An esd protection device for soi power switch

Abstract

The invention relates to the technical field of semiconductor devices, in particular to an ESD protection device for an SOI power switch, comprising: a P-type substrate; an N-type deep well on the P-type substrate; first sequentially arranged on the N-type deep well N well, first P well, first P-type intrinsic doped region, second N well, second P-type intrinsic doped region, second P well, third N well, first P-type intrinsic doped region The impurity region isolates the first P well and the second N well, and the second P-type intrinsic doping region isolates the second N well and the second P well; the first P well includes a first P+ injection region, a first N+ injection region ; The second P well includes a second N+ injection region and a second P+ injection region; there is a gate oxide layer on the second N well, the first P+ injection region and the first N+ injection region are connected to the anode, and the second N+ injection region and The second P+ injection region is connected to the cathode, which increases the maintenance voltage of the device, reduces the trigger voltage of the device, and improves the bidirectional protection performance.

Description

technical field

[0001] The invention relates to the technical field of semiconductor devices, in particular to an ESD protection device for SOI power switches. Background technique

[0002] Electrostatic discharge (ESD, Electron Static Discharge) is an instantaneous process in which a large amount of static charge is poured into the integrated circuit from the outside to the inside when the pins of an integrated circuit are floating, and the whole process takes about 1000ns. When the electrostatic discharge of the integrated circuit will generate hundreds or even thousands of volts of high voltage, the gate oxide layer of the input stage in the integrated circuit will be broken down. With the advancement of integrated circuit technology, the feature size of MOS transistors is getting smaller and smaller, and the thickness of the gate oxide layer is getting thinner. In this trend, high-performance ESD protection devices are used to discharge electrostatic charges to protect t...

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