J11/04G06F3/041C09J2301/312H10K50/00C09J7/243C09J7/383C09J7/40C08K5/005
Inventor 雅各布·P·约翰逊亚当·J·默勒塞雷娜·L·施洛伊斯纳
Owner 3M INNOVATIVE PROPERTIES CO
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