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A low-viscosity transparent mildew-proof electronic coating adhesive and preparation method thereof

A low-viscosity, transparent technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of not being environmentally friendly, not mildew-proof, and easy to thicken, and achieve low VOCs, fast curing, and relatively good capacitive effect

Active Publication Date: 2021-05-04
CHENGDU GUIBAO SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the shortcomings of the existing organic silicon coating adhesives that are easy to thicken, not environmentally friendly, and not mildew-proof, the present invention provides a low-viscosity transparent anti-mold electronic coating adhesive and its preparation method

Method used

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  • A low-viscosity transparent mildew-proof electronic coating adhesive and preparation method thereof
  • A low-viscosity transparent mildew-proof electronic coating adhesive and preparation method thereof
  • A low-viscosity transparent mildew-proof electronic coating adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Under the protection of nitrogen, put 29.75g octadecyldimethyl tertiary ammonium, 19.87g chloropropyltrimethoxysilane, 49.62g methyltrimethoxysilane into a three-necked flask with a condenser, raise the temperature to reflux, and keep Reflux for 32 hours, stop heating, and cool to room temperature to prepare antifungal agent FMJ-1.

[0043] Add 100 parts of trimethoxysilyl ethyl-terminated polydimethylsiloxane with a viscosity of 300 mPa·s, and 10 parts of white carbon black treated with hexamethyldisilazane into the planetary agitator base, at a pressure of -0.9 After stirring for 15 minutes under MPa, stop the shoveling. Add 2 parts of 1,1,3,3-tetramethyl-1,3-bistrimethoxysilylethyldisiloxane (crosslinking agent) and 0.6 parts of FMJ-1 into the planetary machine, in- Stir at 0.9 MPa for 30 minutes. Add 0.3 parts of organotin catalyst and 1 part of γ-glycidyl etheroxytrimethoxysilane into the planetary machine, remove the vacuum and stir for 30 minutes, then discharg...

Embodiment 2

[0045] Under the protection of nitrogen, 21.34g of dodecyldimethyl tertiary ammonium, 18.27g of chloropropylmethyl dimethoxysilane, and 59.42g of methyltrimethoxysilane were dropped into a three-necked flask with a condenser, and the temperature was raised to Reflux, keep reflux for 24h, stop heating, cool to room temperature to prepare antifungal agent FMJ-2.

[0046] Add 100 parts of trimethoxysilyl ethyl-terminated polydimethylsiloxane with a viscosity of 500 mPa·s, and 8 parts of white carbon black treated with hexamethyldisilazane to the planetary agitator base, at a pressure of -0.9 After stirring for 30 minutes under MPa, stop the shoveling. Add 3 parts of 1,1,3,3-tetramethyl-1,3-bistrimethoxysilylethyl disiloxane (crosslinking agent) and 0.8 parts of FMJ-2 into the planetary machine, in- Stir at 0.9 MPa for 30 minutes. Add 0.3 parts of organotin catalyst and 1 part of γ-glycidyl etheroxytrimethoxysilane into the planetary machine, remove the vacuum and stir for 30 mi...

Embodiment 3

[0048] Under the protection of nitrogen, put 21.34g dodecyldimethyl tertiary ammonium, 19.87g chloropropyltrimethoxysilane, 41.21g methyltrimethoxysilane into a three-necked flask with a condenser, heat up to reflux, and keep Reflux for 28 hours, stop heating, cool to room temperature, and seal and store to obtain the fungicide FMJ-3.

[0049] Add 100 parts of trimethoxysilyl ethyl-terminated polydimethylsiloxane with a viscosity of 1000 mPa·s, and 5 parts of white carbon black treated with hexamethyldisilazane into the planetary stirring base, at a pressure of -0.9 After stirring for 15 minutes under MPa, stop the shoveling. Add 3 parts of bistrimethoxysilylethane (crosslinking agent) and 0.8 parts of FMJ-3 into the planetary machine, and stir for 30 minutes at -0.9MPa. Add 0.3 parts of organotin catalyst and 1 part of γ-glycidyl etheroxytrimethoxysilane into the planetary machine, remove the vacuum and stir for 30 minutes, then discharge to prepare the coating gel III.

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Abstract

The invention discloses a low-viscosity transparent mildew-proof electronic coating adhesive and a preparation method thereof. The coating adhesive is polydimethylsiloxane, hexamethyldisilazide, and White carbon black treated with alkane, cross-linking agent, anti-fungal agent, tackifier and catalyst are mixed under vacuum condition according to a certain mass ratio. The draping glue prepared by the invention solves the problems of poor mildew resistance and poor stability of common draping glues, and the preparation method is simple and feasible. The components of the drape adhesive are well matched, and have the characteristics of low viscosity, environmental protection, solvent-free, and good stability; after curing, they have good electrical insulation, mildew resistance, and transparency, and have good adhesion to PCB circuit boards. Strong, able to meet the "three defenses" requirements of PCB circuit boards.

Description

technical field [0001] The invention belongs to the technical field of coating glue for electronic circuit boards, and in particular relates to a low-viscosity transparent mold-proof electronic coating glue and a preparation method thereof. Background technique [0002] With the development of science and technology, the application of electronic products in all walks of life is becoming more and more extensive, the precision of circuit boards is getting higher and higher, and the layout is getting denser and denser. However, in the process of high integration, we will inevitably have to face the challenges of the harsh environment of electronic appliances. Circuit boards and electronic components are affected by moisture, salt spray, high temperature, etc. during use, and are prone to corrosion, Softening, deformation, mildew and other problems, resulting in equipment failure. People usually apply a layer of coating glue on the surface of circuit boards, electronic compone...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J11/04C09J11/06
CPCC09J11/04C09J11/06C09J183/04C08K13/06C08K9/06C08K3/36C08K5/544
Inventor 陈贵荣陈相全罗晓锋黄强
Owner CHENGDU GUIBAO SCI & TECH
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