Organic semiconductor device without electron transport layer and preparation method of organic semiconductor device

Abstract

The invention relates to an organic semiconductor device without an electron transport layer and a preparation method of the organic semiconductor device; a device comprises a transparent substrate, an organic material thin film, a metal Ti thin film and a metal electrode thin film from the bottom up in sequence; the preparation method comprises the following steps of firstly, preparing a layer oforganic material thin film on the surface of the transparent substrate, and then adopting a method of heat evaporation, electroplating or magnetron sputtering, preparing a metal Ti thin film on the surface of the organic material thin film, and finally, covering a layer of metal electrode material on the surface of the Ti thin film, so as to obtain the organic semiconductor device without the electron transport layer. By adopting the device without the electron transport layer structure, the thin film preparation process can be greatly simplified, and the use of part of materials is avoided,so that the process link for simplifying the preparation of the device is realized, the yield of the device is improved, and the manufacturing cost is lowered.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to an organic semiconductor device without an electron transport layer and a preparation method thereof. Background technique [0002] With the rise of new semiconductor devices such as organic photovoltaic cells, light-emitting diodes, and detectors, new organic materials and devices emerge in an endless stream, especially in organic light-emitting diodes (OLEDs), flexible wearable electronic devices, etc., which have great application prospects. Its related fields have also received extensive attention. At present, organic devices generally have a typical "sandwich structure". Taking trans-type devices as an example, they have a structure of "conductive glass / hole transport layer / organic functional layer / electron transport layer / metal electrode". In actual production, the carrier transport layer is composed of multiple layers of organic or inorganic materials. ...

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Problems solved by technology

However, these transport layers also bring a series of problems: First, the device manufacturing process is greatly complicated, and the complex device structure will reduce the yield rate; second, the transport layer materials are expensive, far exceeding the electrode and functional layer. The price of the material; again, the stability of the transport layer material itself will also adversely affect the device performance

In short, although the appearance of the transport layer has improved the performance of the device, it has also brought adverse effects on many aspects such as the device preparation process, device cost, and device stability.

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