Method for manufacturing flexible printed circuit board

Abstract

The invention discloses a method for manufacturing a flexible printed circuit board and provides a manufacturing method. The method comprises the following steps: drilling holes in a soft substrate according to pentagonal star distribution to form a plurality of via holes, exposing a pattern on an original image to a photosensitive base plate, executing development, etching the surface of a singlepanel, arranging a signal line group, respectively arranging multi-port connecting ends at two ends, bending the circuit board at a thermoplastic temperature, executing rapid cooling and shaping, andpressing a connecting surface; the space stability is very good, a three-dimensional multilayer circuit board structure can be conveniently formed, folding, rotation and shaping are directly carriedout, batch production can be achieved by using the same template for many times, the process is simplified, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a manufacturing method of a flexible printed circuit board. Background technique [0002] Flexible printed circuit boards have the characteristics of thin thickness, light weight, dense lines, bendability and flexibility, and are widely used in the field of electronic devices. Flexible printed circuit boards have been widely used to provide wiring for movable parts of electronic devices. In addition, with the reduction in size of electronic devices and the improvement in functions of electronic devices, flexible printed circuit boards by connecting several flexible printed circuit boards together have been used. Flexible printed circuit boards In some specific applications, at least two flexible printed circuit boards can even be soldered into an integrated flexible printed circuit board. [0003] Obviously, the thickness of the soldering position of the integrated flexi...

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Problems solved by technology

In this way, the solder bumps used for soldering are obviously protruded relative to the surface of the integrated flexible printed circuit board, which is easy to cause the integrated flexible printed circuit board to break at the welding position, resulting in the failure of the integrated flexible printed circuit board

[0004] Combining the above technical solutions and existing problems in reality, as well as combining the currently widely used technical solutions, the main defects are mainly reflected in the following aspects: poor thermal conductivity and heat dissipation, and difficult to control the transformation of the spatial structure and the specific size , which directly leads to its difficulty in improving its reliability; furthermore, because of the extremely poor dimensional stability and low wiring density, it is not convenient to make multilayer boards, and in the prior art, mechanical punching is used in the manufacture of multilayer flexible circuit boards. When the hole and mechanical cutting are used, it is easy to produce slag particles of various particle sizes, which will affect the performance of the circuit board

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