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Paste-like phase-change wave-absorbing heat-conducting material and preparation method thereof

A technology of heat-conducting materials and phase-change materials, which is applied in the field of paste-like phase-change wave-absorbing heat-conducting materials and its preparation, can solve problems such as limited scope of application, inability to use components, migration and dissipation of organic silicon substances, etc., and achieve interface Good wettability and filling effect, improved longitudinal heat transfer performance, and convenient use

Inactive Publication Date: 2019-03-29
苏州铂韬新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The design structure of the solid sheet makes it impossible to use in the narrow space of components, and the scope of application is limited;
[0006] 2. The latent heat cannot be processed, which will affect the normal operation of the device;
[0007] 3. There is migration and dissipation of organic silicon substances in organic silicon paste electromagnetic wave absorbing materials

Method used

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  • Paste-like phase-change wave-absorbing heat-conducting material and preparation method thereof
  • Paste-like phase-change wave-absorbing heat-conducting material and preparation method thereof
  • Paste-like phase-change wave-absorbing heat-conducting material and preparation method thereof

Examples

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Effect test

Embodiment 1

[0042] A paste-like phase-change wave-absorbing and heat-conducting material, which includes the following components by weight: phase-change material: 10 parts of Fischer-Tropsch wax, electromagnetic wave absorbing material: 40 parts of Fe-Si alloy powder, with a median particle size of 50 μm; Base oil: 5 parts of dipentaerythritol hexaester, insulating and heat-conducting powder consisting of 2 parts of alumina and 3 parts of magnesium oxide; flame retardant: 1 part of melamine, functional additive consisting of 0.5 parts of diethylene glycol monoethyl ether, three 0.5 parts of sodium polyphosphate.

[0043] The preparation method of the above-mentioned pasty phase-change wave-absorbing heat-conducting material comprises the following steps:

[0044] Step 1: First transfer the required phase change material, base oil, and functional additives to a stainless steel barrel for heat preservation, heating and stirring at a temperature of 50°C, stirring rate: 20r / min, and stirring...

Embodiment 2

[0049] A paste-like phase-change wave-absorbing and heat-conducting material, which includes the following components by weight: phase-change material: 50 parts of EVA wax, electromagnetic wave absorbing material: 80 parts of Fe-Si-Cr alloy micropowder, with a median particle size of 100 μm , Base oil: 30 parts of dioctyl phthalate, insulating and heat-conducting powder composed of alumina and 20 parts of magnesium oxide; flame retardant: 5 parts of polyammonium polyphosphate, functional additives made of dimethylformamide 2 parts, 2 parts of sodium 2-ethoxyethanol phosphate, 1 part of sodium tripolyphosphate.

[0050] The preparation method of the above-mentioned pasty phase-change wave-absorbing heat-conducting material comprises the following steps:

[0051] Step 1: First, transfer the required phase change materials, base oil, and functional additives to a stainless steel barrel for heat preservation, heating, and stirring at a temperature of 160°C, stirring rate: 80r / min,...

Embodiment 3

[0056] A paste-like phase-change wave-absorbing and heat-conducting material, which includes the following components by weight: the phase-change material is composed of 35 parts of microcrystalline wax and 5 parts of dioctyl adipate base oil; the electromagnetic wave absorbing material: sheet 40 parts of Fe-Si-Al micropowder, with a median particle size of 70 μm, the base oil is composed of 5 parts of dioctyl adipate base oil, and 2 parts of C9 long-chain alkylbenzene base oil; the insulating and heat-conducting powder is made of alumina 5 5 parts of magnesium oxide; flame retardant: 4 parts of zinc borate, functional additive: 3 parts of sodium hexametaphosphate.

[0057] The preparation method of the above-mentioned pasty phase-change wave-absorbing heat-conducting material, such as figure 1 shown, including the following steps:

[0058] Step 1: First transfer the required phase change material, base oil, and functional additives to a stainless steel barrel for heat preser...

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Abstract

The invention discloses a paste-like phase-change wave-absorbing heat-conducting material. The paste-like phase-change wave-absorbing heat-conducting material is prepared from the following components: a phase-change material, an electromagnetic wave absorbing material, base oil, insulating heat-conducting powder, a flame retardant and functional additives. The paste-like phase-change wave-absorbing heat-conducting material is prepared from the phase-change material, the electromagnetic wave absorbing material, the base oil, the insulating heat-conducting powder, the flame retardant and otherfunctional additives and has the following advantages that 1, the paste-like composite material is convenient to use, can be directly applied and is not limited by the space structure; 2, the interface wettability and the filling effect of the material are good, the portion between an electronic component and a radiator can be directly coated or filled with the material during use, and the operation is simple; and 3, the phase-change material changes along with the temperature form and absorbs surrounding latent heat.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic wave absorption and heat-conducting materials, and relates to a paste-like phase-change wave-absorbing and heat-conducting material and a preparation method thereof. Background technique [0002] In today's society, with the rapid development of the electronics industry, the functions and performance of electronic equipment are increasing, and at the same time, they are also developing towards lightness, thinning and miniaturization, which leads to an increasing installation density of components and an increasing degree of integration. As the heat dissipation problem and the electromagnetic interference problem between components are getting higher and higher, people are paying more and more attention to it. For electronic equipment, heat dissipation and electromagnetic interference problems may occur in any part of the electronic equipment, which may affect the performance of the compone...

Claims

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Application Information

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IPC IPC(8): C09K5/06
CPCC09K5/066
Inventor 袁兴平杨爽王建斌刘慧远李建波
Owner 苏州铂韬新材料科技有限公司