Resistance paste for YH21CT stainless steel thick film circuit and preparation method thereof

A technology of YH21CT and resistance paste, applied to conductive materials dispersed in non-conductive inorganic materials, non-adjustable metal resistors, circuits, etc., can solve the problems of low thermal conductivity of polymer substrates, difficulty in machine assembly, and poor mechanical properties etc. to achieve excellent printing and sintering properties, excellent thixotropy, and low cost

Inactive Publication Date: 2019-03-08
浙江亮能机电科技有限公司
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polymer substrate has low thermal conductivity, high expansion coefficient, and poor stability at high temperature above 100°C
The ceramic substrate includes Al 2 o 3 And AIN, etc., its size is small, generally not more than 100mm 2 ×100mm 2 , and the mechanical properties are poor, and the assembly of the whole machine is difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A resistance paste for YH21CT stainless steel thick film circuit:

[0018] 1. Glass-ceramic formula: SiO 2 (35%), BaO (8%), Al 2 o 3 (15%), CaO (26%), ZrO 2 (6%), H 3 BO 3 (10%).

[0019] 2. Glass-ceramic smelting process: 1550°C, heat preservation for 2 to 3 hours.

[0020] 3. Particle size control of glass-ceramic powder: Use a vibrating ball mill for coarse grinding, and then use a planetary ball mill or agitator ball mill for fine grinding until the largest particle does not exceed 3 microns.

[0021] 4. Formula and mixing of tungsten-palladium composite powder: 8% tungsten powder and 92% palladium powder, the largest particle size of the powder is less than 1.5 microns. Pour it into a blender and mix evenly, and mix to obtain the required tungsten-palladium composite powder for later use.

[0022] 5. Organic binder formula and dissolution process: tributyl citrate (80%), hydrogenated castor oil (1%), nitrocellulose (2.5%), terpineol (15%), Span-85 (1%), 4....

Embodiment 2

[0029] A resistance paste for YH21CT stainless steel thick film circuit:

[0030] 1. Glass-ceramic formula: SiO 2 (33%), BaO (9%), Al 2 o 3 (16%), CaO (28%), ZrO 2 (5%), H 3 BO 3 (9%).

[0031] 2. Glass-ceramic smelting process: 1550°C, heat preservation for 2 to 3 hours.

[0032] 3. Particle size control of glass-ceramic powder: Use a vibrating ball mill for coarse grinding, and then use a planetary ball mill or agitator ball mill for fine grinding until the largest particle does not exceed 3 microns.

[0033] 4. Formula and mixing of tungsten-palladium composite powder: 25% tungsten powder and 75% palladium powder, the largest particle size of the powder is less than 1.5 microns. Pour it into a blender and mix evenly, and mix to obtain the required tungsten-palladium composite powder for later use.

[0034]5. Organic binder formula and dissolution process: tributyl citrate (76%), hydrogenated castor oil (1.5%), nitrocellulose (3.5%), terpineol (17%), Span-85 (1.5%),...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle sizeaaaaaaaaaa
Login to view more

Abstract

The invention discloses a resistance paste for an YH21CT stainless steel thick film circuit and a preparation method thereof. The resistance paste comprises 86%-90% of solid phase component and 10%-14% of organic binder by weight percentage; the solid phase component includes 70%-90% of tungsten-palladium composite powder and 10%-30% of SiO<2>-BaO-Al<2>O<3>-CaO-ZrO<2>-H<3>BO<3> series microcrystalline glass powder by weight percentage; the tungsten-palladium composite powder includes 8%-25% of tungsten powder and 75%-92% of palladium powder by weight percentage; particle sizes of the tungstenpowder and the palladium powder are smaller than 1.5 mum; the raw materials of the SiO<2>-BaO-Al<2>O<3>-CaO-ZrO<2>-H<3>BO<3> series microcrystalline glass powder include 30%-80% of SiO<2>, 2%-20% of BaO, 6%-40% of Al<2>O<3>, 20%-60% of CaO, 2%-20% of H<3>BO<3> and 2%-15% of ZrO<2> by weight percentage; the raw materials of the organic binder include 60%-82% of tributyl citrate, 0.2%-10% of hydrogenated castor oil, 1%-15% of cellulose nitrate, 3%-30% of terpilenol, 1%-18% of span-85 and 0.2%-10% of 4. gamma-butyrolactone by weight percentage; and the preparation steps include steps of preparingthe microcrystalline glass powder, the tungsten-palladium composite powder, the organic binder and the resistance paste.

Description

technical field [0001] The invention relates to a resistance paste for thick film circuits, in particular to a resistance paste for YH21CT stainless steel thick film circuits and a preparation method thereof. technical background [0002] In the field of thick film circuit technology, traditional substrates include polymer and ceramic substrates, and a series of electronic pastes that match them have already been commercialized, but both have their limitations. Polymer substrates have low thermal conductivity, high expansion coefficient, and poor stability at high temperatures greater than 100°C. The ceramic substrate includes Al 2 o 3 And AIN, etc., its size is small, generally not more than 100mm 2 ×100mm 2 , and the mechanical properties are poor, and the assembly of the whole machine is difficult. Contents of the invention [0003] The object of the present invention is to provide a resistance paste with high and adjustable square resistance, high and adjustable r...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00H01C7/00C03C10/14
Inventor 朱峙
Owner 浙江亮能机电科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap