Coupling packaging structure and method of single mode fiber and silicon-based photo-electronic chip end face

Abstract

The invention discloses a coupling packaging structure and method of a single mode fiber and a silicon-based photo-electronic chip end face. The structure comprises a bottom plate, a silicon-based photo-electronic chip, an optical fiber capillary, a high-numerical aperture fiber, and the single mode fiber. Two ends of the high-numerical aperture fiber are separately connected with the silicon-based photo-electronic chip and the single mode fiber. The silicon-based photo-electronic chip and the optical fiber capillary are fixed to the bottom plate. The method comprises the following steps thatwelding and optical fiber capillary arranging are conducted, step etching and chip fixing are conducted, coupling is conducted, ultraviolet adhesive filling is conducted, and solidification is conducted. Compared with the prior art, the high-numerical aperture fiber is adopted as an energy transmission medium of the single mode fiber and the silicon-based photo-electronic chip, and the existing problem of coupled mode spot mismatch between single mode fiber and the silicon-based photo-electronic chip is solved. Coupling with minimal energy loss is achieved. The coupling packaging structure andmethod have the advantages of being high is stability, high in coupling efficiency and simple in packaging, and having a wide application prospect.

Description

technical field [0001] The invention relates to the technical field of single-mode optical fiber and silicon-based optoelectronic chip packaging, more specifically, the invention relates to a coupling packaging structure and method for a single-mode optical fiber and a silicon-based optoelectronic chip end face. Background technique [0002] In recent years, silicon-based optoelectronics has been greatly developed, because the manufacturing process of silicon-based integrated optical devices is fully compatible with microelectronics technology, and the carrier light wave transmitted in silicon-based optoelectronic chips is a kind of extremely high frequency, which can provide The transmission of the signal provides electromagnetic waves of extremely high bandwidth. However, since the mode spot diameter of the optical field in the end face waveguide of the silicon-based optoelectronic chip is 3.5 μm, and the core diameter of the single-mode fiber is generally relatively large...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems that the existing coupling and packaging methods of single-mode optical fiber and silicon-based optoelectronic chip end faces have huge losses, etc., the present invention innovatively provides a coupling packaging structure and method for single-mode optical fiber and silicon-based optoelectronic chip end faces. Optical fiber with special structure and coupling package structure. The present invention can effectively match the optical fiber and the end face of the silicon-based optoelectronic chip, which not only greatly reduces the energy loss of end face coupling, but also has the advantages of high coupling efficiency and easy packaging. The field of semiconductor packaging has broad application prospects

[0006] Based on the above technical solution, the present invention innovatively uses the high numerical aperture optical fiber as the optical fiber directly coupled with the silicon-based optoelectronic chip, thereby solving the problem of excessive energy loss in the existing coupling method, and the present invention can match the optical fiber and the electronic chip through a stepped structure The height of the waveguide is provided by the fiber capillary for stress clamping in the coupling process and stress support in the packaging process. The fiber capillary is convenient to be reliably clamped by fixtures such as a six-axis adjustment frame. Stabilize the optical fiber during the alignment process, improve alignment efficiency and accuracy; and the surface area of ​​the optical fiber capillary is large, which can achieve more effective and reliable fixation with the base plate

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