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A kind of LED encapsulation body and its manufacturing method

A technology of LED package body and installation area, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of reduced luminous flux of LED light source, blackening of substrate reflection area, etc., achieve high transparency, reduce light loss, and avoid blackening Effect

Active Publication Date: 2020-11-27
ZHONGSHAN MULINSEN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the sulfur element enters the package, the silver on the surface of the substrate will react to form black silver sulfide, which will cause the reflective area of ​​the substrate to become black and reduce the luminous flux of the LED light source.

Method used

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  • A kind of LED encapsulation body and its manufacturing method
  • A kind of LED encapsulation body and its manufacturing method
  • A kind of LED encapsulation body and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Such as figure 1 As shown, the LED package includes a substrate 1 , an ultraviolet LED chip 2 and a light-transmitting shell 3 , and the light-transmitting shell 3 covers the ultraviolet LED chip 2 . The upper surface of the substrate 1 is provided with a PET reflective film 4 , and the ultraviolet LED chip 2 is installed and fixed on the PET reflective film 4 . The PET reflective film 4 comprises a PET base material 41 and an aluminum-plated reflective layer 42 located on the upper surface of the PET base material 41. The corrosion resistance of the aluminum-plated reflective layer 42 is higher than that of the silver-plated reflective layer, and the aluminum-plated reflective layer The anti-ultraviolet performance of the reflective layer 42 is stronger than that of the silver-plated reflective layer; the gas and water vapor permeability of the PET substrate 41 is low, and it has excellent gas barrier, water oil and odor performance, and has high transparency, which ca...

Embodiment 2

[0035] Such as figure 2 As shown, the LED package includes a substrate 1 , an ultraviolet LED chip 2 and a light-transmitting shell 3 , and the light-transmitting shell 3 covers the ultraviolet LED chip 2 . The upper surface of the substrate 1 includes an installation area and a reflective area, where the ultraviolet LED chip 2 is installed and fixed, and a first PET reflective film 5 is provided in the reflective area. The first PET reflective film 5 comprises a first PET substrate 51 and a first aluminized reflective layer 52 provided with an upper surface of the first PET substrate 51, and the corrosion resistance of the first aluminized reflective layer 52 is higher than that of the silver-plated reflective layer. The anti-corrosion performance of the first PET substrate 51 is higher, and the anti-ultraviolet performance of the first aluminum-coated reflective layer 52 is stronger than that of the silver-plated reflective layer; the gas and water vapor permeability of the...

Embodiment 3

[0040] Such as image 3 and Figure 4 As shown, the LED package includes a substrate 1 , an ultraviolet LED chip 2 and a light-transmitting shell 3 , and the light-transmitting shell 3 covers the ultraviolet LED chip 2 . The difference from Embodiment 2 is that the substrate 1 includes a transparent substrate 11 and a heat dissipation substrate 12 , the heat dissipation substrate 12 is provided with a mounting groove 121 , and the transparent substrate 11 is mounted and fixed in the mounting groove 121 . Silica gel 8 or adhesive is provided between the lower surface of the second PET reflective film 6 and the bottom of the installation groove 121 , so as to install and fix the transparent substrate 11 in the installation groove 121 . The heat generated when the ultraviolet LED chip 2 is in use is conducted to the heat dissipation substrate 12 through the transparent substrate 11, thereby effectively improving the heat dissipation performance of the LED package.

[0041]As an...

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Abstract

The present invention discloses a LED packing body and a manufacturing method thereof. The upper surface of a substrate is provided with a PET reflective film. The PET reflective film comprises a PETbase material and an aluminum-plated reflective layer arranged on the upper surface of the PET base material. A chip is arranged on the PET reflective film, the corrosion resistance of the aluminum-plated reflective layer is high than the corrosion resistance of a silver-plated reflective layer, and the anti-ultraviolet performance of the aluminum-plated reflective layer is stronger than the anti-ultraviolet performance of the silver-plated reflective layer. The PET base material has the advantages of low gas and water vapor permeability, good gas resistance, good water and oil resistance, good odor resistance, high transparency, capability of ultraviolet blocking and good brightness. Part of ultraviolet beams emitted by an ultraviolet LED chip are reflected to the aluminum-plated reflective layer of the PET reflective film via a light transmitting shell, so that the light loss is reduced, the blackening of a reflective zone of the substrate is avoided, and the LED light source luminous flux is ensured.

Description

technical field [0001] The present invention relates to the field of LED technology, more specifically, it relates to an LED packaging body and a manufacturing method thereof. Background technique [0002] In order to avoid the light emitted by the LED chip being absorbed by the metal substrate, resulting in light loss. The current practice in the industry is to plate silver on the surface of the metal substrate. Utilizing the high reflectivity of silver, the light incident on the surface of the substrate is reflected to the LED chip and the silicone layer. Due to the high moisture permeability and oxygen permeability of organic silica gel, during the use of the LED light source, the sulfur element in the air will pass through the silica gel and penetrate into the interior of the package. After the sulfur element enters the package, the silver on the surface of the substrate will react to form black silver sulfide, which will cause the reflective area of ​​the substrate to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/60
Inventor 涂梅仙李钊英卢菊香董闽芳梁俊杰张沛
Owner ZHONGSHAN MULINSEN ELECTRONICS CO LTD
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