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Laser drilling method for IC support plate

A laser drilling and carrier technology, applied in laser welding equipment, electrical components, circuits, etc., can solve the problems of high production cost of IC carrier, easy to break the knife, slow aging of mechanical drilling, etc., to improve the drilling efficiency , The effect of high hole position accuracy

Inactive Publication Date: 2019-05-07
GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. The drill diameters used for mechanical drilling of through holes of 0.1mm, 0.15mm, and 0.2mm are 0.15mm, 0.2mm, and 0.25mm respectively. When the diameter of the drill reaches 0.2mm and below, the drilling process easy to break the knife;
[0006] 2. Due to the characteristics of IC carrier board design, there are many via holes, and each production board ranges from tens of thousands of holes to as many as hundreds of thousands of holes, and the mechanical drilling time is very slow;
[0007] 3. In view of the above problems, the production cost of IC substrate is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A method for laser drilling of an IC carrier plate is characterized in that it comprises the following specific steps:

[0031] S1. Cutting material: select double-sided copper clad laminate;

[0032] S2. Copper reduction on one side: 2pnl boards are stacked together to reduce copper through micro-etching lines. After copper reduction, the side stacked together with the same copper thickness is defined as A side, and the copper-reduced side is B side, and do Do not mark the surface and keep the placement direction of each board consistent;

[0033] S3. Browning: through the browning line, a layer of browning film is applied on the copper surface; the copper surface will not reflect light during laser drilling;

[0034] S4. Laser drilling: use a laser drilling machine, retrieve the prepared laser drilling data, drill from the B side, set the laser energy, and make the hole diameter reach 0.01mm after drilling, and drill through the medium layer, No glue residue at the ...

Embodiment 2

[0049] A method for laser drilling of an IC carrier plate is characterized in that it comprises the following specific steps:

[0050] S1. Cutting material: select double-sided copper clad laminate;

[0051] S2. Copper reduction on one side: 2pnl boards are stacked together to reduce copper through micro-etching lines. After copper reduction, the side stacked together with the same copper thickness is defined as A side, and the copper-reduced side is B side, and do Do not mark the surface and keep the placement direction of each board consistent;

[0052] S3. Browning: through the browning line, a layer of browning film is applied on the copper surface; the copper surface will not reflect light during laser drilling;

[0053] S4. Laser drilling: use a laser drilling machine, retrieve the prepared laser drilling data, drill from the B side, set the laser energy, and make the hole diameter reach 0.075mm after drilling, and drill through the medium layer, No glue residue at the...

Embodiment 3

[0068] A method for laser drilling of an IC carrier plate is characterized in that it comprises the following specific steps:

[0069] S1. Cutting material: select double-sided copper clad laminate;

[0070] S2. Copper reduction on one side: 2pnl boards are stacked together to reduce copper through micro-etching lines. After copper reduction, the side stacked together with the same copper thickness is defined as A side, and the copper-reduced side is B side, and do Do not mark the surface and keep the placement direction of each board consistent;

[0071] S3. Browning: through the browning line, a layer of browning film is applied on the copper surface; the copper surface will not reflect light during laser drilling;

[0072] S4. Laser drilling: use a laser drilling machine, retrieve the prepared laser drilling data, drill from the B side, set the laser energy, and make the hole diameter reach 0.0125mm after drilling, and drill through the medium layer, No glue residue at th...

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PUM

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Abstract

The invention provides a laser drilling method for an IC support plate. The laser drilling method comprises the following specific steps: material opening, single-sided copper reducing, browning, laser drilling, copper depositing, single-sided plating, film drying, acidic etching, AOI, masking soldering, gold depositing, forming, testing, FQC, FQA and packaging. The laser drilling method adopts alaser drilling way to replace a mechanical drilling process, is higher in hole precision, improves drilling efficiency by 60% or more, does not need a drill bit, and does not have a tool breaking rate.

Description

technical field [0001] The invention belongs to the technical field of IC carrier board processing, and in particular relates to a laser drilling method for an IC carrier board. Background technique [0002] The IC packaging substrate or IC carrier board is mainly used as an IC carrier, and provides signal interconnection between the chip and the PCB, heat dissipation channels, and chip protection. It is a key component in packaging, accounting for 35-55% of the packaging process cost. The basic materials of IC substrate technology include copper foil, resin substrate, dry film (solid photoresist), wet film (liquid photoresist), and metal materials (copper, nickel, gold salt), etc. The process is similar to PCB, but Its wiring density, line width and line spacing, interlayer alignment accuracy and material reliability are all higher than PCB. [0003] The IC carrier board is made of stacked materials of different thicknesses, including conductive materials and non-conduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382H01L21/48
Inventor 苏化友郑晓蓉
Owner GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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